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Content tagged with Industrial Control Designline posted in May 2002
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TEL's cleaning tool picked by Sematech for low-k process evaluations
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5/31/2002   Post a comment
AUSTIN, Tex. -- Tokyo Electron Ltd. today announced that its PR200Z polymer removal system has been chosen as the process tool of record for International Sematech's Advanced Tool Development Facility and copper-oxide frontend line.
Agere re-enters USB chip market with analog companion to digital ASICs
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5/31/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today introduced a USB 2.0 analog chip for customized digital-only ASICs serving the Universal Serial Bus 2.0 standard. The introduction is a change in course for Agere, which last year announced it was pulling out of the USB 2.0 market to focus more attention of 1394b serial links (see July 16 story).
Agilent supplies ASICs for HP's Itanium 2-based systems
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5/30/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. here today disclosed it is using 0.18-micron ASIC technology to ship a three-chip set solution to Hewlett-Packard Co. for workstations and servers based on Intel Corp.'s 64-bit Itanium 2 microprocessors.
Intel fills out development support for network processor lineup
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5/30/2002   Post a comment
SANTA CLARA, Calif.--Intel Corp. today rolled out two new hardware development platforms aimed at easing the job of designing communications systems, based on the company's IXP2800 and IXP2400 network processors. The two new platforms fill out Intel's development tools for its new network processors.
Philips design team wins EDAC award
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5/30/2002   Post a comment
Circuit inverts temperature sensor output with accuracy
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5/29/2002   Post a comment
Jerry Steele returns: A well known apps engineer cracks his knuckles on a signal conditioning circuit for Maxim.
Current Mirrors with a DCP offer precision and current gain control
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5/29/2002   Post a comment
For applications that require or desire a computer controlled variable current, the use of a digitally controlled potentiometer and a current mirror with degeneration provides a low cost solution. A Xicor apps engineer examines some circuits.
Denali's on-chip bandwidth processor core targets memory efficiency
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5/29/2002   Post a comment
PALO ALTO, Calif. -- Denali Software Inc. here said it has developed an on-die programmable memory controller core to allow system-on-a-chip designers get much higher memory efficiency in their products.
Intel predicts Itanium 2 will double performance of enterprise computing
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5/29/2002   Post a comment
MUNICH -- During a meeting with European systems developers here, Intel Corp. today predicted that its upcoming 64-bit Itanium 2 microprocessor will deliver up to 1.5-to-2 times the performance of today's enterprise computers, based on existing Itanium processors.
Networking Systems Require Tight Control/Data Plane Integration
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5/29/2002   Post a comment
Treating data plane and control plane processors as separate entities won't work in next-generation networking architectures. System architectures must optimally share resources between these two planes to hit 10-Gbps data rates and beyond.
Silicon fingerprint sensor enables low-cost security
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5/28/2002   Post a comment
Forgot your PIN? Lost your access card? Password hacked? Put these security woes to bed. Your fingerprint neatly carries all that's needed to ensure secure access for a host of applications. A capacitive-based sensing chip makes fingerprint access practical.
Intel cuts MPU prices thanks to yields from 300-mm wafers, 0.13-micron process
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5/28/2002   Post a comment
SANTA CLARA, Calif. -- Intel Corp. has cut the prices of 21 microprocessor products by a range of 9-to-53% as the company's investments in 300-mm wafer fabs and 0.13-micron processes helped to drive down production costs, according to a spokesman here today.
Agilent claims first single-chip mapper for Gigabit-over-Sonet solutions
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5/28/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. today announced the first single-chip solution for Gigabit Ethernet over Sonet and Synchronous Digital Hierarchy (SDH) networks. The Ethernet-over-Sonet (EoS) mapper chip integrates a serializer/deserializer (SerDes), clock data recovery and OC-3 to OC-48 framer functions, Agilent said
Tessera will offer Toshiba's fine-pitch BGA processes under licensing pact
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5/28/2002   Post a comment
SAN JOSE -- Tessera Technologies Inc. today announced it will act as a licensor of Toshiba Corp.'s fine-pitch ball-grid array (FBGA) semiconductor assembly processes for "face-up" chip-scale packages as part of an expanded arrangement with the Japanese IC maker.
Jazz Semi provides SiGe and RF processes to French MEMS supplier
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5/28/2002   Post a comment
NEWPORT BEACH, Calif. -- Jazz Semiconductor Inc., the foundry spin-off of Conexant Systems Inc., today announced a joint manufacturing and marketing agreement with France's MEMSCAP SA, a supplier of microelectronics mechanical systems (MEMS).
Mentor's Calibre, IMEC labs formalize R&D efforts in 193- and 157-nm lithography
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5/28/2002   Post a comment
WILSONVILLE, Ore.--Mentor Graphics Corp. here today announced its Calibre division has struck an R&D alliance with the IMEC research group in Europe to jointly pursue new resolution enhancement technology (RET) for subwavelength lithography used with 193- and 157-nm exposure tools.
Kyocera develops low-resistance alumina ceramic package for mobile ICs
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5/28/2002   Post a comment
TOKYO -- Kyocera Corp. today announced development of a low-resistance alumina-based technology from multi-layer chip packages that combines the advantages of low-temperature co-fired ceramics (LTCC) and alumina ceramics for next-generation mobile systems applications.
Tower Semi ups forecast to at least 35% sequential rise in Q2 foundry revenues
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5/28/2002   Post a comment
MIGDAL HAEMEK, Israel--Tower Semiconductor Ltd. today raised its second-quarter forecast for silicon foundry revenues to at least a 35% sequential increase from $8.4 million in the first quarter of this year. Earlier this month, the Israeli chip foundry posted $12 million loss, including expenses for a new wafer fab, on sequentially lower revenues in Q1 (see May 2 story).
Intel aims R&D center in Spain at low-power processor designs
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5/28/2002   Post a comment
MUNICH -- During the European version of the Intel Developer Forum (IDF) here today, Intel Corp. and a major university in Spain announced plans to team up and open a new R&D laboratory to develop next-generation microprocessor designs.
Nazomi sues ARM for patent infringement in Java acceleration circuits
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5/28/2002   Post a comment
SANTA CLARA, Calif.--Nazomi Communications Inc. here today announced a patent infringement lawsuit against ARM Ltd., accusing the U.K.-based processor core supplier of violating its technology for Java-software acceleration.
Samsung speeds ramp of 512-Mbit DDR-II chips after evaluations with IBM
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5/28/2002   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. today announced plans to begin volume production of 512-megabit DDR-II synchronous DRAMs in the third quarter this year after successfully completing system-level evaluation on prototype 128-Mbit DDR-II devices with IBM Corp.
Intel quits InfiniBand, but will support its deployment
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5/24/2002   Post a comment
Despite Intel's announcement yesterday that it would no longer produce InfiniBand host channel adapters (HCAs), Intel and observers were quick to say that the semiconductor giant will continue to support and play an instrumental role in InfiniBand's deployment.
DRAM prices tumble, but 3Q shortage looms
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5/24/2002   Post a comment
Weak demand sent contract prices for 128Mbit SDRAM plummeting as much as 20% in May.
Is foundry broker model the next thing in fabless business?
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5/24/2002   Post a comment
SAN JOSE -- A little-known company, called Alpha Technologies Inc., here has surfaced and announced plans to expand what could be considered an unusual business model for semiconductors: the "fabless silicon foundry" service model.
ITC to review Toshiba vs. Samsung patent case
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5/24/2002   Post a comment
The U.S. International Trade Commission voted to investigate Toshiba's patent infringement complaint against Samsung Electronics and its U.S. subsidiaries.
Asyst will spend $66 million to set up AMHS venture with Japan's Shinko
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5/24/2002   Post a comment
FREMONT, Calif.--Asyst Technologies Inc. today announced a definitive agreement in its previously announced plans to set up a joint venture for wafer fab automated material handling systems (AMHS) with Shinko Electric Co. Ltd. of Japan.
SIA applauds passage of trade bill
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5/23/2002   Post a comment
The Semiconductor Industry Association today applauded the United States Senate's passage of the Trade Promotion Authority, which will allow the Administration to negotiate to further open foreign markets to U.S. high technology exports.
Synergy Needed For 10-Gbps Backplanes
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5/23/2002   Post a comment
Designers can no longer view passive and adaptive backplane components as separate islands. To hit the 10-Gbps range, designers must develop interconnects, board traces and adaptive equalization techniques in tandem.
IBM, Sony to jointly offer chip solutions for digital TV in Europe
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5/22/2002   Post a comment
LONDON -- Sony Corp.'s Semiconductor & Devices Europe (SDE) subsidiary and IBM Corp.'s Microelectronics Division today announced plans to offer complementary and compatible products for set-top box developers in the European market.
Agilent describes IC tester upgrades, including 10-Gbit/sec. module
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5/22/2002   Post a comment
SANTA CLARA, Calif. -- Agilent Technologies Inc. here announced its anticipated upgrades for IC testers, including the world's first module capable of testing chips at speeds of 10-gigabit-per-second, according to company executives.
TI claims one of the densest SRAM blocks on processor with 0.13-micron process
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5/22/2002   Post a comment
DALLAS -- Texas Instruments Inc. today announced it is using a 0.13-micron copper CMOS process to fabricate and begin shipments of a 180-million transistor multiprocessor IC for telecom applications, providing more than 200 pulse-code modulation (PCM) channels on a chip.
STATS licenses heat-dissipation technology from Taiwan's ITRI for plastic BGA
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5/22/2002   Post a comment
SINGAPORE -- ST Assembly Test Services Ltd. (STATS) today rolled out an enhanced version of its plastic ball-grid array package with a patented heat dissipation technology that enables the PBGA to serve a broader range of high-speed IC applications in telecommunications, computers, and digital consumer products.
Chartered presses harder to narrow technology gap with foundry rivals
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5/22/2002   Post a comment
SINGAPORE -- Chartered Semiconductor Manufacturing Pte. Ltd. expects to begin receiving its first revenues for 0.13-micron processed wafers in the second half of 2002 with sales volumes becoming "noticeable" in the fourth quarter.
Cutting Power in Turbo Coding Architectures
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5/22/2002   Post a comment
Turbo coding schemes can be a power hog in 3G wireless system designs. This article lays out a decoding architecture that reduces power requirements through improvements in SNR and BER.
Cymer, LTB to develop measurement tools for DUV light sources
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5/21/2002   Post a comment
SAN DIEGO -- Cymer Inc. here and Germany's LTB Lasertechnik Berlin GmbH today announced plans to jointly develop advanced spectrometer systems for measuring the spectral performance of deep-ultraviolet (DUV) light sources.
Advantest, Synopsys team up on failure diagnostics for complex ICs
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5/21/2002   Post a comment
SANTA CLARA, Calif. -- Advantest Corp. announced it was collaborating with Synopsys Inc. to develop a fast, accurate failure diagnostics system for deep-submicron system-on-chip (SoC) designs. The failure diagnostics tools will leverage Synopsys' TetraMAX automatic test pattern generation (ATPG) technology, said Advantest.
Schlumberger creates 'NPTest' as name of test spin-off, plans IPO
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5/21/2002   Post a comment
NEW YORK--Schlumberger Ltd. today unveiled "NPTest Inc." as the name of a newly formed subsidiary for the company's core product lines in its automatic test equipment business, which is scheduled to be spun off as a separate company.
Advanced Energy plans to appeal verdict in MKS patent suit
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5/21/2002   Post a comment
FORT COLLINS, Colo. -- Advanced Energy Industries Inc. today promised to appeal a jury's verdict awarding $4.2 million in damages to MKS Instruments Inc. in a patent lawsuit against the Colorado-based company.
Malaysia's Silterra resumes foundry fab spending as 0.18-micron demand grows
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5/21/2002   Post a comment
KULIM, Malaysia -- Silicon foundry startup Silterra Malaysia Sdn. Bhd. here today announced it will spend $107 million for additional production tools as the company aims to increase its wafer fab capacity from 18,000 eight-inch wafers per month to about 22,000 by the first quarter of 2003.
Counteracting Impairments in Comm Interface Designs
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5/21/2002   Post a comment
Skew and lossy interconnects plague today's networking chip interfaces. Fortunately, automatic skew compensation, equalization, and more are here to help.
Chartered Semi ups sales growth estimate to 40% from Q1
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5/20/2002   Post a comment
MILPITAS, Calif.-- Chartered Semiconductor Manufacturing Pte. Ltd. today significantly hiked its second-quarter revenues forecast to a sequential growth of 40% compared to a previous estimate of 25% from Q1 sales of $84.4 million.
MKS says it won $4.2 million in patent suit against Advanced Energy
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5/20/2002   Post a comment
ANDOVER, Mass. -- MKS Instruments Inc. today announced it won $4.2 million in damages from a federal court jury in a patent lawsuit against Advanced Energy Industries Inc. of Fort Collins, Colo.
Storage switches need fast, programmable data path processors
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5/20/2002   Post a comment
To effectively consolidate networked attached storage (NAS), SANs and other emerging storage solutions into a single storage infrastructure, will require an intelligent storage networking switch that includes data path processing performance in the tens of Gigabits/second.
Scalable virtual ring detector aims at fault tolerant distributed computing
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5/20/2002   Post a comment
In many distributed computer systems, there are large numbers of computers or processing nodes that control various facets of the system.
Infiniband backs 'blade' servers
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5/20/2002   Post a comment
With the convergence of telecom/datacom switching centers and traditional LAN and Internet-based data centers, a distributed server architecture based on "blades" is emerging.
AMD's Austin fab ramps flash memories, plans last processor in Q3
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5/20/2002   Post a comment
AUSTIN, Tex. -- Advanced Micro Devices Inc. today said its 200-mm wafer Fab 25 here is now ramping volume production of 32- and 64-megabit flash chips using a 0.17-micron process technology after beginning a transition from microprocessor production to nonvolatile memories.
'Linda' spans telecom/Web servers
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5/20/2002   Post a comment
Many limitations of current servers and the failover techniques used to achieve the appropriate level of reliability necessitate compromises when applied to telecom services.
ISSI, Fujitsu collaborate in stacked flash/SRAM products for mobile devices
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5/20/2002   Post a comment
SANTA CLARA, Calif. --Integrated Silicon Solution Inc. (ISSI) today rolled out a new series of stacked multi-chip packages for combinations of flash memory and SRAM devices in portable systems applications, such as cellular phones, two-way pagers, and handheld PCs.
NanoVia licenses fast drilling technology to Hitachi for chip-carrier tools
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5/17/2002   Post a comment
LONDONDERRY, N.H.--NanoVia LP here announced it has licensed its hybrid optical technology for laser micro-via drilling steps used in chip-carrier packages to Hitachi Via Mechanics in Japan.
Page 1 / 3   >   >>


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