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Content tagged with Industrial Control Designline posted in August 2000
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NEC, In-System to develop ICs for USB 2.0 spec
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8/31/2000   Post a comment
BOISE, Idaho -- In-System Design Inc. (ISD) today announced a partnership with NEC Corp. to co-develop a family of devices based on a new Universal Serial Bus (USB) 2.0 standard. Under a partnership agreement, ISD's digital expertise will be combined with NEC's analog capabilities to create what the companies claim will be the world's first single-chip solutions for the USB 2.0 specification.
Tundra to buy chip-layout specialist Quadic for $45 million
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8/31/2000   Post a comment
KANATA, Ontario--Tundra Semiconductor Corp. here today announced plans to acquire Quadic Systems Inc., an analog chip developer and design-layout specialist based in South Portland, Maine. Tundra said the purchase will help it reduce development time for high-speed interconnect technology in communications-chip applications. Tundra plans to buy Quadic for stock and cash, valued at up to $45 million.
OSE, Siliconware aim to be Taiwan's next $1 billion companies
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8/31/2000   Post a comment
SAN JOSE -- The rapid shift towards outsourcing in the IC-packaging and assembly arena is creating the next wave of $1 billion companies in Taiwan. Two Taiwan-based companies -- Orient Semiconductor Engineering Ltd. (OSE) and Siliconware Precision Industries Co. Ltd. (SPIL) -- separately projected that they will reach $1 billion in sales over the next year or two, putting them in an elite group of companies in the booming IC-packaging and assembly business.
Innocomm shifts to fabless model from wireless-IC design house
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8/31/2000   Post a comment
SAN DIEGO -- Two-year-old Innocomm Wireless Inc. here has turned itself into a fabless chip company from its start as an IC design house for radio-frequency and mixed-signal devices. The San Diego startup said it now specializes in chip sets for wireless PCs and automation products in the home and office.
Wolfson's stereo DAC integrates all audio functions for digital TV
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8/31/2000   Post a comment
EDINBURGH, Scotland -- Wolfson Microelectronics Ltd. today announced a single-chip digital-to-analog converter (DAC) that integrates all the functions needed for audio processing in digital TVs and set-top boxes.
Metrology supplier ADE posts 76% sales increase, narrows loss
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8/31/2000   Post a comment
WESTWOOD, Mass.--ADE Corp. here reported a 76% increase in revenues to $21.8 million in the company's first fiscal quarter, ended July 31, compared to $12.4 million in the period last year. The supplier of metrology and inspection systems posted a net loss of $1.2 million in the quarter vs. a net loss of $7.2 million in the period last year.
Top AMD executive departs suddenly
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8/31/2000   Post a comment
Fab infrastructure supplier Kinetics completes $550 million buyout
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8/31/2000   Post a comment
SANTA CLARA, Calif.--Kinetics Group Inc., a supplier of process infrastructure systems for chip-production tools, announced the completion of a $550 million buyout of its operations by management and the investment arm of Deutsche Bank AG.
TI says it won't rush Burr-Brown merger; Tucson fab upgrade considered
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8/31/2000   Post a comment
TUCSON, Ariz. -- Now that Texas Instruments Inc. has completed its $7.6 billion acquisition of Burr-Brown Corp., the real tricky part of M&A has begun--merger. Top TI officials promise to take a steady-but-not-hurried pace in merging the venerable analog chip supplier into Texas Instruments. In doing so, TI will put customer requirements ahead of merger activities, and it will consider upgrading Burr-Brown's 4-inch wafer fab in Tucson, while maintaining existing foundry agreements, said managers
Philips buys full ownership of LCD joint venture in Japan
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8/31/2000   Post a comment
AMSTERDAM, the Netherlands -- Royal Philips Electronics NV today announced it is acquiring the remaining shares of a Japanese joint venture in liquid-crystal displays, formed three years ago with partner Hosiden Corp. in Osaka. The Dutch company said it will buy the remaining 20% interest in Hosiden and Philips Display Corp. (HAPD), which was created in April 1997 to produce 15-inch active-matrix LCDs.
Lithography sales rise 178%; tools total grows 112% in first half of 2000
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8/31/2000   Post a comment
SAN JOSE -- Semiconductor capital equipment shipments grew 112% in the first half of 2000, compared to the same period last year, according to a new industry report, which underscores the rapid buildup of chip capacity that worries some analysts. Chip makers took delivery of $21.9 billion in production equipment during the first six months of 2000 vs. $10.3 billion in the first half of 1999, said the SEMI trade group today.
On Semi to triple R&D and target power management, broadband ICs
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8/31/2000   Post a comment
PHOENIX -- On Semiconductor today announced plans to triple spending on research and development by 2001, compared to 1999 levels, with a long-term target of R&D expenditures set at 5-to-6% of revenues after next year. The year-old spin-off from Motorola Inc. spent about $37 million on R&D in 1999, which represented 2.3% of its revenues.
Pentium IV Pushes Clocks To 1.4 GHz and Beyond
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8/31/2000   Post a comment
DSPnet Site Director Ray Weiss discusses how the Pentium IV, Intel's latest Pentium built on microburst architecture, proves that the Pentium still kicks butt.
Write Once, Then What?
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8/31/2000   Post a comment
Java arose from the vision of the network as the computer. It was intended to be a language by which applications could run on any machine without changes. The rallying cry "write once, run anywhere" fired the imagination of developers worldwide. EMBEDDEDnet site director Rich Quinnell asks, "Has Java delivered on its promise?"
Anadigics enters new wireless net arena, invests in Embedded Wireless
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8/30/2000   Post a comment
Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
Varian Semiconductor Equipment gears up production in Korea
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8/30/2000   Post a comment
GLOUCESTER, Mass.-- A year and a half after spinning off as an independent company, Varian Semiconductor Equipment Associates Inc. today announced a new initiative to rebuild its manufacturing presence in Korea.
Corning increases efforts in glass for EUV lithography
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8/30/2000   Post a comment
CORNING, N.Y.--Corning Inc. today said it was increasing its emphasis on ultra-low expansion glass for next-generation lithography applications. The company believes its ULE glass substrate material will enable extreme ultraviolet (EUV) technology to become a viable replacement for optical lithography in wafer fabs.
Intel accuses Broadcom of building business on its patents
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8/30/2000   Post a comment
SANTA CLARA, Calif. -- Intel Corp. today expanded its legal assault against Broadcom Corp., charging the Irvine, Calif.-based company with patent infringement and misappropriation of trade secrets. The suit, filed in the U.S. District Court of Delaware, also alleges that Broadcom is involved in a "carefully crafted plan" to base its business around Intel's communications-chip technology.
Gel-Pak to acquire supplier of prototype plastic packages
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8/30/2000   Post a comment
SUNNYVALE, Calif.--Gel-Pak LCC today announced plans to acquire Silicon Packaging Technology Inc., a San Diego supplier of prototype plastic packages for integrated circuits. The acquired company will be renamed Quik-Pak and will continue to offer plastic packages for new IC designs that have the same mechanical and electrical performance as chips housed in production packages, Gel-Pak said.
Compaq, Intel, Microsoft, and others develop new power management spec
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8/30/2000   Post a comment
SAN JOSE -- A group of 29 companies led by Compaq, Intel, Microsoft, Phoenix, and Toshiba here today banded together to publish a new power management specification for notebook PCs, desktops, and servers.
Alliance to invest $75 million in Tower's new foundry fab in Israel
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8/30/2000   Post a comment
MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
Dense-Pac applies chip-stacking packaging to DSPs
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8/30/2000   Post a comment
GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.
AMD aims 32-Mbit simultaneous read/write flash at portable systems
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8/30/2000   Post a comment
SUNNYVALE, Calif.--Advanced Micro Devices Inc. today launched a new 32-megabit flash memory chip, which combines low-voltage technology with a simultaneous read/write architecture for portable systems applications. The 1.8-volt flash is capable of read-access times as fast as 110 nanoseconds with up to 60% less power consumption, compared to 3-V devices, said AMD.
TSMC says it's sold out of foundry capacity for 2000 and 2001
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8/29/2000   Post a comment
SANTA CLARA, Calif. -- During an industry meeting here, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) disclosed that the company is already sold out of its worldwide wafer-foundry capacity for both 2000 and 2001, with demand remaining robust at least until 2003.
inSilicon licenses Arm's system-on-chip peripherals
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8/29/2000   Post a comment
SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
Philips aims analog frontend ICs at range of CCD camera segments
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8/29/2000   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).
Conexant offers chip set for V.90 modem, Ethernet on single card
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8/29/2000   Post a comment
NEWPORT BEACH, Calif.--Conexant Systems Inc. today rolled out a new V.90/Ethernet chip set for mobile computing, based on a mini-peripheral component interconnect form factor, called mini-PCI. The solution puts both the V.90 modem and Ethernet connection on a single card, saving costs in notebook PCs, said the company.
Nvidia files suit against 3dfx
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8/28/2000   Post a comment
SAN JOSE -- Nvidia Corp. here today announced a lawsuit against 3dfx Interactive Inc. for alleged patent infringement in the graphics chip market. The suit claims that 3dfx of San Jose has infringed upon five of Nvidia's patents involving graphics-acceleration technology used in PCs.
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