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Content tagged with Industrial Control Designline posted in February 2012
<<   <   Page 7 / 7
Microchip and Digilent unveil PIC32-based Cerebot development boards
Product News  
2/1/2012   1 comment
Users can develop a wide range of 32-bit microcontroller apps using Arduino-compatible chipKIT MPIDE, or Microchip’s MPLAB X IDE and MPLAB C Compiler
iFixit blasts Apple for tiny torx screws
News & Analysis  
2/1/2012   9 comments
During a teardown at this year’s DesignCon 2012 in Santa Clara, CEO of iFixit, Kyle Weins, blasted Apple for switching out its Phillips screws for new tamper-resistant screws.
New versions of Wi-Fi expected to boost tablets
News & Analysis  
2/1/2012   4 comments
Chip makers and consumer electronics manufacturers are working to improve the tablet user experience within the home, turning to newer versions of Wi-Fi to improve connectivity and the ability to stream content from tablets to TVs, according af Broadcom executive.
Mali graphics to lead in smart TVs, says ARM's East
News & Analysis  
2/1/2012   2 comments
Mali graphics technology from IP licensor ARM Holdings plc shipped in tens of millions of partners' chips in 2011, and will do even better in 2012, particularly in digital televisions, according to CEO Warren East.
CEA-Leti opens 3-D IC packaging service
News & Analysis  
2/1/2012   Post a comment
French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners with what it describes as a "mature" process for the production of 3-D interconnected products and projects.
Broadcom beats estimates
News & Analysis  
2/1/2012   Post a comment
Chip vendor Broadcom reported fourth quarter results and gave first quarter guidance that beat analysts' expectations.
Lines blurring between digital, analog design worlds
News & Analysis  
2/1/2012   7 comments
Lines are blurring between the once distinct areas of digital and analog design, necessitating new tools and new ways of design collaboration, according to a panel of experts at the DesignCon 2012 conference.
Wanted: 3-D IC standards within six months
News & Analysis  
2/1/2012   13 comments
Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving some of the efforts.
Digital oscilloscopes offer low price point
Product News  
2/1/2012   2 comments
Rigol Technologies, Inc. offers the DS4000 series digital oscilloscope, a general purpose test instrument for multiple applications.
Demodulation software tests next generation Wi-Fi
Product News  
2/1/2012   Post a comment
ZTEC Instruments has released ZProtocol™ WLAN, a 802.11ac demodulation software for the analysis, characterization and test of the next generation of Wi-Fi RF integrated circuits (RFIC).
Aeroflex upgrades digital radio test set
Product News  
2/1/2012   Post a comment
Aeroflex Incorporated announced that an upgrade to its 3920 Radio Test Set supports P25 Phase II TDMA test functions and adds features for the development, manufacturing, and field test of both analog and digital private mobile radios (PMRs) and base stations.
<<   <   Page 7 / 7


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