Validity of New Feature Phone Market News & Analysis 2/27/2014 23 comments What once looked like a sky-is-a-limit smartphone market is grounded. If the Mobile World Congress has given us any clue, low-cost mobile handsets are back in the spotlight.
Tronics Prototypes Piezoresistive 6DOF Sensor News & Analysis 2/26/2014 Post a comment Tronics Microsystems SA (Grenoble, France) has designed and manufactured its first batch of 6-degrees-of-freedom (6DOF) MEMS chips based on piezoresistive nanowire technology licensed from research institute CEA-Leti.
RF Micro & TriQuint to Merge in $1.6B Stock Deal News & Analysis 2/26/2014 4 comments A proposed $1.6 billion all-stock merger between TriQuint Semiconductor Inc. and RF Micro Devices Inc. is expected to create a wireless component powerhouse capable of providing all of the critical RF building blocks required to simplify handset and equipment design.
LTE Built-In GM Cars: No Smartphones Required News & Analysis 2/25/2014 24 comments Smartphones are no longer the only platform hotly pursued by cellular operators eager to boost their revenue. Now, it’s cars. GM has partnered with AT&T, and Qualcomm launched 20nm LTE-A chipset for automotive.
Spansion to Launch HyperBus I/F for Automotive News & Analysis 2/18/2014 12 comments Spansion has developed HyberBus Interface, targeting in-car systems that demand “instant-on” and “interactive graphical user interface.” The proprietary interface offers low latency, high read throughput, and low pin-count.
Sonics' New IP for Low-Power SoCs Patented News & Analysis 2/18/2014 3 comments Sonics revealed the issuance of patent 8,601,288 "Intelligent Power Controller" from the US Patent Office. The hardware-based power-management IP lets SoC designers partition power domains and turn them on and off without software intervention.
Big blues at IBM India News & Analysis 2/17/2014 37 comments Layoffs are likely to spread to all IBM units globally. 2,000 may lose job in India, 15,000 lay-offs worldwide.
IBM’s Chip Unit on Chopping Block? News & Analysis 2/7/2014 49 comments Discussions about putting IBM’s semiconductor business on the chopping block have returned with a vengeance. IBM reportedly retained Goldman Sachs to look for possible buyers.
Power Week-in-Review: 10 EV Predictions News & Analysis 2/6/2014 2 comments This week, 10 market and technology predictions for electric vehicles in 2014, an energy harvester that continuously converts low-frequency vibration to electricity, a "proton flow" battery that could offer an economical hydrogen-based alternative to lithium, and a real-time AC power monitor IC.
Government OKs Car-to-Car Talk News & Analysis 2/5/2014 23 comments In announcing vehicle-to-vehicle (V2V) communication technology Monday, the US Dept. of Transportation pledged to “begin taking steps to enable” V2V for light vehicles. But it stopped short of proposing rulemaking.
Stretchable wiring uses liquid metal News & Analysis 2/1/2014 4 comments Stretchable wiring that could be developed for use in a range of applications from headphones to phone chargers has been developed by researchers from North Carolina State University.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.