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Content tagged with Industrial Control Designline posted in June 2004
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Cutting RF power in W-CDMA phones
News & Analysis  
6/30/2004   Post a comment
The spread-spectrum wireless communications standard, IS-95/3GPP, embodies stringent specifications for linearity and adjacent-channel power ratio (ACPR), says this Maxim engineer. The power amplifier does not operate continuously in voice mode. When the phone user isn't speaking, it runs at a half rate (50 percent of the time) or at a one-eighth rate, so there's no worry about the phone's heating during voice mode. But in data mode the PA runs continuously until the data transmission is complet
Power reduction remains top priority for 3G mobiles
News & Analysis  
6/30/2004   Post a comment
Earlier this year, Vodafone chief executive officer Arun Sarin said that product quality deficiencies would slow the rollout of third-generation (3G) mobile phones. They are bulky, they get hot, and they don't have enough battery life," he said. Rob Keenan uses this as the kick-off point from an EE Times' article package on cell phone power managmenet. The big issue is in W-CDWA power consumption, he warns.
DVD players, LCD screens driving DTV adoption
News & Analysis  
6/30/2004   Post a comment
High-quality LCD and plasma screens capable of showing crisp, vivid images, coupled with the popularity of DVD players, are coaxing a growing number of consumers to buy digital televisions. For CMP's TechWeb.
Sharp sets road map for silicon-on-glass
News & Analysis  
6/30/2004   Post a comment
Sharp Laboratories Europe has established a road map for the miniaturization of integrated circuits manufactured on the glass substrate used in displays.
The industry's first single-chip, dual 14-bit A/D converter
Product News  
6/30/2004   Post a comment
ADI's family of high-speed, dual ADCs saves up to 40% board space and offers flexible, cost-effective solutions for communications and imaging applications.
Stacking gives tomorrow's densities today
Product News  
6/30/2004   Post a comment
Advanced systems designers have a dream. It is to put everything on a single die. Let's face it. It's not going to happen.
Services may make FPGA/ASIC Designs More Transparent
Product News  
6/30/2004   Post a comment
The complexities of doing custom logic in house is becoming increasingly harder. Services are rising to meet the challenges.
Nomadic RF spectrum analyzer spans 100-kHz to 7-GHz
Product News  
6/30/2004   Post a comment
RF test company Anritsu is debuting a battery-powered and handheld spectrum analyzer that's just the ticket for looking at IEEE-802.11a, 3G cellular, ultra-wideband, and WiMAX signals, up to 7-GHz. At the oppossite end of the spectrum, the unit goes down to 100-kHz. eeProductCenter Senior Tech Editor Alex Mendelsohn gives his impressions of Anritsu's new portable.
A White Paper from Lattice on their new DSP Capable FPGAs.
Product News  
6/30/2004   Post a comment
A White Paper From Lattice on Their New Family of DSP Capable FPGAs
A White Paper on the new family of Low Cost FPGA's From Lattice.
Product News  
6/30/2004   Post a comment
A White Paper on the new family of Low Cost FPGA's From Lattice.
NAND Flash Memory: Dispelling the Misconceptions
Product News  
6/30/2004   Post a comment
Contributed Article From Toshiba about NAND Flash Issues.
3U-sized UPS delivers 5.4 kW
Product News  
6/30/2004   Post a comment
Lower Cost Drives New FPGAs
Product News  
6/30/2004   Post a comment
Altera Showcases New Cyclone II Device Family Which Expands Altera's Role in Low-Cost, High-Volume FPGA Market.
My Way or the Highway
Product News  
6/30/2004   Post a comment
Virtual IDM Approach Provides One-Stop Shop For All Aspects Of Complex IC Design Through To Manufacturing Services and Volume Silicon Delivery
New FPGAs target Low Cost and DSP Functions
Product News  
6/30/2004   Post a comment
LatticeECP-DSP family provides lowest cost high-performance DSP solutions; LatticeEC family optimized to deliver most cost-effective general-purpose FPGAs
You Can't Go Askew With These Parts
Product News  
6/30/2004   Post a comment
Revolutionary devices provide unprecedented performance, flexibility in support of high-performance clock network designs on electronic circuit boards
ReShape raises $12 million as EDA funding soars
News & Analysis  
6/30/2004   Post a comment
Riding a wave of new venture capital funding for EDA companies, IC physical design provider ReShape Inc. announced Wednesday (June 30) that it has closed a $12 million round of series C funding. ReShape is among nine EDA companies who have collectively received over $87 million in the first six months of 2004.
Digitale Schnittstelle gibt WLAN neue Möglichkeiten
News & Analysis  
6/30/2004   Post a comment
Die räumliche Trennung von von WLAN-Modem und HF-Chip erlaubt eine Entwicklung des IP-Anbieters NewLogic. Die Technik beruht auf der Digitalisierung der Schnittstelle zwischen den beiden Funktionseinheiten und gibt WLAN-Chipdesignern eine Reihe von Vorteilen an die Hand.
The Next Generation Floppy?
Product News  
6/30/2004   Post a comment
100% Guaranteed Biometric Security ClipDrive Bio flash drive utilizes state of the art security solutions such as biometrics and seamless AES based encryption to deliver unparalled security for the transportation of sensitive data.
Second Generation - Mirror Bit Flash
Product News  
6/30/2004   Post a comment
New technology optimized for wireless platforms; premier product lines deliver unrivaled price-performance for phone makers around the world
Timing is Everything
Product News  
6/30/2004   Post a comment
Leading Provider of Timing Solutions Secures Design Wins at Major Vendor to Provide PC Clock Devices for Next-Generation, High-Performance Desktop Platforms
Stacking Up Against the Competition
Product News  
6/30/2004   Post a comment
Staktek and Toshiba America Electronic Components, Inc. Announce 576Mb Network FCRAMTM Stacked and packaged DRAM doubles current industry standard for enterprise network technology
SRAM-based digital signal controllers target embedded control
Product News  
6/30/2004   Post a comment
Marty Gold reviews TI's new TMS320R2811 and R2812 digital signal controllers that offer 150MIPS of 32-bit DSP performance with price tags starting at under $10 in volume quantities.
MPEG2 Encoder ICs - with analog video-capture function
Product News  
6/30/2004   Post a comment
NEC Electronics announced two MPEG2 encoder devices to incorporate hardware-based analog video-capture functionality for the first time in the industry.
Flash-Based Storage - for telecomms, safety, transportation
Product News  
6/30/2004   Post a comment
M-Systems released its newest solid-state flash disk, the IDE 4000, offering the most affordable flash-based memory solution for telecommunications, public safety and transportation markets.
LVDS ASIC Family - for high resolution imaging applications
Product News  
6/30/2004   Post a comment
There is a wide range of imaging devices that use Low Voltage Differential Signaling (LVDS) standard to transmit serialized RGB data at gigabit rates. EPSON has been supplying LVDS Receiver for many years in applications with focus on liquid crystal panels and home electronic appliances. Taking advantage of such experience EPSON has developed a more worthy and flexible solution: a specific Embedded Array family with LVDS Receiver Macro included.
Power-Over-Ethernet - for IP phones, WLAN access points, etc
Product News  
6/30/2004   Post a comment
Helping customers harness power delivered over a standard Ethernet cable, Texas Instruments announced a versatile IC controller and the industry's first Power-over-Ethernet plug-in power module that reduces design time and eases implementation of Ethernet-powered industrial and commercial devices such as WLAN access points, IP phones, security and point-of-sale systems.
eASIC Announces Tape-out Of First Structured ASIC Array
Product News  
6/30/2004   Post a comment
eASIC Corp, a provider of breakthrough Structured ASIC technology and products, announced taping out of its first Structured ASIC array to be fabricated by a European IDM partner at 0.13 micron process technology.
40V & 60V Power MOSFETs - up to 90% lower on-resistance
Product News  
6/30/2004   Post a comment
Automotive 12V boardnet high-side switches and electric motor drives are the target applications for a record-setting family of p-channel MOSFETs announced by Siliconix. The 40V and 60V devices are the first with these breakdown voltage ratings to be built using Vishay's advanced p-channel technology, which reduces MOSFET on-resistance to record-low levels.
Cool MOSFETs in the army now
Product News  
6/30/2004   Post a comment
Freescale boosts automotive performance potential with S12X MCU
Product News  
6/30/2004   Post a comment
Freescale's MC9S12X MCU targets the automotive industry with a unique architecture that employs a coprocessor to off-load the main CPU of such tasks as basic gateway activity, messaging and CAN functionality. Marty Gold reviews this new 16-bit MCU entry.
Phase Control Thyristors - offer high efficiency, high energy
Product News  
6/30/2004   Post a comment
Dynex Semiconductor announced the first products in a range of high efficiency, high energy, phase control thyristors (SCRs). The thyristors (SCRs) incorporate process improvements and a new emitter design to achieve all round improved performance.
Digital Bus Switches - offer beyond rail-to-rail switching
Product News  
6/30/2004   Post a comment
Pericom Semiconductor has released eight NanoSwitch digital bus switch products that are ideally suited to address the operational requirements of next generation Servers, RAID, Super VGA, Memory Bank Switching, and High-performance Networking/Telecom Backplanes.
Infineon, Nanya open 300-mm DRAM wafer fab
News & Analysis  
6/30/2004   Post a comment
Inotera Memories Inc., the DRAM joint venture formed between Infineon Technologies AG and Nanya Technology Corp. in 2002, has opened its 300-mm wafer fab.
MIT-Spinout plant Angriff auf Datenwandler-Markt
News & Analysis  
6/30/2004   Post a comment
Mit 17 Millionen Dollar Risikokapital und einer streng geheimen Technik aus den Laboratorien des 'Massachussetts Institute of Technology' (MIT) will das Startup-Unternehmen Kenet den Markt für ultraschnelle A/D-Wandler aufmischen.
Nortel lagert Massenfertigung an Flextronics aus
News & Analysis  
6/30/2004   Post a comment
Einen der größten Fertigungsverträge der Telekommunikationsbranche haben Nortel Networks und Flextronics unter Dach und Fach gebracht: Für umgerechnet schätzungsweise 675 bis 725 US-Millionen Dollar wird Flextronics künftig fast die gesamte Fertigung für Nortel übernehmen.
TI et ARM s’associent pour sécuriser les transactions sans fil
News & Analysis  
6/30/2004   Post a comment
Texas Instruments Inc. et ARM Ltd. regroupent leurs technologies respectives Omap et TrustZone afin de développer un système fondé sur les semi-conducteurs pour des transactions sans fil sécurisées.
Silterra et l’IMEC sur le point de développer un procédé 0,13 micron pour 2005
News & Analysis  
6/30/2004   Post a comment
Silterra Malaysia Sdn. Bhd. et le centre de recherche IMEC signent un accord afin de créer un procédé de fabrication CMOS 0,13 micron compatible avec celui des fonderies. Ce procédé reposerait sur un procédé de fabrication 0,13 micron élaboré en interne par l’IMEC et modifié pour répondre aux exigences fixées par les clients de fonderies de plaquettes, indique Silterra mardi (29 juin).
Sharp sets road map for silicon-on-glass
News & Analysis  
6/30/2004   Post a comment
Sharp Laboratories Europe has established a road map for the miniaturization of integrated circuits manufactured on the glass substrate used in displays.
Taktischer Wechsel im Schatten von Linux
Product News  
6/30/2004   Post a comment
Der heftig umkämpfte Markt und der sich abzeichnende Linux-Durchbruch haben ihre Spuren hinterlassen: Zwei der größten Anbieter von Embedded-Software ändern ihre Strategie und setzen auf aggressives Marketing, um Entwickler und deren Geldbeutel für sich zu gewinnen.
Taktischer Wechsel im Schatten von Linux
Product News  
6/30/2004   Post a comment
Der heftig umkämpfte Markt und der sich abzeichnende Linux-Durchbruch haben ihre Spuren hinterlassen: Zwei der größten Anbieter von Embedded-Software ändern ihre Strategie und setzen auf aggressives Marketing, um Entwickler und deren Geldbeutel für sich zu gewinnen.
Renesas outlines product, cost-cutting strategies
News & Analysis  
6/30/2004   Post a comment
Fifteen months after its formation, Japan's Renesas Technology Corp. has put the finishing touches on a corporate reorganization to sustain its future growth and prepare for the next semiconductor cycle.
TI to adopt ARM's mobile security scheme
News & Analysis  
6/30/2004   Post a comment
Texas Instruments Inc. renewed its vows with microprocessor developer ARM Ltd. by announcing a plan to incorporate ARM's hardware security scheme for chip sets used in wireless handsets.
Carbon, CoWare link RTL to SystemC
News & Analysis  
6/29/2004   Post a comment
Claiming that co-simulation between a SystemC simulator and an event-driven RTL simulator is no longer needed, EDA startup Carbon Design Systems has announced that its DesignPlayer hardware and software validation modeling system works in CoWare's ConvergenSC SystemC simulation environment.
Page 1 / 18   >   >>


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