Sun, HP square off over real-time Java spec News & Analysis 10/31/1998 Post a comment The battle between Hewlett-Packard Co. and Sun Microsystems Inc. for control of real-time Java will break into open warfare next week at the Embedded Systems Conference. The fracas comes amid an important technical leap forward, with demonstrations of real-time Java applications running on multiple CPUs and operating systems scheduled for the show.
China has designs on local IP prowess News & Analysis 10/31/1998 Post a comment The essential underpinnings of a world-class electronics industry are emerging in China, driven by a huge consumer market and an insatiable hunger for technical know-how. Market-oriented government leaders and a new cadre of technocrats here hope to forge an indigenous design capability that would complement the nation's growing consumer-electronics industry and allow it to create and hold the intellectual property that is the coin of the realm in the Information Age.
IP issues complicate joint ventures in China News & Analysis 10/31/1998 Post a comment Between the lines of China's growing list of joint ventures with foreign high-tech partners is a growing unease about how the inevitable intellectual-property issues will be sorted out. Many foreign executives here and in Japan said few, if any, IP issues have been resolved with their Chinese partners. At the same time, most of the joint ventures are proving expensive, and many are unprofitable.
Synopsys launches $40M venture fund News & Analysis 10/30/1998 Post a comment In an effort to accelerate system-on-a-chip technology, Synopsys Inc. has announced a venture capital fund aimed at emerging intellectual property (IP), EDA, and design services providers.
VLSI will let cache cores be customized News & Analysis 10/30/1998 Post a comment Indicating a trend toward soft cores in the system-on-a-chip era, VLSI Technology Inc. (San Jose, Calif.) plans to give customers the ability to customize cache memory for ARM microprocessor cores.
BGA packaging comes to logic devices News & Analysis 10/30/1998 Post a comment The first logic devices to use ball-grid-array packaging will appear before the end of the year, it was announced here today. Three chip makers--Texas Instruments Inc., Integrated Device Technology Inc., and Philips Semiconductors--have jointly decided to source several logic devices with the same functionality and pin-outs in low-profile, fine-pitch ball grid array (LFBGA) packaging.
Tower to partner for 0.25-micron technology News & Analysis 10/30/1998 Post a comment Tower Semiconductor Ltd. is currently in discussions with potential partners to obtain access to 0.25-micron semiconductor manufacturing capabilities, an executive said here today. The move will allow the Israel-based foundry to gain ground, as it is one of the last foundries to offer production services at that level, while some of the major foundries are expected to roll out 0.18-micron capabilities in the near-future.
Mitsubishi restructures electronics operations News & Analysis 10/30/1998 Post a comment In what it described as a nationwide housekeeping effort, Mitsubishi Electric Corp. is flattening out its overseas operations by dismantling its U.S. holding company and consolidating several electronics subsidiaries.
Silicon Valley wealthy called stingy givers News & Analysis 10/29/1998 Post a comment Is the home of the nation's most expensive homes, newly optioned technical millionaires and six-figure engineering salaries a place for skinflints when it comes to philanthropy? Are the Valley's tax-deductible donations of hardware and software selfishly motivated to get engineering students working with a company's products and possibly breed a few more engineers?
EE charts tough ASIC design course News & Analysis 10/29/1998 Post a comment In India, where people don't take for granted things like public utilities, Ravindra Kumar has enough to do designing the electronic circuits that will help keep the country's water clean and its electrical power running uninterrupted. But as the indefatigable assistant director of India's Electronics Research and Development Center, he also makes the time to woo foundry partners seeking to offer design services, as well as foreign manufacturers that might not otherwise have considered using ASI
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.