LTE IoT: Sequans Claims 'Big Lead' over Rivals News & Analysis 9/6/2016 3 comments With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play? News & Analysis 9/6/2016 Post a comment The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
TSMC, Renesas Partner in 28nm for Robotic Cars News & Analysis 9/5/2016 14 comments Renesas will combine its Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology with TSMC’s 28nm high-K metal gate process to make MCUs for applications such as autonomous vehicle sensor control, coordination of ECUs, fuel-efficient engine management and motor inverter control for EVs.
2016 IC Industry: Who Grabbed What...So Far News & Analysis 9/2/2016 11 comments Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
Renesas, Maxim In Duel for Intersil News & Analysis 8/31/2016 Post a comment The courtship of Intersil Corp. is turning into a duel between Japan’s Renesas Electronics and San Jose, Calif.-based Maxim Integrated Products Inc. Intersil may announce a sale to Renesas as early as next week, Reuters reported.
Sunic System Promises 2,250ppi OLEDs for VR News & Analysis 8/31/2016 Post a comment At the 16th International Meeting on Information Display (IMID 2016) held in South Korea, OLED deposition equipment manufacturer Sunic System unveiled its technical solution for the production of 11K (2,250 ppi) AMOLEDs.
IC Industry M&A: Who's Left to Buy? News & Analysis 8/31/2016 4 comments Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
Z-Wave Specs Released Online News & Analysis 8/31/2016 1 comment Seeking to attract more users and developers, Sigma Designs released key aspects of its Z-Wave home network for the Internet of Things.
Apple Owes $14.5 Billion Back Tax, says Europe News & Analysis 8/30/2016 6 comments The European Commission has ruled that over several years Ireland has granted unjustifiable tax benefits to Apple worth up to €13 billion (about $14.5 billion), which the US computer company must now pay back to the Irish state — plus interest.
ARM Investors Nod to Its Sale to SoftBank News & Analysis 8/30/2016 1 comment Shareholders of ARM overwhelmingly approved its sale to SoftBank on Tuesday. The move officially put an end to the independence of ARM, a wildly successful processor IP core company born 31 years ago in Cambridge, the U.K.
Indoor Nav Leverages LTE News & Analysis 8/30/2016 5 comments NextNav LLC is selling precision timing services from its atomic clock equipped navigation towers to all the major carriers, after which they will be able to offer super-accurate navigation services to every smartphone user worldwide.
Intel Debuts 14nm+ Processors News & Analysis 8/30/2016 3 comments Intel announced its Kaby Lake PC chips using an enhanced 14nm process and media engine to deliver a 12% overall boost and improved 4K video.
3D Composite Promises High-temp Energy Storage for EVs News & Analysis 8/30/2016 1 comment Researchers from Penn State University have found a way to prevent the dielectric breakdown and leakage of high-density supercapacitors as they are submitted to the high temperatures found in hybrid and electric vehicles, while increasing their energy density.
SPD Codes Continue to Find Role News & Analysis 8/26/2016 Post a comment JEDEC's JC-45 Committee has approved the 2016 annual release of codes for the SPD for DDR4/DDR4E and for LPDDR3/LPDDR4. What does it mean for device designers?
Auto Cybersecurity Dissected: Who, Where & What News & Analysis 8/25/2016 3 comments The automotive industry’s change in perception on cybersecurity, compared to just a year ago, is seismic. We attempt to break down the layers of automotive cybersecurity. We identify where such software will reside, its functions and likely evolution.
Power9 Opens IBM to Partners News & Analysis 8/24/2016 3 comments IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86 News & Analysis 8/24/2016 Post a comment AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
SiC Muscles Rohm into Auto Biz News & Analysis 8/24/2016 Post a comment Rohm, a Japanese component vendor whose business could be harmed by the steady decline in market share among leading Japanese CE vendors, has good reason to sweat its own prospects. But Rohm says it has a clear growth strategy.
Renesas Sets Sights on Intersil News & Analysis 8/23/2016 Post a comment Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
ARM Reaches for Supercomputers News & Analysis 8/22/2016 1 comment New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
‘Interscatter’ Tech Lets Implants Talk Wi-Fi News & Analysis 8/19/2016 Post a comment University of Washington researchers have developed what they call “interscatter communication” technology that backscatters (or reflects) existing signals like Bluetooth in the air, transforming wireless transmissions from one technology to another.
Rivals Chasing Velodyne in Lidar Race News & Analysis 8/18/2016 6 comments Velodyne unveiled a combined $150 million investment from co-investors Ford Motor Company and China’s Baidu. A growing number of startups are now chasing Velodyne, the most experienced and best funded lidar tech company.
Watson for the Masses News & Analysis 8/18/2016 1 comment The Columbus-Collaboratory has integrated IBM's Watson into the R programming language with its CognizeR.
E-Retailers Automate Fulfillment News & Analysis 8/17/2016 5 comments The co-robot company InVia Robotics Inc. has invented robots-as-a-service whereby warehouses pay a fee, per co-robot, to use its GrabIt and TransIt co-robots to pick items from the shelves and deliver them to the mailroom.
Was DOS copied from CP/M? News & Analysis 8/17/2016 5 comments For decades, a rumor has persisted that DOS was illegally copied from CP/M and that the fortune accumulated by Bill Gates rightfully belonged to Gary Kildall.
Toyota Partners with Taxi for Automated Driving News & Analysis 8/17/2016 Post a comment Toyota Motor Corp and the Japan Federation of Hire-Taxi Associations have entered into a memorandum of understanding for the development of autonomous driving technologies, aiming to introduce a new vehicle targeted at taxi operators by 2017.
Osram to Focus on Semiconductors Again News & Analysis 8/17/2016 Post a comment Newly named Ledvance (since July 2016), Osram's general lighting lamps business is to be acquired by a Chinese consortium consisting of the strategic investor IDG, the Chinese lighting company MLS and the financial investor Yiwu, for just over €400 million.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.