AMD Fires Volley in x86 War News & Analysis 2/22/2017 Post a comment AMD will start selling March 2 its first Zen-based x86 processor, Ryzen 7, sporting significant price and performance advantages over CPUs from rival Intel.
Cellular IoT Chip Battle Escalates at MWC News & Analysis 2/22/2017 Post a comment The 3GPP completed the standardization of NB-IoT last June. ARM, Sequans Communications and Altair Semiconductors are all rushing to the cellular IoT market. IHS sees NB-IoT technology in 2017 as “an inflection point in the LPWAN market.”
G’foundries debuts 45nm RFSOI News & Analysis 2/21/2017 8 comments Globalfoundries announced it has development kits for its 45nm RFSOI process, a node geared for uses such as 5G millimeter-wave chips.
Peer-to-peer IBM App Bypasses Carriers News & Analysis 2/17/2017 Post a comment Big Blue has a new mesh network technology for its Weather Channel subsidiary that allows its app to propagate weather and disaster information among all cell phone users even when Internet and cellular networks are down.
IoT Group Sets Broad Agenda News & Analysis 2/15/2017 Post a comment The OpenFog Consortium released a reference architecture it will use to guide efforts on standards and product design for the Internet of Things.
Altair Readies Cellular IoT IC with GPS Inside News & Analysis 2/15/2017 Post a comment Altair is rolling out a highly-integrated cellular IoT chip, designed for easy transformation into an IoT module. Executing on Sony’s vision, it also features a GPS receiver. Altair’s future IoT chip may use FD-SOI.
Security Experts Cite IoT Risks News & Analysis 2/14/2017 4 comments The Internet of Things and critical infrastructure represent two of the biggest security vulnerabilities, said experts at the RSA Conference.
Ex-Leadcore Team Crafts SoC for Xiaomi News & Analysis 2/14/2017 Post a comment Xiaomi’s home-grown custom-designed SoC, crafted by a team originally from China’s Leadcore, will drive its soon-to-be-unveiled Mi5C smartphone. The SoC, based on eight ARM A53 cores, is capable of LTE Cat 6.
Travel Order Stifles Startup Founder News & Analysis 2/13/2017 1 comment The founder of startup Kandou Bus was among unintended victims of President Trump’s travel restrictions that prevented him from receiving an award in person.
Ford to Invest $1 Billion in Argo AI News & Analysis 2/10/2017 Post a comment Ford announced a $1 billion investment over the next five years in a startup called Argo AI, founded by two top AI robotic talents. Argo AI designs brain, Ford builds nerves, skeleton and muscle of autonomous cars.
FASTR Looks to Speed Auto-Tech Alliance News & Analysis 2/9/2017 Post a comment In the era of autonomous cars, there are two hard problems the industry needs to solve: Cybersecurity and software reliability. Which industry groups are actually helping carmakers take a holistic view on both issues?
MediaTek Launches New Helio SoC News & Analysis 2/8/2017 Post a comment MediaTek unveiled the Helio P25, an extension of the company’s high-end mobile processor family. The new SoC combines eight cores with the company’s proprietary image signal processor (ISP) as well as dual-camera features.
V-Nova Plucks Faroudja’s Patent Portfolio News & Analysis 2/8/2017 1 comment The news earlier this week that London-based V-Nova has acquired Faroudja Enterprises’ complete patent portfolio – lock, stock and barrel – speaks volumes about the rapid changes affecting the market in video technologies.
iPhone Share Drops in China for First Time News & Analysis 2/8/2017 Post a comment Apple’s share of China’s smartphone market has dropped for the first time as consumers in the world’s most populous nation show a growing acceptance of locally made handsets, according to market research firm IDC.
TSMC, Samsung Diverge at 7nm News & Analysis 2/8/2017 9 comments TSMC and Samsung described 7nm SRAMs at ISSCC, showing how different the companies’ process offerings will be under than name.
Atomic-scale Electronics Probed News & Analysis 2/7/2017 1 comment IBM's scanning probe thermometry combines a scanning tunneling microscope with a microelectromechanical system to measure the temperature of individual atoms.
Intel Shows 2.5D FPGA at ISSCC News & Analysis 2/7/2017 6 comments Intel described its EMIB packaging in an ISSCC session where AMD showed its Zen 86 fits it’s a smaller die than Intel’s current 14nm chip.
Object-Detection Becomes Wearable News & Analysis 2/6/2017 1 comment Obstacle-detection technology, enabled by sensor fusion, is at the core of autonomous cars. What are the possibilities of applying the same sensor-fusion technology to wearable devices to aid the visually impaired or blind?
Chip Group Sets 2017 Policies News & Analysis 2/2/2017 Post a comment The Semiconductor Industry Association released an eight-point policy agenda for 2017 that may clash with President Trump’s plans on trade and immigration.