Breaking News
News Analysis
<<   <   Page 2 / 2
Intel Spins out Security Group
News & Analysis  
9/7/2016   Post a comment
Intel will spin out its security group into an independent company renamed McAfee, selling 51% of it to a private equity firm for $3.1 billion.
Apple Debuts Three Custom Chips
News & Analysis  
9/7/2016   16 comments
Apple described three new chips powering its iPhone 7, Apple Watch 2 and a new family of wireless earbuds and headphones.
LPWA Nets Call on Cellular Partners
News & Analysis  
9/7/2016   Post a comment
Two low power wide area network companies struck deals with makers of cellular modules to expand their links in the Internet of Things.
LTE IoT: Sequans Claims 'Big Lead' over Rivals
News & Analysis  
9/6/2016   3 comments
With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play?
News & Analysis  
9/6/2016   Post a comment
The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
TSMC, Renesas Partner in 28nm for Robotic Cars
News & Analysis  
9/5/2016   14 comments
Renesas will combine its Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology with TSMC’s 28nm high-K metal gate process to make MCUs for applications such as autonomous vehicle sensor control, coordination of ECUs, fuel-efficient engine management and motor inverter control for EVs.
2016 IC Industry: Who Grabbed What...So Far
News & Analysis  
9/2/2016   11 comments
Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
iPhone7 Boosts Broadcom Results
News & Analysis  
9/1/2016   1 comment
Broadcom predicted slightly better than expected results, largely due to increasing content in Apple’s iPhone 7.
Fujitsu Is Licensee of Nantero's Carbon-Nanotube RAM
News & Analysis  
9/1/2016   16 comments
Fabless chip company Fujitsu Semiconductor and foundry Mie Fujitsu Semiconductor have both announced that they are licensees of carbon-nanotube non-volatile memory technology from Nantero Inc. (Woburn, Mass.).
Non-Volatile Memories Morph Industry Collaboration
News & Analysis  
9/1/2016   Post a comment
Emerging technologies benefit from early interaction with customers, particularly new paradigms such as NVMe.
Facebook Feeds Open Software
News & Analysis  
9/1/2016   Post a comment
Facebook described open source projects in machine learning, data compression and video stabilization at its annual At Scale event.
Renesas, Maxim In Duel for Intersil
News & Analysis  
8/31/2016   Post a comment
The courtship of Intersil Corp. is turning into a duel between Japan’s Renesas Electronics and San Jose, Calif.-based Maxim Integrated Products Inc. Intersil may announce a sale to Renesas as early as next week, Reuters reported.
Sunic System Promises 2,250ppi OLEDs for VR
News & Analysis  
8/31/2016   Post a comment
At the 16th International Meeting on Information Display (IMID 2016) held in South Korea, OLED deposition equipment manufacturer Sunic System unveiled its technical solution for the production of 11K (2,250 ppi) AMOLEDs.
IC Industry M&A: Who's Left to Buy?
News & Analysis  
8/31/2016   4 comments
Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
Z-Wave Specs Released Online
News & Analysis  
8/31/2016   1 comment
Seeking to attract more users and developers, Sigma Designs released key aspects of its Z-Wave home network for the Internet of Things.
Embeddable FPGA IP Saves Re-Spins in Chip Design
News & Analysis  
8/31/2016   Post a comment
Embeddable FPGA blocks give chip designs the flexibility needed to weather last-minute changes.
Apple Owes $14.5 Billion Back Tax, says Europe
News & Analysis  
8/30/2016   6 comments
The European Commission has ruled that over several years Ireland has granted unjustifiable tax benefits to Apple worth up to €13 billion (about $14.5 billion), which the US computer company must now pay back to the Irish state — plus interest.
ARM Investors Nod to Its Sale to SoftBank
News & Analysis  
8/30/2016   1 comment
Shareholders of ARM overwhelmingly approved its sale to SoftBank on Tuesday. The move officially put an end to the independence of ARM, a wildly successful processor IP core company born 31 years ago in Cambridge, the U.K.
Indoor Nav Leverages LTE
News & Analysis  
8/30/2016   5 comments
NextNav LLC is selling precision timing services from its atomic clock equipped navigation towers to all the major carriers, after which they will be able to offer super-accurate navigation services to every smartphone user worldwide.
Intel Debuts 14nm+ Processors
News & Analysis  
8/30/2016   3 comments
Intel announced its Kaby Lake PC chips using an enhanced 14nm process and media engine to deliver a 12% overall boost and improved 4K video.
ON Semi to Sell Automotive IGBT Biz to Littelfuse
News & Analysis  
8/30/2016   Post a comment
ON Semiconductor (Phoenix, AZ) has agreed to sell its ignition IGBT power device business to Littelfuse (Chicago, IL) for $104 million to allow its acquisition of Fairchild Semiconductor to go ahead.
3D Composite Promises High-temp Energy Storage for EVs
News & Analysis  
8/30/2016   1 comment
Researchers from Penn State University have found a way to prevent the dielectric breakdown and leakage of high-density supercapacitors as they are submitted to the high temperatures found in hybrid and electric vehicles, while increasing their energy density.
Ford / MIT Collaborate on Future
News & Analysis  
8/29/2016   6 comments
Ford and MIT collaborate to mine Big Data from smartphones to perform urban planning.
Alliance Seeks to Boost Indoor LTE
News & Analysis  
8/29/2016   Post a comment
The problem of cellular coverage indoors is being tackled by a new industry organization.
SPD Codes Continue to Find Role
News & Analysis  
8/26/2016   Post a comment
JEDEC's JC-45 Committee has approved the 2016 annual release of codes for the SPD for DDR4/DDR4E and for LPDDR3/LPDDR4. What does it mean for device designers?
Würth Acquires Amber Wireless
News & Analysis  
8/26/2016   Post a comment
Broad component supplier Würth Elektronik eiSos GmbH & Co. KG has acquired fellow German company Amber Wireless GmbH for an undisclosed sum.
Auto Cybersecurity Dissected: Who, Where & What
News & Analysis  
8/25/2016   3 comments
The automotive industry’s change in perception on cybersecurity, compared to just a year ago, is seismic. We attempt to break down the layers of automotive cybersecurity. We identify where such software will reside, its functions and likely evolution.
End-to-End IoT Security Simplified
News & Analysis  
8/25/2016   6 comments
Forget key generation and security audits, Microchip's new product relieves OEMs of such burdens.
Power9 Opens IBM to Partners
News & Analysis  
8/24/2016   3 comments
IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86
News & Analysis  
8/24/2016   Post a comment
AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
SiC Muscles Rohm into Auto Biz
News & Analysis  
8/24/2016   Post a comment
Rohm, a Japanese component vendor whose business could be harmed by the steady decline in market share among leading Japanese CE vendors, has good reason to sweat its own prospects. But Rohm says it has a clear growth strategy.
Advances Get a Grip on Single Photons & Molecules
News & Analysis  
8/23/2016   9 comments
Researchers are on the road to creating a single-photon emitter and a single-molecule detector.
Microsoft Gives Peek at HoloLens Chip
News & Analysis  
8/23/2016   4 comments
The HoloLens processing unit uses 24 Tensilica DSPs and an assortment of accelerators to deliver a trillion pixel-operations per second, Microsoft disclosed.
Renesas Sets Sights on Intersil
News & Analysis  
8/23/2016   Post a comment
Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
ARM Reaches for Supercomputers
News & Analysis  
8/22/2016   1 comment
New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield
News & Analysis  
8/22/2016   1 comment
Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
Automotive Lidar Startup Raises Series A
News & Analysis  
8/19/2016   Post a comment
Innoviz Technologies Ltd. (Kfar Saba, Israel), a 2016 startup developing lidar sensors for autonomous vehicles, has raised $9 million in a Series A financing round.
Uber Takes Over Otto, Partners with Volvo for Autonomous Driving
News & Analysis  
8/19/2016   Post a comment
On the company's webpage, Uber's CEO and Co-Founder Travis Kalanick officially announced the acquisition of Otto, a fresh startup driven by high profile engineers who developed a kit that allows big-rig trucks to drive autonomously on highways.
‘Interscatter’ Tech Lets Implants Talk Wi-Fi
News & Analysis  
8/19/2016   Post a comment
University of Washington researchers have developed what they call “interscatter communication” technology that backscatters (or reflects) existing signals like Bluetooth in the air, transforming wireless transmissions from one technology to another.
Intel to Accelerate Altera, Says CEO
News & Analysis  
8/18/2016   8 comments
Intel will support Altera's base FPGA business including use of ARM cores and long lifetime products, said Intel's CEO.
Rivals Chasing Velodyne in Lidar Race
News & Analysis  
8/18/2016   6 comments
Velodyne unveiled a combined $150 million investment from co-investors Ford Motor Company and China’s Baidu. A growing number of startups are now chasing Velodyne, the most experienced and best funded lidar tech company.
Watson for the Masses
News & Analysis  
8/18/2016   1 comment
The Columbus-Collaboratory has integrated IBM's Watson into the R programming language with its CognizeR.
Programmable Analog Coprocessor Takes Many Sensor Inputs
Product News  
8/18/2016   Post a comment
Cypress Semiconductor's latest PSoC programmable system-on-chip, the PSoC Analog Coprocessor, simplifies the design of next-generation industrial, home appliance and consumer systems that require multiple sensors.
E-Retailers Automate Fulfillment
News & Analysis  
8/17/2016   5 comments
The co-robot company InVia Robotics Inc. has invented robots-as-a-service whereby warehouses pay a fee, per co-robot, to use its GrabIt and TransIt co-robots to pick items from the shelves and deliver them to the mailroom.
USB 3.0 FPGA Module Sustains 360MB/s Data Transfers
News & Analysis  
8/17/2016   2 comments
Orange Tree Technologies has released the ZestSC3, an FPGA module built around Xilinx' Artix-7 user-programmable FPGA and a very high performance SuperSpeed USB 3.0 interface.
Was DOS copied from CP/M?
News & Analysis  
8/17/2016   5 comments
For decades, a rumor has persisted that DOS was illegally copied from CP/M and that the fortune accumulated by Bill Gates rightfully belonged to Gary Kildall.
Toyota Partners with Taxi for Automated Driving
News & Analysis  
8/17/2016   Post a comment
Toyota Motor Corp and the Japan Federation of Hire-Taxi Associations have entered into a memorandum of understanding for the development of autonomous driving technologies, aiming to introduce a new vehicle targeted at taxi operators by 2017.
Osram to Focus on Semiconductors Again
News & Analysis  
8/17/2016   Post a comment
Newly named Ledvance (since July 2016), Osram's general lighting lamps business is to be acquired by a Chinese consortium consisting of the strategic investor IDG, the Chinese lighting company MLS and the financial investor Yiwu, for just over €400 million.
Wintel Reunites in Mixed Reality
News & Analysis  
8/16/2016   Post a comment
Microsoft and Intel will release a specification in December for headsets and PCs running Windows 10 that support virtual and augmented reality.
Intel Grabs ARM for 10nm Foundry
News & Analysis  
8/16/2016   18 comments
Intel revealed first details of its 10nm process and said it will start making ARM-based mobilde SoCs for Spreadtrum and LG Electronics.
<<   <   Page 2 / 2


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Most Recent Comments
Like Us on Facebook
Special Video Section
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...