China's BCD Semi scraps IPO News & Analysis 6/30/2008 Post a comment China's BCD Semiconductor Manufacturing Ltd. has withdrew its plan for a U.S. initial public offering of its common stock, according to a filing from U.S. Securities & Exchange Commission (SEC).
8-bit MCU features dual bus design for complex multi-chip A/V subsystem control Product News 6/30/2008 1 comment Its dual SMBus feature, small form factor and support for a wide range of operating voltages make the SST89C58RC MCU an ideal solution for numerous applications, including HDMI, HDTVs, A/V receivers, home appliances, industrial instruments, notebook PCs, DVD players, Blu-ray players, RF modules and security applications such as fingerprint identification.
Private equity to take major stake in NDS News & Analysis 6/30/2008 Post a comment News Corporation is planning to sell a significant share in its NDS Group plc subsidiary to private equity group Permira. NDS Group is a supplier of software, conditional access systems and architectural blueprints for digital pay-TV systems around the world.
Opinion: ST-NXP Wireless needs a new name News & Analysis 6/30/2008 3 comments ST-NXP Wireless, the new communications IC joint venture floated by STMicroelectronics NV and NXP BV, is starting life with a name that confuses its identity with those of the parent companies. Even before the ink dries up on its birth certificate, CEO Alain Dutheil should consider changing the name.
Fluke : ScopeMeter suits CAN-bus troubleshooting Product News 6/30/2008 Post a comment As well as enabling detailed signal measurements, the rugged Fluke 125 Industrial ScopeMeter features a "bus health" mode function which gives a clear good/bad indication for the electrical signals on a CAN-bus and other buses.
Samsung invests in Inside Contactless News & Analysis 6/30/2008 Post a comment Samsung Ventures America announced it has invested in French fabless supplier of smartcard chips Inside Contactless SA. Building upon investments from Nokia Growth Partners, Motorola Ventures and institutional investors, this participation brings the total investment in the company to about $42 million.
Airless tire reinvents wheel News & Analysis 6/30/2008 Post a comment Resilient Technologies together with the University of Wisconsin's Madison Polymer Engineering Center, are developing an airless tire to solve the problem with a four-year, $18-million grant from the Pentagon.
Are IC thermal problems hot air, question panelists News & Analysis 6/30/2008 Post a comment At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?
Europe again lags in chip sales for May '08 News & Analysis 6/30/2008 Post a comment Europe was again the laggard in semiconductor growth in May, with the WSTS figures showing it fared worst in both the three month moving average and year-to-year calculations compared to other regions, and that it showed the largest decline, of 0.3 percent, for sales between April and May 2008.
ST publishes corporate responsibility report Product News 6/30/2008 Post a comment The European chipmaker STMicroelectronics NV has published its 2007 corporate responsibility report. This publication, part of annual series, presents detailed indicators of the company's performances across a range of environmental, health & Safety, social and corporate governance issues.
Chip sales increased 7.5% in May, says SIA News & Analysis 6/30/2008 Post a comment The three month moving average of global chip sales was $21.8 billion in May, 7.5 percent up on the $20.3 billion reported for May 2007, according to the Semiconductor Industry Association (SIA) and based on figures from WSTS.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.