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posted in June 2004
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Hightech-Kommunikation bei der Müllabfuhr
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Ein Anwendungsprofil des Kommunikationsprotokolls CANopen macht Müllfahrzeuge zu Technologieträgern: Mithilfe der Spezifikation können in den meist modular aufgebauten Entsorgungsfahrzeugen elektronische Komponenten herstellerunabhängig miteinander kommunizieren.
Le modèle de dispersion utilisé dans la fabrication des semi-conducteurs permet d’améliorer la cartographie
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Un modèle de diffusion similaire à la technique utilisée dans la conception des semi-conducteurs a résolu un vieux problème en matière d’affichage de l’information, le cartogramme.
Les nano-aimants pourraient générer des champs de micro-ondes
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Une nouvelle forme d’interaction électromagnétique dans laquelle le spin de l’électron modifie la direction magnétique de nano-aimants de cobalt est en cours d’étude à la Cornell University en vue de découvrir de nouveaux types de mémoires et de dispositifs de traitement du signal.
Summit Visual tool supports SystemC
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The latest version of Summit Design Inc.'s Visual Elite graphical based ESL design product includes Advanced SystemC modeling and analysis capabilities.
250-MSample/s, 8-bit ADCs
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The AD9480 8-bit analog-to-digital converter (ADC) provides a 250-MSample/s conversion rate and +/-0.25 LSB differential nonlinearity.
Instrument option supports EDGE-capable mobile devices
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Helping OEMs and service providers test and align EDGE cellphones and mobile data cards, instrumentation maker Willtek now has an option for its existing Model 4400 Mobile Phone Tester Series. The option permits production and service personnel to test and align transmitters, which is important to do after component exchange.
Resistors deliver higher performance, smaller size for medical apps
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As their next-generation designs continue to shrink in size, medical equipment manufacturers are calling for resistors that deliver higher frequency, extended resistance values and tighter tolerance all in a small, surface-mount package. Thanks to the use of new materials, refined manufacturing processes as well as advanced packaging technologies, resistor manufacturers are making the grade and fine-tuning their resistor technologies to meet the demands for higher performance and smaller footpri
10-Gigabit Ethernet over copper cable picks up momentum with the new Mysticom CX-4 module
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Review: Three key points stand out about Mysticom's new MY3126 CX4 module-in-a-chip for 10 Gbit/s links for short reach enterprise applications. The new module offers twice the CX4 standard's specified distance of 15 meters; enables the use of thin gauge cables for shorter distance applications, and touts an 80% cost savings for 10 Gbit/s links. In addition, the Mysticom solution can address both the enterprise stackable and data center markets.
A design conundrum
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Manually creating digital symbols or footprints to represent components in a computerized schematic board is one of the more tedious and time-consuming parts of electronic-system design. Entering a single integrated circuit can easily burn the better part of a workweek"not the best use of an engineer's time.
Can you hear me?
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We are now entering that period when greed gets the best of many companies. The U.S. economy is expanding, business high-tech equipment spending is reviving and consumer electronics sales remain vigorous. Mistakes and miscalculations are bound to happen in this sweltering environment--and for the electronics industry, history indicates that an accurate reading of real demand is typically the first casualty.
DRAM's tortuous road
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Good news and bad news tend to go hand in hand in the DRAM market. Consider the latest forecast for memory products from Gartner Inc. (Stamford, Conn.). The market researcher predicts DRAM vendors "will enjoy a strong 2004" but adds that "oversupply will sour the following 12 months, and intense competition looks likely to make for a grim 2006."
The global 30
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Sweet relief. Painful memories of 2001 and 2002--those successive years of misery for most electronics companies--are receding fast and being replaced by much more pleasant conditions.
A different kind of recovery arrives
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This is not your father's recovery. It's a new day, many say, driven less by the familiar PC and more by whims of consumer electronics, wireless and a market and supply base more global than ever before.
Samsung met au point un procédé de câblage CVD pour les mémoires DRAM 70 nm
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Samsung Electronics Co. Ltd. a mis au point une méthode de dépôt chimique en phase vapeur (chemical vapor deposition, ou CVD en anglais) afin de déposer une interconnexion aluminium au niveau des mémoires DRAM, en utilisant un procédé technologique 70 nm, selon un communiqué publié par le groupe jeudi (27 mai).
Competition heats in X86, PowerPC embedded markets
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Competition stepped up a notch or two in the embedded X86 and PowerPC processor markets last week, and already the brickbats are flying.
Le Français Prosilog expose le fruit de sa collaboration avec ST à la DAC 2004
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Prosilog SA, société française spécialisée dans le développement et la commercialisation d’outils pour la conception de systèmes sur puce, présentera, à l’occasion de la Conférence DAC (Design Automation Conference) à San Diego (Californie) du 7 au 11 juin 2004, l’intégration de la plate-forme multimédia TC4SOC de STMicroelectronics dans son environnement Magillem.
Clearing hurdles to integrated transceivers
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Startup Quorum Systems Inc. (San Diego) leveraged its staff's expertise in converter, filter and synthesizer design in developing a Wi-Fi and quad-band GSM/GPRS/Edge transceiver.
Broadcom, BroadLight collaborate on FTTP chip set
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Startup chip developer BroadLight announced Tuesday (June 1) that it is partnering with Broadcom in order to provide a unified fiber-to-the-premise (FTTP) chip set that delivers voice, video and data capabilities to residential users.
Power-Management-Chip unterstützt Wireless SpeedStep
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151 Ein hochintegriertes Powermanagement-Chip von Dialog Semiconductor versorgt in künftigen Handy-Generationen gleich zwei Prozessoren: Sowohl ein Kommunikationsprozessor als auch ein Applikationsprozessor aus Intels neuer Produktfamilie PXA27x können ihre Energie aus Dialogs CMOS-Baustein DA9030 saugen.
Rien ne va plus in der Wafer-Fertigung
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Um mehr als 60 Prozent hat die Fertigung in Foundries und bei führenden Chipherstellern im ersten Quartal 2004 im Vergleich zum Vorjahreszeitraum zugelegt. Laut einem Bericht der SICAS über Kapazitäten und Fab-Auslastungen brummt das Geschäft wie noch nie: Trotz umfassender Kapazitätserweiterungen ist eine Auslastung von fast 100 Prozent erreicht.
Startup's dual-radio IC opens door to roaming
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With the introduction of a single-chip wireless-LAN and cellular RF transceiver, a small startup may have laid the fundamental hardware building block for ubiquitous wireless connectivity.
Mysticom adds transceivers for enterprise networking designs
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Mysticom is expanding its product line this week with the release of an LX-4 optical transceiver and CX4 copper transceiver designed to bring 10-Gbit connectivity in enterprise networking applications.
Wafer-Messtechnik auf dem Weg in die Konvergenz-Ära
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Alles wächst zusammen und greift ineinander - der Trend zur Konvergenz macht auch vor der Wafer-Messtechnik nicht Halt. Dieser Bereich steckt mitten in einem tief greifenden Konvergenz-Prozess. Neue optische Tools zum Erfassen der Critical Dimensions (CD) erscheinen auf der Bildfläche und drängen bislang in den Fabs übliche CD-SEM-Messgeräte ins Abseits.
Alliance Semiconductor investit 50 millions de dollars en Inde et double ses effectifs
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Alliance Semiconductor Corp., fournisseur de produits à signal mixte/analogique et de puces mémoire, a annoncé lundi (31 mai) un projet d’investissement, à hauteur de 50 millions de dollars, dans son centre de conception en Inde. Ce projet s’étalera sur cinq ans.
Topnordic köper delar av Ementor
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6/1/2004   Post a comment
Det danska IT-företaget Topnordic A/S har köpt den del av Ementor ASA danska bolag som marknadsför hårdvaru- och infrastrukturprodukter på den danska marknaden.
Ny vd för Emano
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Från och med den 1 juni tillträder Finn Persson tjänsten som ny vd för det av Industrifonden delägda riskkapitalbolaget Emano i Umeå. Finn Persson efterträder Tomas Lindström som varit vd för Emano sedan starten 1998.
Searching For The Big Picture
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