DRAM rankings: Q1 sales down on weak ASPs News & Analysis 5/31/2011 1 comment Global DRAM revenue fell to $8.3 billion in the first quarter, down 5.6 percent from the fourth quarter of 2010 due to weak pricing, according to a report by market research firm IHS iSuppli.
Actions Semi tips MIPS-based Honeycomb SoC News & Analysis 5/31/2011 2 comments Actions Semiconductor will collaborate with MIPS Technologies to offer a MIPS-based, 1.3 GHz chipset optimized for version 3.0 of Google's Android operating system, also known as Honeycomb, the companies said.
Brazilian IP startup makes PMU for Lfoundry use Product News 5/31/2011 Post a comment Chipus Microelectronics SA, a Brazilian startup licensor of analog and mixed-signal circuit designs, has announced the availability of a power management unit for use on LFoundry's 150-nm mixed-signal process technology.
Report: IDC cuts chip growth on poor PC sales News & Analysis 5/31/2011 1 comment Market research firm International Data Corp. has cut its forecast on the annual revenue growth of the semiconductor sector to between 4 and 5 percent from 6 to 8 percent, according to a Dow Jones report.
India starts hunt for fab-building chipmakers News & Analysis 5/31/2011 12 comments A committee recently set up by the Indian government to help drive the establishment of semiconductor manufacturing in the sub-continent, has conducted its first meeting and has started approaching chip companies to ask them to set up wafer fabs there.
Intel Ultrabooks attack tablet market News & Analysis 5/31/2011 26 comments Intel will push down the power and size of the notebook computer to create a so-called. Ultrabook, its answer to tablets that have so far chosen ARM over x86 processors.
European EMS firm broken in three News & Analysis 5/30/2011 Post a comment TES Electronics Solutions (Langon, France), an electronics design and manufacturing services company, is being broken up and sold off to three different companies by order of the Tribunal de Commerce de Rennes, according to local reports.
Singapore starts training Abu Dhabi fab workers News & Analysis 5/30/2011 6 comments Teaching institute Singapore Polytechnic has signed an agreement to train wafer fab workers for Abu Dhabi. Some 50 men and women from the Emirate of Abu Dhabi will form the pioneering class following an agreement signed between the Abu Dhabi owned Advanced Technology Investment Co. (ATIC); foundry Globalfoundries Inc., which is majority-owned by ATIC; and Singapore Polytechnic.
Intel embeds Mirics in PC-with-TV motherboard Product News 5/30/2011 6 comments Mirics Ltd., a developer of a software modem technology for digital TV reception, has said that Intel Corp. is planning to deliver global broadcast TV reception through an Intel branded PC motherboard.
OEMS speed adoption of IPv6 News & Analysis 5/30/2011 3 comments The first of over two dozen IPv6 systems from leading OEMs that are using NetLogic Microsystem's NL11k knowledge-based processors will begin shipping in production in 3Q 2011, with the remaining customer systems expected to commence shipping over the following twelve months.
Mentor, Magma top expectations News & Analysis 5/27/2011 1 comment Mentor Graphics CEO Walden Rhines said Mentor's board has met once by phone since three members nominated by billionaire financier Carl Icahn were elected to join it.
Tessera sues Sony again News & Analysis 5/27/2011 2 comments Tessera Technologies filed a complaint through one of its subsidiaries against Sony in California state court.
Zarlink tips 5% job cuts on 'strong' results News & Analysis 5/27/2011 13 comments Canadian mixed-signal chip company Zarlink Semiconductor Inc. has said it plans to reduce its global workforce by approximately 5 percent by the end of fiscal Q2 2012, which ends in September 2011. Zarlink (Ottawa, Ontario) made the announcement within its statement of its fourth fiscal quarter and 2011 fiscal year results.
TI selects G24i as energy harvest partner News & Analysis 5/27/2011 2 comments G24 Innovations Ltd., a pioneer of dye-sensitized thin-film solar cells, is working with Texas Instruments to combine G24i's solar cell technology with TI power conversion ICs.
Image gallery: Xperia Play handset teardown News & Analysis 5/26/2011 5 comments The first "PlayStation certified" smartphone features Qualcomm's Snapdragon, Broadcom's BlueTooth/WiFi/FM combo chip and memory ICs from Micron and Elpida, among others, according to a teardown analysis.
High-temp MEMS goes seismic News & Analysis 5/26/2011 4 comments Analog Devices claims to have designed the world's first MEMS chip that can tolerate temperatures as high as 342 degrees Fahrenheit.
Smart meters wait on home net spec News & Analysis 5/26/2011 17 comments Some smart meter projects are on hold while engineers re-work a road map for Smart Energy Profile 2.0, a key standard for tomorrow's home energy networks.
Freescale CEO bullish on IPO News & Analysis 5/26/2011 6 comments Rich Beyer, Freescale Semiconductor's chairman and CEO, said he was happy with the opening of the company's IPO despite the fact that the opening price was lowered. Shares climbed up more than 5 percent by mid-day trading.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.