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Content tagged with Industrial Control Designline posted in March 2002
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Java variations could stall unified cell-phone platform
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3/29/2002   Post a comment
Unique implementations and extensions of Java for emerging voice and data cellular devices are threatening what many see as the best hope for unifying this nascent market.
Taiwan's government lifts ban on China fabs
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3/29/2002   Post a comment
TAIPEI, Taiwan -- After months of delay, Taiwan's government has finally lifted a ban on 200mm wafer investments in China, although with several conditions. Taiwan's government will let semiconductor companies build a total of three fabs before 2005 using current-generation production equipment, Premier Yu Shyi-kun said at a press conference late tonight. Facilities that operate with new manufacturing equipment won't be allowed for at least two years from now, he added.
MoSys applies 1T-SRAM to TSMC's 90-nm process for smallest cell yet
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3/29/2002   Post a comment
SUNNYVALE, Calif. -- MoSys Inc. today announced it has extended its collaboration with Taiwan Semiconductor Manufacturing Co. Ltd. to include the company's one-transistor SRAM cell technology in TSMC's 90-nm (0.09-micron) foundry processes.
STMicro doubles speed of EEPROM, preps chip for automotive systems
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3/28/2002   Post a comment
GENEVA--STMicroelectronics today introduced a faster version of its serial peripheral interface (SPI) 256-kilobit EEPROM to support 10-MHz clock frequencies at 5-volt operation and a range of 2-to-5-MHz at 2.5 volts.
Agilent plans major upgrade of SoC chip testers
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3/28/2002   Post a comment
SANTA CLARA, Calif. -- During a series of presentations here this week, Agilent Technologies Inc. gave a sneak preview of plans to upgrade its IC testers for cutting-edge communications semiconductors, system-on-a-chip products and other devices.
Centillium sees stronger demand for DSL chips in Japan
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3/28/2002   Post a comment
FREMONT, Calif.--Centillium Communications Inc. here said a strong pickup in demand for digital subscriber line (DSL) products in Japan has caused the company to re-evaluate its chip inventory, which had been previously written down in value because it was believed to be obsolete or excessive for market conditions.
Advanced Energy buys German supplier of power systems for fab tools
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3/28/2002   Post a comment
FORT COLLINS, Colo. -- In a move to strengthen its European presence in chip fabs and other manufacturing facilities, Advanced Energy Industries Inc. today announced it has purchased Dressler HF Technik GmbH in Stolberg, Germany, which is a privately-held supplier of radio-frequency power systems for plasma-based equipment and processes.
Solectron snares optical contract with Lucent
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3/28/2002   Post a comment
Solectron Corp. has more optical networking equipment in its future as part of a three-year outsource agreement with Lucent Technologies Inc.
Germany's X-Fab buys Zarlink's Plymouth fab
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3/28/2002   Post a comment
Deal meets company's first quarter deadline to dispose of UK site – just.
Foundry hikes capex plans by nearly $1 billion
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3/28/2002   Post a comment
TAIPEI, Taiwan -- Taiwan Semiconductor Manufacturing Co.'s chairman said that his company will sharply increase capital spending this year, called on the government to remove restrictions on investment in China, and repeated a pledge to invest $20 billion at home. TSMC, the largest pure-play foundry house worldwide, is set to boost its capex this year to $2.57 billion, 56% more than the $1.65 billion target forecast months ago, chairman Morris Chang said during a visit today to Taiwan's Premier
Zarlink to sell U.K. plant to X-Fab and receive foundry services
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3/28/2002   Post a comment
PLYMOUTH, England -- Canada's Zarlink Semiconductor Inc. today announced it has found a buyer for its wafer fab here. X-Fab Semiconductor Foundries AG of Erfurt, Germany, has agreed to buy the facility for $30 million--$12 million in cash on closing of the transaction and $18 million in secured notes payable over three years, the two companies said.
JMAR to discontinue standard chip business to focus on X-ray lithography
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3/28/2002   Post a comment
SAN DIEGO--Banking on X-ray lithography as its main ticket for the future, JMAR Technologies Inc. today announced it will discontinue its standard semiconductor products business in order to place more emphasis on next-generation exposure tools and light sources for wafer fabs.
Alpha Industries cuts forecast due to weakness in wireless systems
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3/28/2002   Post a comment
WOBURN, Mass.--Alpha Industries Inc. today lowered its forecast for revenues in the current fiscal quarter to $28 million and it predicted an adjusted net loss of $0.11-to-$0.13 per share because unexpected weakness in wireless infrastructure markets and delays in orders for radio-frequency (RF) semiconductors used in handsets.
The SPI-5 Spec: A Tutorial
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3/28/2002   Post a comment
Recently ratified, the SPI-5 specification will play an important role in the development of emerging 40-Gb optical systems. Richard Cam of PMC-Sierra takes us on a tour of this hot new spec.
Mentor says it now holds 85.6% of IKOS shares in takeover bid
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3/27/2002   Post a comment
WILSONVILLE, Ore.--Mentor Graphics Corp. here today announced it has purchased 7.8 million shares of IKOS Systems Inc. in its bid to buy the San Jose-based supplier of design verification systems.
Updated: STMicro said to be largest analog vendor
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3/27/2002   Post a comment
STMicroelectronics has been ranked as the leading analog supplier in 2001 by Databeans Inc., a two-year-old research firm based in Reno, Nev., dethroning Texas Instruments Inc.
Infineon executive urges memory makers to standardize
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3/27/2002   Post a comment
SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
Samsung creates LCD driver for up to 65,000 colors in mobile phones
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3/27/2002   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. today announced development of a new LCD driver ICs for mobile phones supporting the reproduction of up to 65,000 colors on liquid crystal displays vs. 256 colors in today's phones.
Infineon executive urges chip makers to adopt more standards
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3/27/2002   Post a comment
SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
Applied launches fast inspection tool for 100-nm, below copper processes
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3/27/2002   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. today rolled out a new high-speed wafer inspection system for 100-nm (0.10-micron) and below process technologies. The CompassPro system uses several new features, including what Applied calls All Optical Dynamic Range and Multi-Perspective Grain Suppression technologies, to quickly identify yield-impacting defects at lower cost and at higher speeds.
JEDEC takes aim at defining wireless LAN chip standards
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3/27/2002   Post a comment
SANTA CLARA, Calif. -- JEDEC today clarified its efforts in the 802.11 wireless local-area networking (WLAN) market, saying it is setting up a new committee to develop the chip-level "physical-layer interface" standards for the technology.
Taiwan's ChipMOS is latest to plan assembly/test factory in Shanghai
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3/27/2002   Post a comment
SHANGHAI -- Taiwan's ChipMOS Technologies (Bermuda) Ltd. today announced plans to build an IC test and assembly factory in the Shanghai Qingpu Industrial Zone to serve China's growing manufacturing base for integrated circuits as well as chip modules, displays, ink-jet print head modules, and other subsystems.
Signal Integrity effects haunt SoC Designs - A Designer's Perspective
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3/27/2002   Post a comment
Written by members of the VSIA Signal Integrity subcommittee, this tutorial offers an overview of the issues faced by System-on-Chip designers. It amplifies some concerns expressed by Dr. Raminderpal Singh in EE Times' March 25th Signals section.
SpeedFam-IPEC posts $10.4 million loss in quarter
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3/26/2002   Post a comment
CHANDLER, Ariz.--SpeedFam-IPEC Inc. today reported a 2.7% sequential decline in revenues to $25.1 million in its fiscal third quarter, ended March 2, compared to $25.8 million in the prior three-month period. The company's revenues were 57% lower than $58.8 million in the quarter last year.
PDF offers yield-analysis package to fabless chip houses for foundry processes
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3/26/2002   Post a comment
SAN JOSE--PDF Solutions Inc. here announced a new yield-improvement technology package for fabless semiconductor companies to help them quickly make design changes in products without impacting the supply of devices coming from silicon foundries.
Xilinx's EasyPath seeks to skirt costly redesigns
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3/26/2002   Post a comment
Answering the call for lower-cost alternatives to big FPGAs, Xilinx Inc. is offering a software-based solution, rather than re-engineering silicon.
RosettaNet compliance testing services unveiled
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3/26/2002   Post a comment
E-business standards consortium RosettaNet today announced that its RosettaNet Ready compliance testing services and badges are now available.
PDA chip content to 'inch up' in 2002, says report
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3/26/2002   Post a comment
EL SEGUNDO, Calif. -- Unit shipments of personal digital assistants (PDAs), also known handheld computers, are expected to grow from 12.1 million systems in 2001 to about 50 million units in 2006, according to a new report from iSuppli Corp.
FCRAM 101 Part 2: Applying FCRAMs to OC-192
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3/26/2002   Post a comment
As networking architectures move to higher speeds, new memory architectures are required. Part 2 of this series explores the impact of FCRAM on OC-192 designs and beyond.
China may be site of next Jedex conference
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3/26/2002   Post a comment
SANTA CLARA, Calif. -- Jedex, the conference sponsored by the JEDEC industry standards body, is in final negotiations to hold its next show in China the first of October.
Infineon and Nanya discuss possible collaboration
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3/26/2002   Post a comment
TAOYUAN, Taiwan -- Nanya Technology Corp. is in talks with Infineon Technologies AG regarding a potential collaboration, Nanya confirmed today.
TRW raises bar in laser sources to enable EUV beta tools
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3/26/2002   Post a comment
ST. CHARLES, Mo. -- Raising the bar for next-generation lithography (NGL) sources, TRW Inc.'s Cutting Edge Optronics subsidiary here today demonstrated a 1500-watt laser module for an NGL technology called extreme ultraviolet (EUV). The new laser has been integrated with a xenon jet target and is producing EUV output. Cutting Edge has demonstrated one 1500-watt module thus far, but it plans to develop and integrate three modules in a compact enclosure, which will produce a total of 4500 watts of
New breeds of multi-chip packages in the wings
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3/26/2002   Post a comment
SANTA CLARA, Calif. -- New generations of higher density, smaller stacked multichip packages (MCP) are needed to meet the exploding memory needs of servers, switches and routers, and new high speed data handheld phones and PDAs, the first Jedex conference heard Monday.
Memory chip makers demur on 400MHz DDR-I
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3/26/2002   Post a comment
Santa Clara, Calif. -- Three major DRAM makers -- Elpida Memory, Hynix Semiconductor and Infineon Technologies -- told the Jedex conference here Monday that they didn't plan to make 400-MHz speed memory in the DDR-I standard.
Fujitsu says new CMOS ASICs compete with SiGe, GaAs technologies
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3/26/2002   Post a comment
SAN JOSE -- Fujitsu Microelectronics America Inc. here launched a new 0.11-micron CMOS standard cell ASIC series, which targets advanced networking and low-power consuming wireless systems served by competing SiGe and GaAs chip technologies.
ChipPAC inks backend pact with China's Grace as assembly battle heats up
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3/26/2002   Post a comment
SHANGHAI -- U.S.-based ChipPAC Inc. today announced a non-exclusive manufacturing alliance with silicon foundry startup Grace Semiconductor Manufacturing Corp. here to provide backend chip-assembly and final testing services for wafer fab customers. The agreement follows a similar pact between Grace and Amkor Technology Inc. announced two weeks ago, and another alliance between ChipPAC and Shanghai-based Semiconductor Manufacturing International Corp. (SMIC).
"Better Design Productivity" Pervasive at Board-Design Show
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3/26/2002   Post a comment
The recent Silicon-Valley based PCB Design conference and exhibition concentrated on new tools and tool enhancements to help board engineers and designers improve existing design methodologies. TechOnLine's Jim Lipman discusses how the show's exhibitors concentrated on new tool bundles, Web-based collaborative design, and enhanced design functionality for mainstream board designers.
JEDEC describes new DDR-II specs, says first parts due out in late 2002
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3/26/2002   Post a comment
SANTA CLARA, Calif. -- During the JEDEX conference here on Monday, representatives from the DRAM and PC markets outlined some of the first public details, specifications and updates for a second-generation, double-data-rate SDRAM standard called DDR-II. The proposed DDR-II standard has been in the works for months and is supposed to replace existing DDR SDRAMs or DDR-I. The "mainstream DRAM" market is also supposed to migrate from the 200/266-MHz versions of DDR SDRAMs in the market today, to t
JMAR plans to significantly increase X-ray stepper throughput
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3/25/2002   Post a comment
SAN DIEGO--JMAR Technologies Inc. today said it was on schedule with plans to demonstrate an integrated compact X-ray source with a newly-developed X-ray stepper for gallium-arsenide (GaAs) processes using lithography feature sizes below 130 nm (0.13 micron) and 150-mm (6-inch) substrates.
ESEC replaces CEO with former Siemens Semiconductor chief
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3/25/2002   Post a comment
CHAM, Switzerland -- Chip-assembly tool supplier ESEC Group today announced its board had replaced the company's chief executive officer after a disagreement about strategies to turnaround the struggling company. ESEC named Jürgen Knorr--former head of the Siemens Semiconductor Group in the 1980s and 1990s--as its new CEO.
Xilinx looks to ease path to custom FPGAs
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3/25/2002   Post a comment
Several years after exiting the FPGA-to-ASIC conversion business, Xilinx Inc. (San Jose, Calif.) has come up with a "no-risk" alternative for customers who want a lower piece price for higher volume orders, the company said.
TI's new DSP cuts cost of multiple/accumulate function in half
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3/25/2002   Post a comment
HOUSTON -- Texas Instruments Inc. today announced it has expanded the scope of its TMS320C64x series of digital signal processors to address low-power consuming applications with a DSP chip that cuts the cost of multiply/accumulate functions in half, compared to its nearest competitors.
Microsoft expands Xbox pact with Solectron
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3/25/2002   Post a comment
Solectron Corp. has been tapped once again to provide repair and warranty services for Microsoft Corp.'s Xbox gaming device.
Samsung VP sees paradigm shift in memories due to new applications
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3/25/2002   Post a comment
SANTA CLARA, Calif. -- At the JEDEX conference today, an executive from Samsung Electronics Co. Ltd. insisted the memory market is alive and well despite the current IC downturn, saying that a new class of digital applications will "digest" and propel the need for existing and next-generation devices in the market.
JEDEC discloses DRAM roadmap, but 400-MHz DDR may not make the cut
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3/25/2002   Post a comment
SANTA CLARA, Calif. -- During the first-ever JEDEX conference today, a representative from JEDEC outlined a roadmap for the "mainstream" DRAM market, disclosing that his organization "may or may not" ratify a much-anticipated standard for 400-MHz double-data-rate (DDR) SDRAMs.
Jabil to expand presence in automotive electronics
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3/25/2002   Post a comment
Jabil Circuit Inc. will expand its European footprint and automotive expertise under a pending three-year pact with Valeo.
Toshiba claims smallest four-chip stacked flash/SRAM package
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3/25/2002   Post a comment
TOKYO -- Toshiba Corp. today said it is offering the industry's smallest multi-chip package for stacked memory in portable phones. The four-chip NOR flash/SRAM memory products measure 10-mm long and 7-mm wide, combining 8 megabits of static RAM and 32 Mbits of pseudo SRAM with two 64 Mbits of nonvolatile flash memories.
EMS providers upgrading services in Mexico
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3/25/2002   Post a comment
The need to justify Mexico's rising labor costs has EMS providers driving new-product-introduction (NPI), repair, and logistics services south of the border. The stronger peso has steered several EMS companies to upgrade supply chain services in cities such as Guadalajara and Monterrey to differentiate their Mexican operations from lower- cost Asian contractors. "The idea of Mexico being a place where only mature manufacturing is done is changing,"
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