Asahi Glass to demo 0.1mm glass laminate at SID News & Analysis 5/31/2012 4 comments At next week’s Society for Information Display exhibition manufacturer of glass, chemicals and high-tech materials AGC will showcase carrier glass on which to laminate its 0.1 mm-thick ultra-thin glass for next-generation displays and various other applications.
Andes Takes Embedded Cores to Japan, Korea News & Analysis 5/31/2012 Post a comment Emboldened by reports of an uncertain future for MIPS Technologies, Andes Technology will take its embedded cores to the Japan market this fall. Andes CEO Frankwell Lin says its a "small move for us."
Samsung, LG lead on tablet displays News & Analysis 5/31/2012 4 comments Thanks to continued strong sales of Apple iPad and Amazon Kindle Fire, Korean display makers Samsung Electronics Co. Ltd. and LG Electronics Inc. remained the top suppliers of tablet screens in 2011, with more than 80 percent of all shipments combined, according to IHS iSuppli.
Intel phone debuts in China News & Analysis 5/31/2012 11 comments Intel has released another Atom-powered smartphone, this time by Chinese electronics vendor Lenovo Group, which said it will put out an Intel Inside device at CES 2012 back in January.
Freescale pushes wireless recharge News & Analysis 5/31/2012 15 comments Freescale Semiconductor's reference designs for recharging tablets and smartphones allow automobiles, airports, coffee shops and other public areas to supply almost invisible recharging stations built into tables, kiosks or nearly any horizontal surface.
Insufficient baseband chip supply hurting LTE smartphone sales News & Analysis 5/30/2012 9 comments Since there has been greater than originally expected demand for LTE smartphones and tablets, international vendors are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
Teledyne acquires LeCroy News & Analysis 5/30/2012 4 comments Military and aerospace specialist Teledyne Electronic Technologies has acquired Lecroy Corp., expanding its portfolio of analytical instrumentation products.
3U form-factor PSU claims increased power benefits Product News 5/30/2012 Post a comment Pulse Electronics' 3U form-factor PSU for VPX applications is now available with optimized Positronic P47 connections and can be configured to deliver more than 400 W of power plus provide an additional high power 28 V protected output.
Industrial apps go multi-platform News & Analysis 5/30/2012 3 comments Motorola Solutions has crafted a universal app platform for its developers, enabling a single HTML5 app to be deployed on iOS, Android, Windows Phone, Windows Mobile, Windows CE and Blackberry mobile devices.
Ansys to acquire embedded software firm News & Analysis 5/29/2012 2 comments Simulation software provider Ansys said it signed a definitive agreement to acquire France-based Esterel Technologies, a provider of embedded software simulation tools for mission critical applications, for about $53 million in cash.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.