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posted in May 2013
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IBM breakthrough could alleviate mobile data bottleneck
News & Analysis  
5/31/2013   8 comments
Integrated phased-array transceiver contains all millimeter- wave components necessary for high data-rate communications.
STEM on Tektronix agenda
News & Analysis  
5/31/2013   5 comments
What is Tektronix doing to ensure the next-generation of experts in physics and electronics?
Satellites support drones in commercial airspace
News & Analysis  
5/31/2013   2 comments
European defense and research companies have successfully demonstrated satellite control of Remotely Piloted Aircraft Systems (RPAS) in commercial, non-segregated airspace, opening up wider use of such drones.
Intel wins CPU slot in Samsung tablet
News & Analysis  
5/31/2013   21 comments
Atom processor gain design win in Samsung Galaxy tablet computer, according to reports.
Analyst: Chip sales were weak in April
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5/31/2013   Post a comment
Financial analyst sees signs of weakness in the chip market and predicts market contraction in 2013.
Exar releases step-down regulator for EMC/EMI sensitive applications
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5/31/2013   Post a comment
Exar’s latest power management chip delivers 3A of current with a 2.5MHz programmable operating frequency.
Texas Instruments ADS4449 14-bit A/D converter
Product News  
5/31/2013   Post a comment
According to TI, the ADS4449 is the highest-performance 4-channel A/D converter at 250 MSPS, providing an additional 4-dB SNR and 8-dB SFDR, compared to existing 4-channel A/D converters.
Linear Technology LTC2378-20 SAR A/D converter
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5/31/2013   Post a comment
Linear Technology’s 20-bit 1Msps no-latency SAR A/D converter boasts exceptionally low 0.5ppm (typ) and 2ppm (max) INL error.
Intel, ARM on even footing in Net of Things, says IDC
News & Analysis  
5/30/2013   12 comments
More than 25 billion intelligent systems valued at $4 trillion could ship in 2020, said an IDC analyst helping create a new trade group for the sector.
QuickLogic’s "CUB" system provides easy eval of ArcticLink III VX for customer designs
Product News  
5/30/2013   Post a comment
Multi-function boards support all variants of the ArcticLink III VX and BX families; provides fast and easy prototyping and compatibility testing.
Making yesterday’s parts with today’s green technology
Product News  
5/30/2013   Post a comment
When a critical component is declared end-of-life (EOL) by a manufacturer, a ripple effect begins. Re-manufacturing the part in an environmentally-friendly manner has become a challenge…
Production availability of SmartFusion2 SoC FPGAs from Microsemi
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5/30/2013   Post a comment
Microsemi has announced the availability of its first production-qualified SmartFusion2 System-on-Chip FPGAs, the M2S050 and M2S050T.
Avnet Electronics Marketing releases production-grade ZedBoard
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5/30/2013   Post a comment
Production-grade ZedBoard is the industry’s first development kit to offer production silicon of the Xilinx Zynq-7000 All Programmable SoC.
Lattice’s latest design software allows designers to derive big benefits from tiny FPGAs
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5/30/2013   Post a comment
Lattice Diamond v2.2 and iCEcube2 (v2013-03) tools provide access to innovative, compact, low-power FPGA solutions.
ADI unveils ADL5544, ADL5545, ADL5610 and ADL5611 broadband RF gain blocks
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5/30/2013   Post a comment
RF amplifiers offer a combination of high linearity, power, and noise-figure performance over a wide frequency range.
Optocoupler targets military, medical apps
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5/30/2013   Post a comment
Isolink’s optocoupler is aimed at applications requiring optical isolation in gamma, neutron and proton radiation environments with high current transfer ratio and low saturation Vce.
Samsung unveils 4-Gb LPDDR3 mobile DRAM
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5/30/2013   Post a comment
20-nm-class memory can transmit data at up to 2,133 Mb/s per pin.
Stackpole RAF Series chip resistor arrays provide size, weight reduction
Product News  
5/30/2013   Post a comment
Stackpole is offering a small chip resistor array, consisting of two or four isolated 0201 equivalent resistors in a single rectangular-shaped chip with no scallops or holes.
Microsemi unveils TRRUST-Stor Series 200 high-security, self-encrypting solid state drive line
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5/30/2013   Post a comment
New 256GB, 200MB/s TRRUST-Stor series 200 SATA SSD shipping to customers.
Global GDP woes dragging on chip growth
News & Analysis  
5/30/2013   12 comments
IC Insights trimmed its forecast for 2013 chip market growth after preliminary Q1 GDP estimates from several regions came in soft.
Europe adds to chip pilot line support list
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5/29/2013   Post a comment
The European Commission has added LEDs, power, MEMS and 450-mm to the list of chip manufacturing pilot lines it will support.
Tablets expected to outship notebooks in 2013
News & Analysis  
5/29/2013   8 comments
IDC cuts PC market forecast as consumers turn increasingly to tablets, smartphones.
SRC sponsors research in Abu Dhabi
News & Analysis  
5/29/2013   1 comment
The Semiconductor Research Corporation is jointly funding semiconductor development efforts with the Globalfoundries parent company.
AMD rolls 'Kyoto' server processors
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5/29/2013   Post a comment
Firm claims small core processors outperform Intel's Atom server chips with better power efficiency.
MOST Forum sketches 5-Gbps future
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5/28/2013   Post a comment
At the recent MOST Forum in Germany, experts discussed the presence and future of the MOST data bus used in automotive environments against the background of the AVB/Ethernet camp seemingly having gained ground recently.
Slideshow: Ethernet yesterday, today and tomorrow
News & Analysis  
5/28/2013   15 comments
The 40th anniversary of Ethernet unearthed old war stories, a couple poems, a robotic-assisted videoconferencing demo and talk of a big, insecure future.
Wolfson to move integrated MEMS mics to 8in wafers
News & Analysis  
5/28/2013   2 comments
Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMs microphones and moving production to 8in (200mm) wafers in the first to make the move.
HiWave spinoff to develop new haptics, embedded audio
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5/28/2013   Post a comment
Led by HiWave's former CEO and CTO, James Lewis and Chris Travis, start-up Redux Labs has been spun out to advance its Surface Sensation technology for third generation haptic and embedded audio technology.
IEEE802.11a/b/g/n Compatible WLAN-module supports data rates up to 150Mbps
Product News  
5/28/2013   Post a comment
With the UGZZE-M11A Alps Electric Europe is now offering a IEEE802.11a/b/g/n compatible wireless LAN module with data transmission rates of up to 150Mbps.
Low-power 'always on' software for voice control
Product News  
5/28/2013   Post a comment
More famous for its analogue chip designs, Wolfson Microelectronics has launched the first in a series of software that simplifies the use of voice control with low power voice recognition and noise cancellation.
36-V digital pots support wide signal swings, high power-supply voltages
Product News  
5/28/2013   1 comment
Microchip Technology Inc., has introduced two new volatile, SPI digital potentiometers (digipots) which are the first to operate at 10, 12, 18, 24 and 36 volts, for systems requiring wide signal swing or high power-supply voltages.
IPx8 waterproof 11x15x2mm speaker delivers 94dB max SPL
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5/28/2013   Post a comment
Knowles Sound Solutions' Cobra speaker is a 11x15x2mm speaker with 1 Watt of power handling capacity for outstanding loudness in portable consumer devices.
Intel invests in Irish R&D
News & Analysis  
5/28/2013   10 comments
Intel is investing $1.5 million in the Tyndall National Institute at University College Cork to help collaboration in R&D in photonics, microsystems and nanoelectronics.
Cloud-based virtualization goes mobile
News & Analysis  
5/24/2013   6 comments
Innovations by Citrix and Nvidia could take virtualization to its logical conclusion, allowing users to access their desktops from any mobile device.
Research gap threatens innovation, experts warn
News & Analysis  
5/24/2013   22 comments
The decline of big corporate R&D groups such as Bell Labs has created a hole in the innovation pipeline said Bill Spencer (pictured) at an event celebrating the 40th anniversary of Ethernet.
Global FDSOI ecosystem rising
News & Analysis  
5/24/2013   5 comments
So far, STMicroelectronics has been identified as the only company tilting at the FDSOI windmill. That perception, and a lonely market landscape, are about to change.
SOI wafer supplier sees cash halved
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5/24/2013   Post a comment
Soitec has seen cash resources fall by 50 percent as it made net loss that was 80 percent of sales in financial year to end of March 2013.
Intel Haswell packs integrated voltage regulator
News & Analysis  
5/23/2013   12 comments
Integration eliminates as many as seven external third party chips—one of many power improvements driven by competition with ARM.
Silicon Labs' Si52111 and Si52112 clock generator ICs ease power consumption, design complexity
Product News  
5/23/2013   Post a comment
Silicon Labs introduced what it claims are the industry’s smallest, most power-efficient PCIe clocks for consumer, embedded, storage, server and communications applications.
Europe launches $12 billion chip support campaign
News & Analysis  
5/23/2013   34 comments
Europe is planning to spend $12 billion to reverse the continent's decline in chip production. Recreate the success of Airbus in semiconductors, said official.
AMD launches three mobile APUs
News & Analysis  
5/23/2013   2 comments
Additions to AMD's lineup of mobile accelerated processing units include chips formerly codenamed Temash, Kabini and Richland.
Broadcom: Time to prepare for the end of Moore’s Law
News & Analysis  
5/23/2013   52 comments
CTO Henry Samueli says Broadcom is starting to prepare customers for the end of CMOS scaling in the next 15 years, and it is working out plans for 3-D chip stacks.
TI expands ecosystem for MSP430 Capacitive Touch solutions
Product News  
5/22/2013   Post a comment
End-to-end portfolio allows developers to quickly and easily create capacitive touch designs that replace mechanical buttons.
Rugged SBC offers flexible I/O for data processing in compact displays
Product News  
5/22/2013   Post a comment
MEN Micro has launched a low power, rugged single board computer with a 1.6GHz Atom processor that incorporates flexible I/O for demanding graphics environments.
Cadence launches massively parallel timing tool to speed SoC design
Product News  
5/22/2013   Post a comment
Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable SoC developers to speed timing closure and move chip designs to fabrication quickly.
Murata DC/DC converter employs PMBus-compatible digital interface
Product News  
5/22/2013   Post a comment
Incorporating a 32-bit ARM7 processor, the 420 Watt regulated UDQ2204/001 model is the first in a series of DC-DC converters from Murata Power Solutions to include a PMBus-compatible digital interface.
Capacitors provide high reliability for +28V power supplies in military and aerospace apps
Product News  
5/22/2013   Post a comment
Vishay Intertechnology extends 597D series of solid tantalum chip capacitors with new DLA-approved devices.
Cypress releases latest version of PSoC Designer IDE
Product News  
5/22/2013   Post a comment
Cypress’s Version 5.4 includes more than 40 new or enhanced user modules to drop into designs and multiple new features to increase ease-of-use and customization.
Sony’s dilemma: Short-term gain vs. long-term strategy
News & Analysis  
5/22/2013   8 comments
Sony CEO reiterated that restoring its electronics business is the company’s priority. But how exactly is a partial spinoff of its entertainment divisions going to help?
Drive interface provides precise position, velocity control in demanding apps
Product News  
5/22/2013   Post a comment
ACS Motion Control has developed a compact, cost-effective dual/quad axis universal drive interface with ±10V commands.
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