DRAM rankings: Q1 sales down on weak ASPs
News & Analysis 5/31/2011 1 comment
Global DRAM revenue fell to $8.3 billion in the first quarter, down 5.6 percent from the fourth quarter of 2010 due to weak pricing, according to a report by market research firm IHS iSuppli.
Actions Semi tips MIPS-based Honeycomb SoC
News & Analysis 5/31/2011 2 comments
Actions Semiconductor will collaborate with MIPS Technologies to offer a MIPS-based, 1.3 GHz chipset optimized for version 3.0 of Google's Android operating system, also known as Honeycomb, the companies said.
Brazilian IP startup makes PMU for Lfoundry use
Product News 5/31/2011 Post a comment
Chipus Microelectronics SA, a Brazilian startup licensor of analog and mixed-signal circuit designs, has announced the availability of a power management unit for use on LFoundry's 150-nm mixed-signal process technology.
Report: IDC cuts chip growth on poor PC sales
News & Analysis 5/31/2011 1 comment
Market research firm International Data Corp. has cut its forecast on the annual revenue growth of the semiconductor sector to between 4 and 5 percent from 6 to 8 percent, according to a Dow Jones report.
India starts hunt for fab-building chipmakers
News & Analysis 5/31/2011 12 comments
A committee recently set up by the Indian government to help drive the establishment of semiconductor manufacturing in the sub-continent, has conducted its first meeting and has started approaching chip companies to ask them to set up wafer fabs there.
Intel Ultrabooks attack tablet market
News & Analysis 5/31/2011 26 comments
Intel will push down the power and size of the notebook computer to create a so-called. Ultrabook, its answer to tablets that have so far chosen ARM over x86 processors.
European EMS firm broken in three
News & Analysis 5/30/2011 Post a comment
TES Electronics Solutions (Langon, France), an electronics design and manufacturing services company, is being broken up and sold off to three different companies by order of the Tribunal de Commerce de Rennes, according to local reports.
Singapore starts training Abu Dhabi fab workers
News & Analysis 5/30/2011 6 comments
Teaching institute Singapore Polytechnic has signed an agreement to train wafer fab workers for Abu Dhabi. Some 50 men and women from the Emirate of Abu Dhabi will form the pioneering class following an agreement signed between the Abu Dhabi owned Advanced Technology Investment Co. (ATIC); foundry Globalfoundries Inc., which is majority-owned by ATIC; and Singapore Polytechnic.
Intel embeds Mirics in PC-with-TV motherboard
Product News 5/30/2011 6 comments
Mirics Ltd., a developer of a software modem technology for digital TV reception, has said that Intel Corp. is planning to deliver global broadcast TV reception through an Intel branded PC motherboard.
OEMS speed adoption of IPv6
News & Analysis 5/30/2011 3 comments
The first of over two dozen IPv6 systems from leading OEMs that are using NetLogic Microsystem's NL11k knowledge-based processors will begin shipping in production in 3Q 2011, with the remaining customer systems expected to commence shipping over the following twelve months.
Mentor, Magma top expectations
News & Analysis 5/27/2011 1 comment
Mentor Graphics CEO Walden Rhines said Mentor's board has met once by phone since three members nominated by billionaire financier Carl Icahn were elected to join it.
Tessera sues Sony again
News & Analysis 5/27/2011 2 comments
Tessera Technologies filed a complaint through one of its subsidiaries against Sony in California state court.
Zarlink tips 5% job cuts on 'strong' results
News & Analysis 5/27/2011 13 comments
Canadian mixed-signal chip company Zarlink Semiconductor Inc. has said it plans to reduce its global workforce by approximately 5 percent by the end of fiscal Q2 2012, which ends in September 2011. Zarlink (Ottawa, Ontario) made the announcement within its statement of its fourth fiscal quarter and 2011 fiscal year results.
Image gallery: Xperia Play handset teardown
News & Analysis 5/26/2011 5 comments
The first "PlayStation certified" smartphone features Qualcomm's Snapdragon, Broadcom's BlueTooth/WiFi/FM combo chip and memory ICs from Micron and Elpida, among others, according to a teardown analysis.
High-temp MEMS goes seismic
News & Analysis 5/26/2011 4 comments
Analog Devices claims to have designed the world's first MEMS chip that can tolerate temperatures as high as 342 degrees Fahrenheit.
Smart meters wait on home net spec
News & Analysis 5/26/2011 17 comments
Some smart meter projects are on hold while engineers re-work a road map for Smart Energy Profile 2.0, a key standard for tomorrow's home energy networks.
Freescale CEO bullish on IPO
News & Analysis 5/26/2011 6 comments
Rich Beyer, Freescale Semiconductor's chairman and CEO, said he was happy with the opening of the company's IPO despite the fact that the opening price was lowered. Shares climbed up more than 5 percent by mid-day trading.