Marvell Shakes Up SoCs, DRAMs News & Analysis 2/23/2015 8 comments Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Self-Directing Antennas Prep for 5G News & Analysis 2/17/2015 Post a comment Ethertronics is leveraging experience developing embedded antennas to create a line of dedicated beamforming chips. The company’s EtherChip EC482 aims to improve RF signal for Wi-Fi and 5 GHz backend applications.
Hollywood Hands Engineer an Oscar News & Analysis 2/10/2015 4 comments Texas Instruments engineer Larry Hornbeck will receive an Academy Award of Merit for his work in improving color and projection in digital films through optical semiconductors.
Tabula Set for March Shutdown News & Analysis 1/30/2015 8 comments Programmable logic company Tabula is rumored to be closing its doors on March 24. Tabula garnered industry interest with a unique 12-level FPGA architecture that dramatically shortened interconnects.
FPGA Debug Goes Outside with New Hardware News & Analysis 1/30/2015 2 comments For 10 years, Belgium company Byte Paradigm has operated as a design center for high-end FPGA-based systems as well as an electronics test and debugging service. Under a new name Yugo Systems, the company is about to expand its offering for FPGA debug.
Windows 10: Compact OS Does Holograms News & Analysis 1/21/2015 20 comments Microsoft demonstrated several applications for Windows 10 at a live event today, highlighting the operating system’s cross-device compatibility and ease of use in new areas of technology such as holographics.
Drone Debate to Pose 6 Basic Questions News & Analysis 1/20/2015 43 comments Drones are gaining the public’s growing interest in the new product category and its awareness about pending regulations. The drone panel at CES raised six basic questions you were afraid to ask.
FeFET to Extend Moore's Law News & Analysis 1/15/2015 10 comments The successful prototyping of a ferroelectric gate aims to extend Moore's Law beyond the end of the International Technology Roadmap for Semiconductors (ITRS) circa 2028.
True 3D Chips Harness Nanotubes News & Analysis 12/19/2014 14 comments Stanford University has learned how to stack any number of layers atop a standard CMOS chip by using low-temperature RRAM for memory and carbon nanotube transistors for logic.
Will Qualcomm's China Investment Pay Off? News & Analysis 12/15/2014 8 comments Qualcomm is vulnerable in China, and the company knows it. It remains to be seen, however, how its $150 million PR gambit to invest in China's mobile ecosystem will actually pay off.
Smart Panel Ponders AI's Future News & Analysis 12/9/2014 7 comments Artificial intelligence is well on its way to entering the market by 2025, but it may look different then much of the public has imagined. AI could give systems the ability to talk to each other quickly and simply, or reason and make inferences.
IBM Plugs Partners Into Power News & Analysis 12/8/2014 9 comments IBM's Open Power Foundation is playing significant roles in the Coral supercomputer program, efforts to find new uses for flash memory, and the proliferation of Power processors in China and beyond.
Hot Technologies: Looking Ahead to 2015 News & Analysis 12/3/2014 3 comments EDN and EE Times explore some of the hot technologies in 2014 that will shape technology trends for next year and beyond as engineers bring even more innovative ideas to reality.
Megachips to Launch DSP-Based Sensor Fusion IC News & Analysis 11/25/2014 2 comments The growing sensor-fusion controller market for smartphones and wearable devices is about to meet a new competitor – this time from Japan. Megachips is rolling out a motion engine and sensor hub chip, dubbed Frizz.
Cypress Announces PSoC 4 BLE & PRoC BLE News & Analysis 11/13/2014 14 comments The PSoC 4 BLE combines a 32-bit ARM Cortex-M0 processor with programmable analog fabric, programmable digital fabric, and a Bluetooth low power core, all on the same silicon die.
Intel, Partners Reveal Privacy Survey News & Analysis 10/22/2014 1 comment The average person’s device ecosystem is expanding, exponentially increasing the amount of data being created as well as associated security risks. In response to a recently released survey, Intel and several of its partner organizations recently discussed big data and ways to mollify the more than 80% of users who are uneasy about who, or what, has access to their information.
TI Beefs Up Driver Assist, Digital Cockpit News & Analysis 10/21/2014 9 comments Car OEMs’ growing desire to meet or exceed higher NCAP ratings is driving chip suppliers to develop more sophisticated ADAS SoCs. TI is rolling out two types of solutions: “safety critical” and “informational” ADAS processors.
IC Industry Slowdown: True or False? News & Analysis 10/15/2014 10 comments Did Microchip Technology get ahead of itself by suggesting that its downward revenue forecast was a negative bellwether for the whole semiconductor market? Or is there a macro-economic weakness that bodes ill for the chip industry?
In $2.5B Deal, Qualcomm & CSR Mesh News & Analysis 10/15/2014 15 comments Qualcomm Inc., the world's largest cellphone chip vendor, has agreed to buy CSR for $2.5 billion to strengthen its presence in the Internet of Things market.
Nokia’s Largest Plant to Shut Down in India News & Analysis 10/8/2014 11 comments One of the world's biggest cellphone manufacturing plants, located in Chennai, India, will stop production of mobile phones and down shutters after Nov. 1. Microsoft, its lone customer, has terminated a subcontract agreement.
Will Infineon's Power IC Gambit Pay Off? News & Analysis 10/8/2014 16 comments Against several of the financial community's shibboleths (get out of manufacturing, get rid of fabs), Infineon not only kept its fabs but upgraded them. The company is staking its power-chip future in Dresden fab.
Spansion to Launch 3D-Embedded Automotive MCU News & Analysis 10/1/2014 1 comment Spansion will launch a new microcontroller designed to offer high-performance human machine interface (HMI) for automobile dash and clusters. It comes with HyberBus interface and 2D or 3D graphics cores (or both) embedded inside the MCU.