Startup to field next-generation design language News & Analysis 5/31/1999 Post a comment Launching what appears to be the strongest private attempt in years to create a new high-level design language, Co-Design Automation Inc. will announce its Superlog language this week. The system-level language combines the best features of Verilog and C/C++ while allowing interfaces and translations to and from C/C++, Verilog and VHDL, the company said.
Products, processes comprise Lucent comm assault News & Analysis 5/31/1999 Post a comment Lucent Technologies is ramping up new process technologies in CMOS and silicon germanium, as part of a continuing focus on single-chip design methods that it plans to apply across a range of communications devices. Offering a look ahead at the road map, Lucent executives last week disclosed the company is in the early stages of production with its first chips to be built in a low-cost SiGe process. The company also tipped news of a number of integrated devices planned for the next year.
Cost crunch creates push for single-chip drive News & Analysis 5/31/1999 Post a comment Intensifying cost pressures have spurred manufacturers of hard-disk drives to step up the push for more highly integrated electronics, turning up the heat in the race toward system-on-chip ICs. Yet the various drive manufacturers and their component suppliers are taking surprisingly different routes toward the single-chip system.
Xilinx Unveils Xilinx Online Program News & Analysis 5/28/1999 Post a comment San Jose--May 25, 1999--In conjunction with a newreconfigurable demonstration and customer endorsements Xilinx, Inc.(San Jose) announced the Xilinx Online program to enable,identify, ...
Intel ties upcoming PC-on-a-chip to Rambus News & Analysis 5/28/1999 Post a comment Intel Corp. will take a crack at putting a PC-on-a-chip late next year. The so-called Timna processor, manufactured with 0.18-micron technology, includes a Pentium II-class processor, a graphics controller, 128 kbytes of L2 cache and the item that's raising the most eyebrows a Direct Rambus memory controller.
NEC invests to beef up 128-Mbit DRAM production News & Analysis 5/28/1999 Post a comment Reaffirming its commitment to DRAMs and leading-edge semiconductor process technology, NEC Corp. will up its investments in two domestic memory fabs to increase production of 128-Mbit synchronous and Rambus DRAMs. Moreover, the company will pump more money into a soon-to-be completed 0.18-micron logic fab with the expectation that it will be finished ahead of schedule.
Go for the Masters News & Analysis 5/28/1999 Post a comment I will be graduating this May with BSEE and have some analog background. I like to work on mixed-signal IC design but have found that most of the semiconductor companies want someone with an MS degree and experience.
Starting as a grunt News & Analysis 5/28/1999 Post a comment I recently started my first full-time job after receiving a MSEE in VLSI design. All my previous engineering experience (summer jobs) had been in academic settings, so this is my first taste of "real world" engineering.
Software's replacing everything News & Analysis 5/28/1999 Post a comment I'm currently a technician working in an R&D group, writing some test code, debugging, simple fixture designs, etc. I'm working on a degree as well and have been on the EE path.
Agere proposes network processor standards group News & Analysis 5/28/1999 Post a comment Agere Inc. has sent a proposal to many of its network-processor competitors, as well as to communication industry OEMs and network software developers, proposing the creation of a Network Processor Standards Organization (NPSO). The company has registered a domain name, www.npstandards.org, and wants to have a founding meeting in or near San Jose, Calif. in July or August.
NEC looks to lead long-haul 1394 standards efforts News & Analysis 5/28/1999 Post a comment Hoping to influence the standards process for long-distance IEEE 1394 networks, NEC Corp. has introduced a physical-layer chip and has prototyped a bridge device that it says will enable 1-km networks. The company will be at the 1394 Developer's Conference in San Jose, Calif., next week to show a prototype wiring concentrator based on a demonstration board that houses the new devices.
Methode buys Polycore, extends transceiver module line News & Analysis 5/28/1999 Post a comment In a move that adds lower-speed transceiver modules to its existing gigabit-speed optoelectronic product line, Methode Electronics Inc. has acquired Polycore Technologies Inc., a small supplier of highly integrated datacommunications modules for LAN equipment.
Motorola readies $40 million expansion at Arizona fab News & Analysis 5/28/1999 Post a comment Motorola Inc. is ready to start the next expansion phase of its MOS-12 wafer fab here, the company said Thursday (May 27). The $40 million phase will complete the interior of the east portion of the fab building, add infrastructure to the plant, and install several process tools. It is part of a $1.1 billion project announced in October 1997.
Tumultuous year keeps Tellabs hopping News & Analysis 5/27/1999 Post a comment Over the last 18 months, Tellabs Operations Inc. has been a microcosm of the changes many large OEMs have dealt with over the last year. The maker of communication-infrastructure equipment has dealt with an acquisition, both buoyancy and battering in the stock market, an increased reliance on remote design sites, and the impact of globalization.
Alliances target voice over DSL News & Analysis 5/27/1999 Post a comment Burgeoning interest in voice over digital subscriber line (VoDSL) as a special case of voice over Internet Protocol was evident this week, as two separate companies created partnerships intended to help drive common architectures that will channel voice over DSL systems from customer premises to telco central offices. Announcement of the PacketLoop Partners Program by AccessLAN Communications Inc. (San Jose, Calif.) and of the VoDSL Partner Program by gateway specialist Jetstream Communications
Cypress to evaluate silicon-28 wafers
News & Analysis 5/27/1999 Post a comment Isonics Corp. and Cypress Semiconductor Corp. announced today that they have signed a joint research and development agreement to explore the use of isotopically pure silicon-28 in semiconductor memory devices.
TI, Symbian and Nokia ally on 3G platform News & Analysis 5/27/1999 Post a comment Texas Instruments Inc., Symbian plc and Nokia Group have developed and will broadly promote a new platform for next-generation wireless phones. Nokia said it will be the first supplier to use the jointly developed Open Multimedia Application Platform (OMAP), which includes an ARM processor and digital-signal processor from TI,
and the Epoc real-time operating system from Symbian. The companies hope to make the platform an industry standard for next-generation phones.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.