China stimulus seen as opportunity for IC firms News & Analysis 8/31/2009 Post a comment Market research firm Gartner advised semiconductor firms to step up efforts to work with Chinese manufacturers in order to cash in on a rise in that country's domestic demand being driven by a government subsidy program for home appliances.
Magma posts loss, amends tender offer News & Analysis 8/31/2009 Post a comment Magma Design Automation posted a loss in accordance with generally accepted accounting principles of $4.3 million on revenue of $28.8 million for the first quarter of its fiscal 2010, the company reported last week.
Globalfoundries in multi-year contract with Cadence News & Analysis 8/31/2009 Post a comment Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
Newsbits: Broadband flood, iPhone in China Product News 8/28/2009 Post a comment Two separate signs of growth in communications hit today as the U.S. government reported it received nearly 2,200 applications requesting nearly $28 billion in stimulus funding for proposed broadband projects and Apple struck a deal with China Unicom to sell the iPhone in China.
Gateways, Web shape next-gen home networks News & Analysis 8/28/2009 Post a comment Tomorrow's home networks will be shaped by a race to bring the Web to digital home products and the rising influence of service providers, according to a market watcher Parks Associates in an online talk.
IBM visualizes single molecule structure News & Analysis 8/27/2009 Post a comment Scientists at IBMs Zurich laboratory have succeeded to visualize the structure of an individual molecule using non-contact atomic force microscopy (AFM). The move is a further step to a still very distant future: Molecular electronics.
Group bids to spend $178M on smart grids News & Analysis 8/27/2009 1 comment A team of utilities, vendors and research groups has submitted a five-year, $178 million proposal to the U.S. Department of Energy to build a smart electric grid demonstration system in the Pacific Northwest region, one of more than 400 bids for economic stimulus grants the DoE has received, contending for as much as $3.9 billion in government funds aimed at accelerating work on smart grids.
Nvidia offers $5,000 in prizes to Cuda programmers News & Analysis 8/27/2009 1 comment Graphics chipmaker Nvidia Corp. (Santa Clara, Calif.) has said it plans to offer prizes totaling $5,000 to five programmers who use the Cuda parallel programming environment to solve the first of a series of challenges.
Startup rewrites NXP’s legacy in 3D passive integration News & Analysis 8/27/2009 Post a comment Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education News & Analysis 8/27/2009 1 comment How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Plenty of business in VDSL for Lantiq News & Analysis 8/27/2009 Post a comment Christian Wolff, designated CEO of Infineon's wireline business sold to Golden Gate Capital, explains the company's strategies in terms of product spectrum, technologies and geographies.
Arasan adds MIPI to IP stable Product News 8/27/2009 Post a comment Arasan Chip Systems, Inc. has released its MIPI (Mobile Industry Processor Interface) High Speed Synchronous Interface (HSI) controller IP and software stack.
Taray appoints Bernie Aronson to Board of Directors Product News 8/27/2009 Post a comment Taray, Inc., a supplier of electronic design automation for design of
FPGA-based systems, announced it has made a key addition to
its board of directors with the appointment of Bernie Aronson, an
industry veteran in semiconductors and electronic design automation.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.