Exclusive: Lenovo to design own chips News & Analysis 3/29/2013 21 comments While beefing up its senior management team to prepare itself to become a leading consumer electronics vendor, Lenovo is growing its IC design team to about 100 engineers by mid this year.
FinFET race holds promises, perils News & Analysis 3/27/2013 9 comments Rising capacitance is one of the challenges ahead in realizing the promises of the first process node to use 3-D transistors, said a group of experts.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.