SEMI book-to-bill improves for fourth straight month News & Analysis 2/24/2012 2 comments The three-month average book-to-bill ratio for North American semiconductor equipment manufacturers improved to 0.95 in January, the fourth consecutive month of improvement after six consecutive months of declines, according to the fab tool vendor trade group SEMI.
Micron increases stake in Inotera News & Analysis 2/24/2012 5 comments Micron Technology is increasing its stake in Inotera Memories, its Taiwanese DRAM joint venture with Nanya Technology, according to a regulatory filing made by Inotera this week.
Genusion licenses B4-Flash to Rohm, Lapis News & Analysis 2/23/2012 3 comments Genusion Ltd., a fabless Japanese memory IP company, has announced that is has licensed its B4-flash non-volatile memory technology to Rohm Group and Rohm subsidiary Lapis Semiconductor Co. Ltd.
ADI, Avago see slight uptick in business News & Analysis 2/23/2012 Post a comment The top executives at analog Analog Devices and Avago Technologies each sounded a note of cautious optimism, with both saying they see signs of improved business in the wake of the firms' most recent quarterly reports.
Memory firms detail sub-20-nm NAND chips News & Analysis 2/23/2012 3 comments Engineers from Samsung Electronics, Toshiba and SanDisk took to the podium to provide details of their respective 19-nm NAND flash chips in presentations at the International Solid-State Circuit Conference.
Mentor expands support for UVM News & Analysis 2/23/2012 Post a comment Mentor Graphics announced the expansion of support for Universal Verification Methodology, an industry standard methodology for IC design verification.
GPU shipments had another down Q4 News & Analysis 2/23/2012 2 comments Shipments of graphics chips declined 10 percent sequentially in the fourth quarter of 2011, continuing a new seasonal trend that has taken shape since the financial crisis of 2008, according to analysts at Jon Peddie Research.
Magma's Madhavan won't join Synopsys News & Analysis 2/22/2012 18 comments As most expected, Magma Design Automation Chairman and CEO Rajeev Madhavan won't join Synopsys Inc. as a result of its recently closed acquisition of Magma, Synopsys said.
Analyst: Mobile MEMS market rising to $6bn in 2016 News & Analysis 2/22/2012 1 comment The annual revenues generated by MEMS components used in mobile consumer equipment, including sensors, audio, displays and RF, will exceed $6 billion in 2016, according to analysis company Juniper Research Ltd. The equipment includes phones, computers and e-readers.
ISSCC: Voltage regulators stacked in 3-D News & Analysis 2/22/2012 8 comments The world's first integrated voltage regulators can be located on the bottom of a 3-D chip stack, according researchers at IBM and Columbia University, who recently demonstrated a silicon interposer containing the necessary magnetic inductors at the International Solid State Circuits Conference.
Dialog on a mobile roll sees strong Q1 News & Analysis 2/22/2012 2 comments Fabless chip company Dialog Semiconductor plc has reported strong financial results for fourth quarter, as expected, and has forecast a strong first quarter of 2012.
Smart roles high endurance MLC drive News & Analysis 2/22/2012 1 comment Smart Storage officially debuted as a company focused on solid-state drives for business systems, rolling out the Optimus Ultra, a high-end serial-attached SCSI drive.
EU project boosts OPV for solar power generation News & Analysis 2/22/2012 1 comment The Swiss Center for Electronics and Microtechnology has launched a four-year, 14.2 million euro ($18.8 million) project that aims to develop highly efficient, long-lasting, cheap and environmentally friendly printed organic photovoltaics.
MOST150 from MOST Cooperation hits the road News & Analysis 2/22/2012 Post a comment The theme of this year's exhibit at the fourth MOST Forum on March 20, 2012 in Stuttgart/Esslingen (Germany) is 'MOST150 Rolls Off the Line', describing the third generation of MOST Technology hitting the road in 2012.
Samsung positions its fab to take on TSMC News & Analysis 2/22/2012 6 comments Samsung touted its new 32-nm high-k metal gate process at the International Solid-State Circuits Conference, showing features it hopes might win customers over from a supply-constrained TSMC.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.