AMS, Dialog Confirm Merger Talks News & Analysis 6/30/2014 6 comments Mixed-signal, power, and RF chip companies AMS AG and Dialog Semiconductor plc have announced that they are in discussions over a possible merger.
China Smartphones: Hot for Sensor Hubs News & Analysis 6/23/2014 5 comments Hillcrest Labs has snatched a smartphone design win for its sensor hub software from Coolpad. This illustrates the insatiable desire among smartphone and wearable vendors to add more sensors to their devices.
X-Fab Cranks Up MEMS Capacities News & Analysis 6/23/2014 Post a comment Semiconductor foundry X-Fab is expanding its MEMS manufacturing capacity in its Erfurt and Itzehoe locations. At these locations, X-Fab is adding 21.500 square feet of cleanroom facilities.
Brazil Wins in LFoundry Rousset Sell-Off News & Analysis 6/20/2014 1 comment South American wafer fab Six Semiconductores of Belo Horizonte, Brazil, has been selected by the Commercial Court of Paris to buy the assets of the bankrupt LFoundry Rousset wafer fab site.
Molex's Shopping Spree Continues News & Analysis 6/18/2014 1 comment Following the recent acquisition of the heavy-duty connector business of Westec last May, and after acquiring the Munich-based FCT Electronics Group in August last year, Molex, which only merged with cabling and connector giant Koch Industries in November last year, is now acquiring Flamar Cavi Elettrici S.r.l.
Analog Devices' $2 Billion RF Buy News & Analysis 6/17/2014 6 comments With its $2 billion cash deal to acquire RF chip maker Hittite Microwave Corp. last week, ADI will gain more than a 1,000 RF chip products that cover the frequency range of DC to 110 GHz: RF (0 to 6 GHz), microwave (6 GHz to 20 GHz), and millimeter wave (20 GHz to 110 GHz).
Intel, Dell Ride SDN Into Telcos News & Analysis 6/16/2014 6 comments To handle the explosion of data in a more effective way, several service providers are advocating for a move to virtual networks driven by software and spearheaded by the telecommunications industry.
Analog Chip Markets on the Up, Says WSTS News & Analysis 6/10/2014 10 comments The World Semiconductor Trade Statistics organization raises its forecast of how sub-markets will perform in 2014 – including the Europe, Asia-Pacific regions and the analog, logic and memory product classes.
Ziptronix & EVG Improve Wafer Alignment News & Analysis 6/9/2014 3 comments Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
TI to Redefine Infotainment for Economy Cars News & Analysis 6/9/2014 9 comments Consumer demand for advanced IVI systems, the bring-your-own-device trend, the auto industry’s pressing need to consolidate a growing number of ECUs, and the further progress of ADAS are key factors driving the automotive chip market.
AMD's G-Series APUs & CPUs Take Flight News & Analysis 6/4/2014 Post a comment AMD's G-series devices address a wide range of embedded applications in healthcare, finance, education and retail, and also industrial applications in rugged and harsh environments.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.