ST gives update on headcount restructuring News & Analysis 8/4/2009 Post a comment Commenting on its financial results for the first half of fiscal year 2009, European chipmaker STMicroelectronics NV (Geneva, Switzerland) provided an update on the current status of the company's restructuring plan.
Healthy IC supplier inventories seen in Q2 results News & Analysis 8/4/2009 Post a comment Most major semiconductor suppliers that have reported second-quarter results are currently holding lean levels of chip inventory, putting them in a strong competitive position as demand begins to recover, according to market research firm iSuppli.
Video: DAC chair on the 2009 show News & Analysis 8/3/2009 Post a comment EE Times caught up with Andrew Kahng, chair of the 46th Design Automation Conference, who said the event exceeded a lot of expectations considering the economy and the July dates.
GlobalFoundries: We are building on Dresden News & Analysis 8/3/2009 1 comment I am an American, and I am now living here in Dresden. This is my second assignment here, following a two year stint nearly 10 years ago. I have worked for the past nearly 20 years for Advanced Micro Devices. AMD is one of only two companies left in the world that design and build microprocessors.
Arteris offering peripheral interconnect IP Product News 8/3/2009 Post a comment Arteris, a provider of network-on-chip interconnect IP, announced the availability of a peripheral interconnect solution said to provide an efficient way to integrate peripheral components onto a system-on-chip.
Android heads for high def roles News & Analysis 8/3/2009 Post a comment MIPS Technologies and one of its partners are developing extensions to the Android operating system to support high definition video displays, part of a broader initiative by MIPS to bring Google's cellphone software to consumer electronics devices such as Blu-ray players, set-top boxes and digital TVs.
Numonyx researches diodes for multilayer cross-bar memories News & Analysis 8/3/2009 Post a comment Numonyx has participated in a 2.95 million euro (about $4.2 million) project to develop low-temperature zinc-oxide diodes for two-terminal memories based on cross-bar architectures. Such memories could be based on phase-change materials or on materials that change resistance through other mechanisms.
June global chip sales up 3.7% on previous month News & Analysis 8/3/2009 Post a comment Global sales of semiconductors rose to $17.2 billion in June, up 3.7 percent from May when sales were $16.6 billion, according to the Semiconductor Industry Association (SIA). June sales were, however, 20 percent lower than June 2008 when sales amounted to $21.6 billion.
Intersil : Video delay lines provide crystal clear images Product News 8/3/2009 Post a comment Four triple analog delay lines for video signals from Intersil provide crystal clear video images at distances up to 300 m for keyboard-video-mouse (KVM) applications such as in offices, banks, supermarkets or classrooms, or any video carried over long distances of inexpensive twisted-pair cable.
Amélioration du marché français des puces en juin News & Analysis 8/3/2009 Post a comment Le marché français des semi-conducteurs a enregistré une croissance de 7,8% en juin 2009, par rapport à la moyenne des trois mois précédents, selon le Syndicat des Industries de micro et nanotechnologies, plus communément appelé Sitelesc.
Bosch takes over two photovoltaics companies News & Analysis 8/3/2009 Post a comment Automotive and industrial electronics giant Bosch group (Stuttgart, Germany) is broadening its photovoltaics activities by the acquisiton of two companies involved module manufacturing including CIGS thin-film modules.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.