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posted in June 2001
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Hynix mulls cutting DRAM output by 20 percent
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6/30/2001   Post a comment
South Korean DRAM vendor Hynix Semiconductor Inc. appears ready to take an unprecedented move to reverse its own fortunes and, by extension, those of the DRAM market.
Sipex cuts workforce by 15%, plans to reduce chip production at foundries
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6/29/2001   Post a comment
BILLERICA, Mass. - Citing the ongoing IC downturn, Sipex Corp. plans to slash its workforce by 15% and will reduce its chip production at outside silicon foundry providers. Instead of using outside foundries, the supplier of analog and mixed-signal chips will boost the production in its own fab by 30%. The move will save the company about $3 million per quarter.
Germany's Osram Opto to build new LED chip fab
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6/29/2001   Post a comment
REGENSBURG, Germany -- Bucking the trend in the semiconductor industry, Osram Opto Semiconductors GmbH & Co. here announced plans to build a new wafer fab in Germany. The total cost of the fab is about $100 million. The fab will make chips for light-emitting diodes (LEDs), laser diodes and sensors, according to Osram Opto. The Regensburg-based company is joint venture between Infineon Technologies AG and Osram GmbH, a manufacturer of lighting products.
Heard on the Beat (June 29)
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6/29/2001   Post a comment
Heard on the Beat (June 29)
Appeals ruling may signal end to Microsoft saga
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6/29/2001   Post a comment
In striking down key portions of the landmark decision to break up Microsoft Corp., a federal appeals court may have opened the door to settlement talks that could end the four-year-old antitrust case.
RESOURCES
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6/29/2001   Post a comment
ST and TSMC prep SiGe for volume production
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6/29/2001   Post a comment
STMicroelectronics and Taiwan Semiconductor Manufacturing Co. (TSMC) are each ready to move their respective silicon germanium (SiGe) process technology into volume production.
Free download of ARM clone source code offered
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6/29/2001   Post a comment
A Chinese graduate student is offering freely downloadable source code for the description of a synthesizable processor core claimed to be compatible with the ARM7 32-bit RISC processor developed by ARM Holdings plc (Cambridge, England).
Substrates enable flexible displays, researchers say
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6/29/2001   Post a comment
Using research out of Yamagata University, two groups in Japan are developing plastic substrates that could be used as the basis of flexible organic light emitting displays (OLEDs).
Samsung speeds up move to 0.12-micron process
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6/29/2001   Post a comment
Samsung Semiconductor will push its planned shrink to the 0.12-micron process for 256- and 512-Mbit memory parts ahead two quarters in a bid to dominate next year's Windows XP-driven PC market.
Intel's expansion sparks turf wars
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6/29/2001   Post a comment
Motorola, AMD's Ruiz settle suit over recruitment dispute
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6/29/2001   Post a comment
SCHAUMBURG, Ill. -- Motorola Inc. and the former president of its semiconductor business, Hector de J. Ruiz, here have reached an out-of-court settlement in their suit over the alleged illegal recruitment of Motorola executives to Advanced Micro Devices Inc. In January of 2000, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
Flexible scheme suits broadband
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6/29/2001   Post a comment
As broadband access becomes more available in homes, new possibilities exist for services that can be provided to the consumer using that access.
Architecture melds DSP with MCU
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6/29/2001   Post a comment
Next-generation wireless applications combining voice, video and data require a processor that can efficiently implement advanced third-generation (3G) algorithms.
Microtune affirms expected drop in Q2 sales, but Q3 backlog increases
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6/29/2001   Post a comment
PLANO, Tex. -- Radio-frequency IC supplier Microtune Inc. here today reiterated that it expects to report second-quarter revenues in a range of $14.1 million to $15.0 million, a 15-to-20% sequential drop from $17.7 million in the first quarter this year. The guidance is similar to what the Plano startup issued on April 23.
DSPs drive merger of voice, data
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6/29/2001   Post a comment
Voice-over-packet technology converts narrowband voice, fax and data traffic from the circuit-switched format used in telephone and wireless cellular networks to packets that can travel over next-generation Internet Protocol (IP) or asynchronous transfer mode (ATM) optical networks.
DSP realm hits new partition choices head-on
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6/29/2001   Post a comment
Like other segments of the semiconductor industry, digital signal processor (DSP) chips reap the rewards of ever-advancing integration.
Orders from TI and others may boost Teradyne, but outlook is still cloudy
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6/29/2001   Post a comment
BOSTON -- Teradyne Inc.'s outlook remains cloudy in spite of a recent uptick orders for its automatic test equipment (ATE) from several established and new customers, reportedly including Texas Instruments Inc., according to analysts. It's been a rough time for Teradyne and other ATE companies. The downturn in the ATE business caused Teradyne earlier this month to reduce its workforce and lower its forecast for the second quarter of 2001.
Bourns grants TTI global franchise
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6/29/2001   Post a comment
ILS, domainLogix roll out e-diagnostics system meeting Sematech guidelines
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6/29/2001   Post a comment
AUSTIN, Tex. -- ILS Technology Inc. and domainLogix Corp. said they are now offering the first commercially available e-diagnostics framework for semiconductor manufacturing, called e-CentreT. The system results from a recently announced technology alliance between the two companies.
Fixed wireless ready for wide rollout
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6/29/2001   Post a comment
Bolstered by hints that the Federal Communications Commission is unlikely to take away their spectrum, developers at a packed industry conference this past week said fixed broadband wireless systems are now primed for major deployment.
Japanese analyst sees cause for cheer in 2002
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6/29/2001   Post a comment
Recovery for the global semiconductor business will occur next summer, an analyst predicted this week during a seminar on prospects for the world electronics and chip industries. Akira Minamikawa, senior analyst at WestLB Securities Pacific Ltd.'s Tokyo office, was one of the few to warn of disaster for the industry last summer.
Inficon claims first multi-sensor e-diagnostics system for fabs
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6/29/2001   Post a comment
EAST SYRACUSE, N.Y.-- Inficon Holding AG today said it will be the first to offer a multi-sensor system for e-diagnostics in wafer fabs and process tools. The company plans to introduce its eFabGuard Global Support Network and the multi-sensor e-diagnostics system during Semicon West next month in San Francisco.
Comm-IC vendors still in a pickle
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6/29/2001   Post a comment
Dome high tech city moves to Deptford as Eden eyes Greenwich
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6/29/2001   Post a comment
The abandoned hi-tech business park scheme that was once scheduled to take over the controversial Millennium Dome has been resurrected.
Struggling OEMs face tough choices
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6/29/2001   Post a comment
European collaboration for SoC
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6/29/2001   Post a comment
Fujitsu Microelectronics Europe (FME) and Europe Technologies (ET), Sophia Antipolis, of France, have pooled their resources to offer a solution which reduces time-to-market for RISC/ARM based System-on-Chip (SoC) designs.
Agere cuts 4,000 more jobs
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6/29/2001   Post a comment
Texas startup GlobiTech ramps up epi-wafer foundry production
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6/29/2001   Post a comment
SHERMAN, Tex. -- GlobiTech Inc. today announced shipments of its first epitaxial wafers to semiconductor manufacturers, which will use the epi-silicon substrates to fabrication CMOS chips with design rules under 0.18-micron feature sizes.
MIT set to move to R&D centre at Ipswich's Adastral Park
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6/29/2001   Post a comment
Cambridge University and the Massachusetts Institute of Technology look set to extend their collaborative research project CMI at a new R&D centre on the Adastral Park research campus near Ipswich.
Free online embedded design
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6/29/2001   Post a comment
PowerPC 440 SoC support
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6/29/2001   Post a comment
Innoveda will enhance its V-CPU hardware/software co verification tool with a processor support package for IBM's PowerPC 440 core.
Wales Foundry issues design kit service
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6/29/2001   Post a comment
Analogue and mixed signal semiconductor foundry, European Semiconductor Manufacturing (ESM), and Nordic VLSI of Trondheim, Norway, have developed a new foundry design kit service for ESM customers.
Germany's X-Fab offers SOI foundry services for mixed-signal, high-voltage ICs
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6/29/2001   Post a comment
ERFURT, Germany--X-Fab Semiconductor Foundries here today announced its has moved into the silicon-on-insulator wafer processing business, offering SOI technology for high-voltage and high-temperature chip applications.
Page 1 / 34   >   >>


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