Brooks Automation to lay off 175-200 workers, lowers outlook News & Analysis 9/28/2001 Post a comment CHELMSFORD, Mass.--Joining a parade of companies cutting their forecasts, Brooks Automation Inc. today announced it would lay off 175-to-200 people and it lowered estimates for revenues in the current fiscal quarter. The company said its revenues are now expected to be in a range of $60-to-$63 million, down from a previous guidance of $70-to-80 million.
EUV consortium obtains $65 million in new funds News & Analysis 9/28/2001 Post a comment LIVERMORE, Calif. -- A U.S.-led consortium to develop extreme ultraviolet (EUV) lithography tools has received $65 million in new funding as part of an expanded contract for the organization.
The consortium--dubbed Extreme Ultraviolet LLC--has received the new funds from its existing members, bringing the total capitalization for the organization to about $315 million.
Karl Suss increases facility for flip-chip bonders in France News & Analysis 9/28/2001 Post a comment SAINT-JEOIRE, France -- Karl Suss France SA, a subsidiary of Munich-based Suss MicroTec AG, said it has completed expansion of a flip-chip bonder production facility here, doubling the plant's capacity for optoelectronics and microelectromechanical system (MEMS) components.
G4 PowerPC and C6000: A Comparison News & Analysis 9/28/2001 Post a comment Traditional DSP chips are now being challenged by a new generation of RISC microprocessors. Pentek's Rodger Hosking compares Motorola's G4 PowerPC RISC device and Texas Instruments' C6000 DSP family by examining both hardware and software issues, and by highlighting the strengths and weaknesses of each device.
STMicro tailors flash and SRAM chips for automotive systems News & Analysis 9/27/2001 Post a comment GENEVA -- STMicroelectronics today announced an expansion of its memory offering for automotive applications, including four new 16-megabit flash chips configured with 32-bit wide data buses and a 128-kilobit (by-16-bit) SRAM dedicated for automotive system designs.
Samsung readies 576-Mbit Rambus DRAM with 0.12-micron process News & Analysis 9/27/2001 Post a comment SEOUL -- Samsung Electronics Co. Ltd. today claimed development of the industry's first 576-megabit Rambus DRAM. The new memory is based on 0.12-micron processes and operates at 1.066-GHz frequencies, making it about eight times faster than today's PC133 synchronous DRAMs, said the Korean chip maker.
Applied's Etec aims e-beam mask tool, new etcher at regaining momentum News & Analysis 9/27/2001 Post a comment HAYWARD, Calif. -- Hoping to regain momentum in the photomask systems business, Applied Materials Inc.'s Etec Systems subsidiary today rolled out a one-two punch in the arena: a new electron-beam-based reticle-writing tool for 0.10-to-0.07-micron IC processes and the company's entry into the emerging plasma-etch photomask equipment market.
Tokyo Seimitsu accuses KLA-Tencor of antitrust violations in patent dispute News & Analysis 9/26/2001 Post a comment TOKYO -- The chairman of Tokyo Seimitsu Co. Ltd. refuted KLA-Tencor Corp.'s allegation of patent infringement in a lawsuit filed recently in the U.S. District Court of North California. Hideo Ohtsubo, who is also CEO of Tokyo Seimitsu, said KLA-Tencor's patent, covers automatic inspection technology for photomasks, is invalid and unenforceable.
Japan sees falling LCD sales News & Analysis 9/26/2001 Post a comment For the second consecutive quarter, Japan has fallen out of the global lead in TFT-LCD production as its industry undertakes a massive restructuring in response to a protracted economic downturn.
TSMC trims expansion plans News & Analysis 9/26/2001 Post a comment Taiwan Semiconductor Manufacturing Co. (TSMC) said it will spend slightly less on capacity expansion in 2002 and will probably fall short of exhausting the $2.2 billion it budgeted for this year.
Here come plastic ICs from startup FlexICs News & Analysis 9/26/2001 Post a comment MILPITAS, Calif. -- After years of research and development, foundry startup FlexICs Inc. here will soon begin shipping samples of the world's first semiconductors fabricated on six-inch plastic substrates.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.