Libya appoints electrical engineer interim PM News & Analysis 10/31/2011 13 comments An electronics engineer by the name of Abdel Rahim al-Kib has been appointed Libya’s interim Prime Minister by the country’s National Transitional Council, just a week and a half after former Libyan leader Muammar Gaddafi was killed by rebels October 20, effectively liberating the country.
Thailand floods take toll on PC makers News & Analysis 10/31/2011 3 comments The ongoing floods in Thailand have created shortages in the hard disk drive (HDD) market which are beginning to trickle down and affect both the pricing and availability of PCs according to industry wide reports.
TI debuts $5 Sitara AM335x ARM processors Product News 10/31/2011 3 comments With pricing starting as low as $5, Texas Instruments has just introduced its new family of Sitara AM335x microprocessors targeting applications such as 3D interactive touch screens, high resolution displays and wireless connectivity.
Global chip sales show September growth News & Analysis 10/31/2011 Post a comment A Japanese recovery and continued demand for mobile personal electronics helped the three-month average of worldwide sales of semiconductors in September reach $25.76 billion, according to the Semiconductor Industry Association quoting figures compiled by World Semiconductor Trade Statistics organization.
EUV litho source is much brighter, says Ushio News & Analysis 10/31/2011 6 comments Xtreme Technologies GmbH (Aachen, Germany) has reported a doubling of the brightness of its laser-assisted discharge plasma (LDP) illumination source for extreme ultraviolet (EUV) lithography with more progress to come.
GHS and Silex build secure Wi-Fi platform Product News 10/30/2011 Post a comment Silex's latest Qualcomm Atheros Wi-Fi radio modules and security supplicant software offerings are now integrated and available for Green Hills Software's INTEGRITY real-time operating system – the foundation for its Platform for Secure Wireless Devices.
HSPA+ module for M2M applications is 2mm thin Product News 10/30/2011 Post a comment Cinterion has released what the company claims to be the world's thinnest HSPA+ M2M module, featuring flexible surface mounting technology and enabling secure, high-speed voice and data communications on global 2G and 3G cellular networks.
Daimler presents comprehensively integrated infotainment system News & Analysis 10/30/2011 Post a comment Several weeks after the first presentation of its futuristic F125 research car, Daimler has provided details on the car's infotainment system. It embraces elements such as cloud computing, seamless media integration, many apps as well as the new MirrorLink open infotainment interface.
NXP shows smart home control using 6LoWPAN News & Analysis 10/30/2011 1 comment At an IPSO Alliance event on the “Internet of Things”, NXP Semiconductors presented a smart home control demo using JenNet-IP – its ultra-low-power wireless connectivity network layer software based on 6LoWPAN.
Downturn drags on chip equipment sales News & Analysis 10/29/2011 6 comments As expected, semiconductor equipment suppliers KLA-Tencor, Novellus Systems and Teradyne reported declines in sales and they expect more of the same in the fourth quarter.
IHS: MStar still leads DTV SoC market News & Analysis 10/28/2011 Post a comment Taiwanese fabless chip vendors MStar Semiconductor and MediaTek continued to dominate the digital TV SoC market in the first half of 2011, holding market shares of 39 percent and 12 percent, according to market research firm IHS.
UN stresses ICTs role in energy sustainability News & Analysis 10/28/2011 8 comments The head of the UN’s Global Compact Lead Ole Lund Hansen has stressed the importance of sustainability, while calling on ICT companies to align strategies in order to promote better energy efficiency.
Imec launces organic PV project with partners News & Analysis 10/28/2011 3 comments Europe’s Imec research consortium (Leuven, Belgium) and 16 project partners have launched the European FP7 project X10D to bring organic photovoltaic technologies as competitive commercial alternatives to thin-film photovoltaic technologies.
TSMC reports Q3 sales decline News & Analysis 10/27/2011 2 comments TSMC reported a third quarter sales decline and said it expects a further decline in the fourth quarter. But TSMC said it expects its capacity utilization to improve slightly in the fourth quarter.
ARM unveils 64-bit architecture News & Analysis 10/27/2011 41 comments ARM Holdings has announced that its next-gen ARMv8 architecture will include the firm’s first 64-bit instruction set, pushing ARM-based processors into new segments of the consumer and enterprise markets.
Avago ACPL-K4xT optocouplers Product News 10/27/2011 2 comments Optimized for use in onboard chargers and other high-voltage systems in hybrid and electric vehicles, Avago's latest optocouplers are qualified to AEC-Q100 Grade 1 stress test requirements for automotive applications.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.