Movidius to Push AI at Edge of Network News & Analysis 10/24/2016 Post a comment Movidius has partnered with China’s Hikvision to penetrate artificial intelligence deeper into surveillance cameras. Movidius CEO Remi El-Ouazzane says deploying AI at network edge is massive trend.
Achronix Brings eFPGA IP to SoC News & Analysis 10/11/2016 6 comments Achronix has declared that the embedded FPGA — which chip designers can simply drop into their own SoC designs with wire-to-wire connections — is no longer a pipe dream. It’s here and shipping, said Steve Mensor, Achronix executive.
Intel's Stratix 10 FPGAs, SoCs Sampling News & Analysis 10/6/2016 3 comments Devices like Stratix 10 FPGAs will help satisfy the insatiable demand for higher computational capabilities, lower latency, greater system flexibility, and increased power efficiencies
Universal Memristor Models All News & Analysis 10/3/2016 Post a comment University of Massachusetts says it has cut in half the number of components needed to model the human brain for deep learning algorithms with its diffusive memritor.
Chip Market to Go Down, says Future Horizons News & Analysis 9/26/2016 Post a comment Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline for the global semiconductor industry.
2016 IC Industry: Who Grabbed What...So Far News & Analysis 9/2/2016 11 comments Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
IC Industry M&A: Who's Left to Buy? News & Analysis 8/31/2016 4 comments Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
Leti Unveils New 3D Network-on-Chip News & Analysis 7/14/2016 Post a comment Leti’s 3D IC technology fundamentally differs from other 3D chips available on the commercial market. The difference lies in the interposer. Leti’s 3D NoC technology uses a ‘smart interposer,” where active elements are integrated.
ST Grows STM32 MCU Family News & Analysis 7/11/2016 Post a comment STMicroelectronics has introduced a development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers and expanded the series with five product lines comprising a range of package and memory-density options.
Intelligence Agency Sets 3D Challenge News & Analysis 7/11/2016 Post a comment The Intelligence Advanced Research Projects Activity within the Office of the Director of National Intelligence has issued a $100,000 challenge to the programming community to improve upon the automatic generation of 2D-to-3D imagery from satellites.
Chip Sales Remain Stagnant News & Analysis 7/8/2016 3 comments Chip sales posted a slight sequential uptick in May, but were down nearly 8% compared with May 2015, according to the SIA.
Google To Acquire Image Recognition Startup News & Analysis 7/7/2016 Post a comment Google announced a deal to buy image-recognition startup Moodstocks. Created in 2009, the French startup first introduced on-device image recognition in 2012, enabling smartphones to recognize whatever their camera sees.
Google Fellow Talks Neural Nets, Deep Learning News & Analysis 6/28/2016 2 comments We are already living with deep learning and large-scale neural networks, as evidenced by the growing number of applications that rely on computer vision, language understanding, robotics and more. Google Senior Fellow Jeff Dean discusses what he wants most from neural networks and machine learning.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.