HSA recruits Arteris, Sonics News & Analysis 8/31/2012 6 comments The Heterogeneous Systems Architecture Foundation, a group formed to advance technology standards for multicore processing, has recruited six additional member companies, including two suppliers of network-on-chip intellectual property to its ranks; Arteris and Sonics.
CST offers EMC and SI tool for PCBs Product News 8/31/2012 Post a comment Computer Simulation Technology launched CST BOARDCHECK for design engineers dealing with electromagnetic compatibility and signal integrity of PCBs to get a quick overview of potential problems in their layout.
Tokyo court hands Samsung a win over Apple News & Analysis 8/31/2012 13 comments A Tokyo court has found Samsung not guilty of infringing Apple's intellectual property, in contrast to a jury decision and a $1.05 billion damage award in Apple's favor in a California court last week.
Formosa Plastics bails out DRAM subsidiaries News & Analysis 8/30/2012 2 comments Formosa Plastics Group, parent of Nanya Technology Corp., has put together a bail-out plan worth about $1 billion to keep the loss-making DRAM maker from delisting from the Taiwan stock exchange, according to local reports.
Intel energizes wireless charging effort News & Analysis 8/30/2012 9 comments Intel has selected mixed-signal fabless chip company Integrated Device Technology to make transmitter and receiver ICs to implement Intel's resonant wireless energy transfer technology.
Silicon Labs unveils MCU plus temperature sensing Product News 8/29/2012 1 comment The C8051F39x/7x MCU family from Silicon Labs combines a high-performance 8-bit MCU with an integrated temperature sensor featuring best-in-class accuracy over an extended temperature range—without calibration.
Verizon pre-certifies Altair LTE chip News & Analysis 8/29/2012 2 comments Verizon Wireless pre-certified Altair Semiconductor’s FourGee 3100/6200 LTE chipset, representing the first time that Verizon certified an LTE chip vs. a device.
Handheld ADSL2+ tester compliant with DSLAMs Product News 8/29/2012 1 comment GAO Instruments is offering its pocket sized handheld ADSL2+ tester that is designed for ADSL, ADSL2, ADSL2+ and Re-ADSL testing. It is well suited for ADSL/ADSL2+ network installation, maintenance, and fault elimination.
Report: TSMC rebuffs Apple, Qualcomm News & Analysis 8/29/2012 31 comments Apple and Qualcomm have each offered more than a $1 billion to foundry Taiwan Semiconductor Manufacturing Co. to obtain a dedicated supply of processor chips, and both their offers have been rejected, according to a Bloomberg report.
Top 10 chip vendors hurt by weak Q2 News & Analysis 8/29/2012 5 comments Six of the world's top 10 semiconductor suppliers booked chip sales in the second quarter that were lower than the second quarter of 2011, with overall chip sales declining 3 percent year-over-year, according to market research firm IHS iSuppli.
AMD reports progress in cores, SoCs, APIs News & Analysis 8/29/2012 2 comments The Heterogeneous Systems Architecture group could finish “within months” the first draft of a new API, said Mark Papermaster (pictured), AMD's CTO in an interview at Hot Chips.
Western Digital back on top of hard disk drive heap News & Analysis 8/28/2012 3 comments Western Digital regained the top spot among hard disk drive suppliers in the second quarter, six months after falling behind rival Seagate Technology in the wake of flooding in Thailand that forced several facility closures, according to market research firm IHS iSuppli.
Making every TV 'smart' News & Analysis 8/28/2012 8 comments Hillcrest Labs announced a downsized version of its motion processing algorithms that can run on an 8-bit microcontroller inside a television remote control, offering the potential to make any TV a "smart" TV.
TSMC joins multibeam mask-writing club News & Analysis 8/28/2012 2 comments Leading foundry chip maker TSMC has joined a multibeam mask writer development consortium hosted by Austria's IMS Nanofabrication. TSMC joins founder members Dai Nippon Printing, Intel, and Photronics.
STATS ChipPAC qualifies TSV process News & Analysis 8/28/2012 Post a comment Singaporean chip packaging and test company STATS ChipPAC Ltd. has announced it has "qualified" 300-mm mid- and back-end manufacturing using a through-silicon-via (TSV) process allowing it to increase its 2.5- and 3-D packaging integration.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.