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Content tagged with Industrial Control Designline posted in September 2000
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Agilent announces new memory tester
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9/29/2000   Post a comment
PALO ALTO, Calif.-- Agilent Technologies Inc. here has expanded its line of automatic test equipment, rolling out a system for use in testing high-speed non-volatile memory devices. Featuring a tester-per-site architecture, the V4400 NVM Test System from Agilent is a general-purpose wafer-sort and final test system designed for use in testing non-volatile memories, embedded devices, and specialty ICs.
STMicro doubles speed of 16-bit MCU, adds DSP functions
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9/29/2000   Post a comment
GENEVA--STMicroelectronics here today announced a new 16-bit microcontroller core, based on a chip architecture that enables most instructions to be executed in a single clock cycle. The new core--called Super10--doubles the execution speed of existing ST10 microcontrollers in such applications as hard-disk drives, automotive electronics and consumer systems, said STMicroelectronics. It also adds DSP functionality for real-time control.
TI forms cell-phone handset venture in China
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9/29/2000   Post a comment
BEIJING -- Texas Instruments Inc. here today announced a joint venture with four companies in China to co-develop next-generation cellular phones, based on TI digital signal processors (DSP) technology. According to a memorandum of understanding (MOU), TI will form a joint venture to develop handsets for the China market with ZTE Corp. Xiamen Overseas Chinese Electronic Inc. Ltd. (Xoceco), Beijing Huahong IC Design Corp., and Ningbao Bird Co. Ltd.
Sun plans to accelerate upgrades to UltraSparc CPUs
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9/29/2000   Post a comment
PALO ALTO, Calif. -- With this week's launch of the UltraSparc III architecture, Sun Microsystems Inc. here is aiming to accelerate its 64-bit processor roadmap to stay well ahead of Intel Corp. and Advanced Micro Devices Inc., which are pushing into the 64-bit arena with their own PC-compatible MPUs.
Samsung applies DDR format to speed up 128-Mbit graphics DRAM
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9/29/2000   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. here today claimed to be the first chip maker to develop a 128-megabit double data rate (DDR) SDRAM for graphics memory applications. The memory supports three-dimensional images and video storage using the DDR memory format, achieving data rates of 500 Mbits per second, according to Samsung.
Motorola sues former chip boss Ruiz for recruiting executives
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9/28/2000   Post a comment
SCHAUMBURG, Ill.-- Motorola Inc. today announced a lawsuit against the former president of its semiconductor business, Hector de J. Ruiz, alleging that he has broken a contract by recruiting Motorola chip executives to join Advanced Micro Devices Inc. Last January, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
300-mm fabs could be bad news for current boom cycle, warns analyst
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9/28/2000   Post a comment
SAN JOSE -- At the annual awards dinner here hosted by the Semiconductor Equipment and Materials International (SEMI) trade group, analyst John Pitzer of Credit Suisse First Boston Corp. said capital spending next year will continue to be strong, but the transition to larger 300-mm wafers could dump too many semiconductors on the market.
Kyma to offer aluminum-nitride wafers for commercial use
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9/28/2000   Post a comment
RESEARCH TRIANGLE PARK, N.C. -- Kyma Technologies Inc. here today announced development of aluminum-nitride (AlN) wafers with 2- and 4-inch diameters for optoelectronics, communications, and semiconductor applications.
Analog Devices rolls out embedded Internet modem chip
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9/28/2000   Post a comment
SAN JOSE -- During the Embedded Systems Conference here today, Analog Devices Inc. introduced a single-chip Internet modem, which the company says is the first device to combine TCP/IP protocol stack and modem functionality.
Wind River, Intel partner on development support for XScale I/O chip set
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9/28/2000   Post a comment
ALAMEDA, Calif. -- Embedded-systems tool supplier Wind River Systems Inc. today announced an agreement with Intel Corp. to support the chip giant's move into data storage, networking, and communications applications, based on the new Intel StrongArm and XScale processor architectures.
Rise discloses more details about its x86 processor strategy
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9/28/2000   Post a comment
SAN JOSE -- At the Embedded Systems Conference here, Rise Technology Co. disclosed more details about its plans to compete in the x86-based microprocessor business. The San Jose-based company rolled out the first member of its iDragon System-on-Chip line, an x86-based processor designed for use in set-top boxes, Internet appliances, and related products
Canon plans lithography production for 500 systems per year
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9/28/2000   Post a comment
TOKYO -- Canon Inc. today announced it will invest an additional $100 million to increase production of lithography tools, including advanced wafer steppers and scanners capable of supporting 300-mm fabs. The company said its expanded manufacturing complex in Utsunomiya, Japan, will operate at an annual capacity of 500 systems per year by the third quarter of 2001.
NEC-Hitachi venture announces 'Elpida' name, 0.13-micron DRAM
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9/28/2000   Post a comment
TOKYO--The DRAM joint venture between NEC Corp. and Hitachi Ltd. today branded itself as Elpida Memory Inc. The two Japanese chip giants also announced that the joint venture has completed development of its first product using 0.13-micron design rules to create a 256-megabit memory in half the die size of today's 0.18-micron DRAMs.
Sarnoff's I/O protection technology could save fabs $50 per wafer
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9/28/2000   Post a comment
PRINCETON, N.J. -- Sarnoff Corp. here this week disclosed a new technology that potentially saves one day in the time it takes to fabricate semiconductor wafers by eliminating the need for a silicide-blocking process step. The technology development company estimated that the cost savings in chip-processing plants could be as much as $50 per wafer.
Applied reports breakthrough in inspection of narrow via structures
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9/27/2000   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. today announced successful demonstration of breakthrough defect-detection capabilities for semiconductors with 7:1 high aspect ratio structures, such as interconnect vias. In evaluations of optical inspection technologies at International Sematech, Applied's multi-perspective laser-scanning system detected critical defects, such as 50-nanometer (0.05-micron) residue, in narrow via structures, according to the company. Inspection of high aspect ratio vi
Fairchild cuts delivery cycle times for logic, interface chips
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9/27/2000   Post a comment
SOUTH PORTLAND, Maine -- Fairchild Semiconductor International Corp. today said it has trimmed cycle times for deliveries of logic and interface products by 65% to 90 days. "New tools and processes will further reduce our cycle time on selected products to 75 days by the end of this year," promised W.T. Greer, senior vice president and general manager of Fairchild's Interface & Logic Group.
Fast-Chip to use UMC foundry for 0.18-micron network coprocessors
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9/27/2000   Post a comment
SUNNYVALE, Calif. -- Two-year-old Fast-Chip Inc. today announced it will use 0.18-micron foundry services at United Microelectronics Corp. to produce its initial series of network coprocessors.
Intel's XScale architecture debuts in network-processor chip set
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9/27/2000   Post a comment
SAN JOSE -- At the Embedded Systems Conference, Intel Corp. today announced the first in a family of chips based on its new RISC-based processor architecture for networking, storage, and related markets.
APW's fiscal Q4 loss is also a gain
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9/27/2000   Post a comment
China's SMIC foundry startup aims for pilot production in 2001
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9/27/2000   Post a comment
SAN JOSE -- A new Shanghai-based silicon foundry company, led by Taiwanese chip veteran Richard Chang, will shortly break ground on its initial wafer fab with aggressive plans to move into pilot production by mid-2001, according to company officials.
Singapore's SSMC fab running wafers 90 days after tool installation
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9/27/2000   Post a comment
SINGAPORE -- Just 90 days after the first chip-processing tools were installed, the silicon wafers have begun running through a new joint-venture fab set up here by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Philips Semiconductors. The new foundry venture--called Systems on Silicon Manufacturing Co. Pte. Ltd. (SSMC)--is now qualifying its processes and aiming to ramp production to full capacity by in 2002.
V3, Infineon collaborate in design boards for TriCore processors
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9/27/2000   Post a comment
TORONTO--V3 Semiconductor Inc. here today announced a new development board and collaboration with Infineon Technologies AG to support single-board computers with embedded PCI interfaces. V3's new evaluation and reference-design system supports embedded PCI applications using Infineon's TriCore Unified Processor Architecture.
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Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
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A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
2 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
28 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
127 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

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