Component inventory overhang persists News & Analysis 8/30/2002 Post a comment Last year's massive inventory glut continues to linger for component suppliers as poor end-market conditions, shifting product designs, and fierce global competition mar suppliers' recovery efforts.
TSMC takes another step toward China News & Analysis 8/29/2002 Post a comment TSMC has signed a memorandum of understanding (MOU) to build wafer fabs in China, paving the way for Taiwan's foundries to enter the thriving Chinese market from which they had until recently been barred.
OC-768: Jumping Physical Design Hurdles News & Analysis 8/29/2002 Post a comment The jump from the OC-192 to OC-768 level will be an even tougher hurdle for design engineers to leap. Here's a look at the design hurdles engineers will face and some solutions to these problems.
Lattice completes Cerdelinx acquisition News & Analysis 8/27/2002 Post a comment Lattice Semiconductor Corp. today announced it has completed its acquisition of Cerdelinx Technologies Inc., bolstering its efforts to integrate high-speed serial I/Os in its FPGA devices.
Carrier Grade Linux: What You Need to Know News & Analysis 8/27/2002 Post a comment Interest is building around the use of Linux in telecom equipment designs. To accelerate acceptance, the OSDL is developing a set of specs that will turn Linux into a carrier-grade OS. Here's a look at these efforts.
CAD tackles package parasitics News & Analysis 8/26/2002 Post a comment RF and mixed-signal (RF-AMS) IC design is already very challenging today, without designers' having to worry about the electrical, thermal and yield effects of the chip package.
BGAs jump speed/density barrier News & Analysis 8/26/2002 Post a comment The combination of large, complex devices with hundreds of pins and densely packed system layouts has led to the proliferation of ball grid array packages.
Current feedback op amps save power in fast photodiode applications News & Analysis 8/20/2002 Post a comment Current Feedback Amplifiers offer high bandwidth with minimal power supply current draw. However, they are rarely used as transimpedance amplifiers in photodiode applications because of the high current noise associated with their inverting inputs. A Linear Technology apps engineer shows how to get mileage from a unity gain configuration.
Method ensures on-track designs News & Analysis 8/19/2002 Post a comment Achieving functional closure on register-transfer-level designs continues to be one of the greatest challenges for today's ASIC and system-on-chip design teams.
Spreadsheet explains decibels as voltage and power News & Analysis 8/18/2002 Post a comment dB, or decibels -- are one of the most useful -- but misunderstood units in all of electronic design. Part of this confusion comes from the fact that some decibel units are units of power, and some are units of voltage. More confusion arises when it is necessary to convert between decibel units, or to convert from a power measurement to a voltage measurement. TI's Bruce Carter describes the decibel, and holds out a spreadsheet that will help designers with their dB measurements.
AMD fab unaffected by floods News & Analysis 8/15/2002 Post a comment Advanced Micro Devices said Thursday that its leading-edge fab in Dresden, Germany has been unaffected by the devastating floods sweeping Europe
Troubleshooting WLAN Radio Designs: Part 2 News & Analysis 8/15/2002 Post a comment Optimizing 802.11b radio architectures can be a challenging task for today's system designers. This two-part series diagnose/correct problems in the transmit and receive portions of a radio design.
Why MEMS Need to Be More Like ASICs News & Analysis 8/12/2002 Post a comment Microelectromechanical-system (MEMS) technology has reached a level
where MEMS devices should be making a big impact in key application
areas, such as communications and biotechnology. TechOnLine's Content
Director, Jim Lipman, provides his take on why MEMS pervasiveness is
currently much smaller than expected by many analysts and a way MEMS
usage can be increased.
IBM to cool down servers News & Analysis 8/8/2002 Post a comment IBM Corp. said it has developed a prototype of a low-power server that cuts power consumption in half when compared to the p610 server that debuted earlier this year with 450W power consumption and dissipation of 1,536 BTUs per hour.
Teradyne to close San Diego PCB plant News & Analysis 8/8/2002 Post a comment Continuing to reel from a slump in the printed circuit board market, Teradyne Inc. announced it would close its San Diego board plant and lay off 125 employees by the year's end.
Merged voice and data means lower voltages for communications systems News & Analysis 8/8/2002 Post a comment The transition from traditional telephony to converged voice and data with Internet Protocols has some interesting implications for power conversion in data communications systems. For one thing, the traditional --48V power bus must be converted to increasing lower voltages for new-generation logic. Fairchild's go-to guy on power issues, Reno Rossetti, discusses the trend and offers some power conversion examples - complete with applications schematics.
Proper board layout makes switchers work right the first time News & Analysis 8/8/2002 Post a comment The stability of a switching power supply is the consequence of a number of factors, including the choice of regulator ICs and filter components. But as National's Sanjaya Maniktala points out, the printed circuit board layout can have a critical effect on switcher stability. The inductive effects of the PCB traces will effect buck and boost regulators very differently. Every once of copper makes a difference, says Sanjaya, in this thorough and informative analysis.
Fine-Tuning VoBroadband Test Capabilities News & Analysis 8/1/2002 Post a comment Integrated linecard/test-head designs help reduce the cost of performing automated tests in VoB applications. But, before implementing automated tests, designers must weigh their value and determine what troubles thee automated system should target.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.