Fairchild files patent lawsuit against Infineon News & Analysis 11/29/2008 Post a comment Fairchild Semiconductor (San Jose, Calif.) is suing Infineon Technologies AG in the U.S. District Courts of Maine and Delaware, claiming some of the German group's CoolMOS and OptiMOS power management devices, as well as its Infineon IGBT and CanPak parts, infringe one or more of eight Fairchild patents.
UCLA develops higher efficiency polymer solar cells News & Analysis 11/28/2008 Post a comment Researchers at the UCLA Henry Samueli School of Engineering and Applied Science have shown the possibility of creating a new polymer for use in solar cells that exhibits greater sunlight absorption and conversion capabilities than existing polymers.
Melexis does not foresee large-scale job cuts News & Analysis 11/28/2008 Post a comment Automotive chip manufacturer Melexis Microelectronic Integrated Systems NV (Ieper, Belgium) does not expect to make massive head-count reductions despite forecasting that its Q4 sales will fall between 25 and 30 percent compared with Q3.
Stühlerücken bei Siemens MedTech News & Analysis 11/28/2008 Post a comment Siemens Healthcare bekommt einen neuen Chef: Der Chief Technology Officer Hermann Requardt übernimmt die Position des CEO für den Bereich Medizintechnik. Seine Funktionen als CTO und Leiter der Zentralabteilung Corporate Technology wird er weiter ausfüllen.
ST, INRIA team on embedded systems News & Analysis 11/28/2008 Post a comment STMicroelectronics NV and INRIA, the French national institute for research in computer science and control, have signed a partnership agreement for next-generation embedded systems.
Nujira touts PA efficiency advance in handsets News & Analysis 11/28/2008 Post a comment Power amplifier specialist Nujira (Cambridge, England) is claiming PAs in handsets that use its High Accuracy Tracking technology are twice as efficient during HSUPA transmissions, and 1.5 times as efficient during W-CDMA transmissions, than the same PA with a standard constant voltage (CV) supply as widely deployed in the industry today.
ST cuts Q4 revenue growth forecasts News & Analysis 11/28/2008 Post a comment European chipmaker STMicroelectronics NV has significantly downgraded its revenue growth outlook for the fourth quarter of 2008 and now expects revenues to be between $2.2 billion and $2.35 billion.
Continental develops car-to-car ice warning system News & Analysis 11/27/2008 Post a comment Continental has a system under development that includes car-to-car communications for clear ice warning systems. Such as system would be superior to current temperature sensors since drivers can be warned ahead of dangerous situations, the company says.
Nanotube switching effect discovered News & Analysis 11/27/2008 Post a comment Scientists from the Karlsruhe Institute of Technology (KIT) (Karlsruhe, Germany) have unexpectedly discovered a physical effect that potentially can be used to develop novel electronic components. By means of the effect, the conductance of the nanotubes can be controlled.
German processor firm alleges Xilinx, Avnet infringe patents News & Analysis 11/27/2008 Post a comment Pact XPP Technologies AG, a developer of a reconfigurable highly parallel processor architecture, has filed a law suit against FPGA vendor Xilinx Inc. and distributor Avnet Inc. in the Eastern District court of Texas, claiming patent infringement. The case was filed Dec 28, 2007.
Improved interface between CANoe and Matlab Product News 11/27/2008 Post a comment The new 2.1 version of the CANoe/MATLAB Interface simplifies data exchange between the two standard tools considerably, and MATLAB models may be parameterized directly from CANoe. Vector is supplying the interface free-of-charge, and it is part of every CANoe license effective immediately.
Alcatel-Lucent CFO quits News & Analysis 11/27/2008 Post a comment Two months after top executive changes, Alcatel-Lucent announced that Hubert de Pesquidoux, chief financial officer and president of Enterprise business, has decided to leave the company to pursue other opportunities. Paul Tufano, an executive in international finance, will succeed him.
Global chip sales seen tumbling in October News & Analysis 11/27/2008 Post a comment The three-month moving average of global chip sales is expected to come in at $22.8 billion for October, down 1 percent on the $23 billion achieved in September, according to Bruce Diesen, analyst at Carnegie ASA in Oslo, Norway.
Bilan énergétique concluant pour Soitec en 2007 News & Analysis 11/27/2008 Post a comment Dix huit mois après le lancement de son plan d'économies d'énergie, Soitec SA annonce des résultats satisfaisants. Le spécialiste du silicium sur isolant aurait évité le rejet de plus de 218 tonnes de CO2 dans l'atmosphère sur l'année 2007.
ERG : EL inverters offer plug-and-play solutions Product News 11/27/2008 Post a comment The family of Smart Force dc-ac EL inverters from Endicott Research Group provides a wide range of standard and custom solutions for display and device designers who need to power electroluminescent (EL) backlit LCDs or devices where EL is used for accent and decorative lighting.
AMD spin-off Foundry Co. sees no long-term downturn News & Analysis 11/27/2008 Post a comment AMD's manufacturing arm which is heading for a spin-off to form a foundry services provider, regards the current downturn as a good anti-cyclical investment opportunity. Nevertheless, the company is aware of the challenges they are approaching, said two top managers of the company.
3-D memristor chip debuts News & Analysis 11/26/2008 Post a comment Memristors technology got a boost recently from Hewlett-Packard Labs, which described the first 3-D memristor chip at a conference in Berkeley, Calif.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.