Molex high-density SFP+ interconnects support 10G Product News 1/31/2007 Post a comment Molex announced the development of the SFP+ Interconnect System. This complete solution meets the next generation Small Form Factor (SFF) 8431 specification and reaches 10 Gbps speeds using the same port space as a standard SFP system.
Energy-efficient Ethernet study group formed News & Analysis 1/31/2007 Post a comment The Ethernet Alliance, an industry group dedicated to the continued success and expansion of Ethernet technology, today announced that the IEEE 802.3 working group recently voted to support the formation of an Energy-Efficient Ethernet (EEE) Study Group.
A Global Industry... In Transition News & Analysis 1/31/2007 Post a comment If you lead, manage or support a customer contact center, you are part of a worldwide profession... one that is evolving daily and one that's led us to create a new resource for you: The Global Report on Call
Celestica's 4Q revenue and losses grow News & Analysis 1/31/2007 Post a comment A sudden downturn in demand from telecom customers on top of an inventory pileup at its Mexico faclity left Celestica Inc. with a net loss for both the fourth quarter and fiscal year 2006.
Dual current sense amplifiers deliver fast response, precision Product News 1/31/2007 Post a comment Linear's LTC6103 contains two independent, high side current sense amplifiers that feature input bias current of 170-nA max and maximum input offset voltage of 450-µV. This precision performance allows the part to resolve very small currents and still operate over a large dynamic range.
GloNav taps Jazz to produce low-power GPS RFIC Product News 1/31/2007 Post a comment Using Jazz's 0.18-micron SiGe BiCMOS process, GloNav has developed a low-power L1 GPS RFIC that operates from a single 1.8-V supply to consume just 15-mW of power, a key requirement for today's cellular handsets, portable consumer devices and battery-operated GPS devices.
Xilinx CEO says IC models under pressure News & Analysis 1/31/2007 Post a comment The semiconductor industry is projected to experience moderate growth in the near term -- with only three IC-manufacturing business models evolving over time, warned Wim Roelandts, president, chairman and chief executive of Xilinx Inc.
Converge opens Tokyo office News & Analysis 1/31/2007 Post a comment Converge announced the opening of its first Japanese office, located in Tokyo. The independent components distributor is rapidly expanding its global presence, having opened sites in Europe and Israel in December.
WUSA-TV brings HD to the Web Product News 1/31/2007 Post a comment Digital Rapids' format-agile StreamZHD media encoding and streaming system was used by Washington, D.C. CBS affiliate WUSA-TV delivered the President's January 23 State of the Union Address live on the Web in high definition.
DRAM market outgrows Qimonda News & Analysis 1/31/2007 Post a comment ; Recent figures from market watcher DRAM Exchange suggest that for the global DRAM market the supply will remain tight. German European vendors - i.e. Qimonda slightly lost market share.
Hynix 4Q sales up on strong DRAM demand News & Analysis 1/31/2007 Post a comment South Korea's Hynix Semiconductor Inc. posted a fourth quarter 2006 net profit of 1.04 trillion won (about $1.1 billion) on consolidated revenues of 2.61 trillion won (about $2.8 billion), the company said Wednesday (Jan. 31).
Sony Ericsson to make mobile handsets in India News & Analysis 1/31/2007 Post a comment Sony Ericsson is joining the growing list of mobile phone suppliers that will make or have made for them handsets in India, perhaps the fastest growing market for mobile communications. The company will start making handsets in Chennai through a deal with its global CEM partners, Flextronics and Foxconn.
Acquisition creates industrial Ethernet giant News & Analysis 1/31/2007 Post a comment U.S. based data cabling and signaling devices manufacturer Belden CDT Inc. has bought German industrial Ethernet and infrastructure specialist Hirschmann Automation and Control GmbH (HAC) for 200 million ($260 million).
EDA startup Jasper settles in France News & Analysis 1/31/2007 Post a comment Seeking to expand its presence in Europe, Jasper Design Automation, a privately-held provider of high-level formal verification solutions, announced it has opened new sales and support headquarters for Europe and the Middle East in Pornichet, near Nantes (France).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.