Freescale pushes wireless recharge News & Analysis 5/31/2012 15 comments Freescale Semiconductor's reference designs for recharging tablets and smartphones allow automobiles, airports, coffee shops and other public areas to supply almost invisible recharging stations built into tables, kiosks or nearly any horizontal surface.
Insufficient baseband chip supply hurting LTE smartphone sales News & Analysis 5/30/2012 9 comments Since there has been greater than originally expected demand for LTE smartphones and tablets, international vendors are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
Teledyne acquires LeCroy News & Analysis 5/30/2012 4 comments Military and aerospace specialist Teledyne Electronic Technologies has acquired Lecroy Corp., expanding its portfolio of analytical instrumentation products.
3U form-factor PSU claims increased power benefits Product News 5/30/2012 Post a comment Pulse Electronics' 3U form-factor PSU for VPX applications is now available with optimized Positronic P47 connections and can be configured to deliver more than 400 W of power plus provide an additional high power 28 V protected output.
Industrial apps go multi-platform News & Analysis 5/30/2012 3 comments Motorola Solutions has crafted a universal app platform for its developers, enabling a single HTML5 app to be deployed on iOS, Android, Windows Phone, Windows Mobile, Windows CE and Blackberry mobile devices.
Ansys to acquire embedded software firm News & Analysis 5/29/2012 2 comments Simulation software provider Ansys said it signed a definitive agreement to acquire France-based Esterel Technologies, a provider of embedded software simulation tools for mission critical applications, for about $53 million in cash.
MEMS wafer maker Okmetic outsources amid SOI push News & Analysis 5/28/2012 1 comment Okmetic Oyj a manufacturer of silicon wafers for sensor, semiconductor and solar applications, has begun outsourcing wafer manufacture even as it is expanding its factory at its Finland headquarters to make more silicon-on-insulator wafers.
Intel confirms Ireland for 14-nm silicon News & Analysis 5/27/2012 24 comments The Intel wafer fab complex in Leixlip Ireland is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion.
Video: Indy 500 pit boss talks tires News & Analysis 5/27/2012 Post a comment We get down and dirty in the pits at the Indy 500, where we learn how 0.5 increments of tire pressure can make or break a race, how many laps a driver can go on one set of wheels, and how far rival tire makers will go to steal another firm's secrets.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.