China's BCD Semi scraps IPO News & Analysis 6/30/2008 Post a comment China's BCD Semiconductor Manufacturing Ltd. has withdrew its plan for a U.S. initial public offering of its common stock, according to a filing from U.S. Securities & Exchange Commission (SEC).
8-bit MCU features dual bus design for complex multi-chip A/V subsystem control Product News 6/30/2008 1 comment Its dual SMBus feature, small form factor and support for a wide range of operating voltages make the SST89C58RC MCU an ideal solution for numerous applications, including HDMI, HDTVs, A/V receivers, home appliances, industrial instruments, notebook PCs, DVD players, Blu-ray players, RF modules and security applications such as fingerprint identification.
Opinion: ST-NXP Wireless needs a new name News & Analysis 6/30/2008 3 comments ST-NXP Wireless, the new communications IC joint venture floated by STMicroelectronics NV and NXP BV, is starting life with a name that confuses its identity with those of the parent companies. Even before the ink dries up on its birth certificate, CEO Alain Dutheil should consider changing the name.
Samsung invests in Inside Contactless News & Analysis 6/30/2008 Post a comment Samsung Ventures America announced it has invested in French fabless supplier of smartcard chips Inside Contactless SA. Building upon investments from Nokia Growth Partners, Motorola Ventures and institutional investors, this participation brings the total investment in the company to about $42 million.
Airless tire reinvents wheel News & Analysis 6/30/2008 Post a comment Resilient Technologies together with the University of Wisconsin's Madison Polymer Engineering Center, are developing an airless tire to solve the problem with a four-year, $18-million grant from the Pentagon.
Fluke : ScopeMeter suits CAN-bus troubleshooting Product News 6/30/2008 Post a comment As well as enabling detailed signal measurements, the rugged Fluke 125 Industrial ScopeMeter features a "bus health" mode function which gives a clear good/bad indication for the electrical signals on a CAN-bus and other buses.
Are IC thermal problems hot air, question panelists News & Analysis 6/30/2008 Post a comment At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?
Europe again lags in chip sales for May '08 News & Analysis 6/30/2008 Post a comment Europe was again the laggard in semiconductor growth in May, with the WSTS figures showing it fared worst in both the three month moving average and year-to-year calculations compared to other regions, and that it showed the largest decline, of 0.3 percent, for sales between April and May 2008.
Chip sales increased 7.5% in May, says SIA News & Analysis 6/30/2008 Post a comment The three month moving average of global chip sales was $21.8 billion in May, 7.5 percent up on the $20.3 billion reported for May 2007, according to the Semiconductor Industry Association (SIA) and based on figures from WSTS.
Sony Ericsson posts another profits warning News & Analysis 6/27/2008 Post a comment A profit warning from Sony Ericsson sent the share price of most mobile phone makers lower as the joint venture between Sony and Ericsson said second-quarter sales and net income would be hit by slowing demand for mid- to high-end models, and that it would only break even for the quarter.
Global chip sales seen 7% up in May News & Analysis 6/27/2008 Post a comment The three-month moving average of global chip sales is estimated to have come in at $21.7 billion in May, up a healthy 7 percent on the $20.3 billion achieved in May 2007, according to Bruce Diesen, analyst at Carnegie Research.
Autodesk ends interest in bid for Flomerics News & Analysis 6/27/2008 Post a comment Autodesk will not pursue its interest in simulation software group Flomerics (Hampton Court, England) leaving the field clear again for Mentor Graphics, who has a 29 percent stake in the British company and who has made several bids to take control.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.