IEDM Set to Stage FinFET vs. FDSOI News & Analysis 9/27/2013 28 comments The leading-edge of semiconductor technology becomes more complex, and IEDM is there to bear witness -- and stage FinFET versus FDSOI, the battle for sub-20nm semiconductors.
Stretchable OLEDs for Displays, Lighting News & Analysis 9/27/2013 24 comments University of California at Los Angeles (UCLA) researchers fabricate a flexible, stretchable, bendable organic light-emitting diode (OLED) display that continues working while being deformed.
Freescale, Micron Extend Memory Research News & Analysis 9/24/2013 2 comments Freescale Semiconductor and Micron Technology have extended separate memory research partnerships in attempts to add to their capabilities at the leading-edge of chip production and find technology that can scale beyond the limits of NAND flash memory.
New York Plans $45 Billion Fab Campus News & Analysis 9/20/2013 23 comments The College of Nanoscale Science and Engineering is filing plans to develop an upstate New York site that could accommodate up to three 450mm wafer fabs at an estimated cost of up to $45 billion.
Soft Mobile Market Hits Chip Capex News & Analysis 9/20/2013 2 comments Capital spending forecasts have been reduced in the short term, affecting 2013 totals, due to perceived softness in the smartphone and tablet computer markets. However, a more favorable general economy is prompting a better outlook for 2014 and 2015.
Superconducting Quantum Computer Beckons News & Analysis 9/20/2013 11 comments Lawrence Berkeley National Laboratory (Berkeley Lab) has reported the first demonstration of high-temperature superconductivity in the surface of a topological insulator--a promising material for quantum computers whose bulk properties are that of an insulator, but whose surface is a conductor.
Spintronics for Silicon Approaching News & Analysis 9/19/2013 3 comments New room-temperature silicon-compatible semiconductor discovered by researchers may pave the way for future chips that store information on magnetic spin of electrons.
IMEC Process Supports Germanium-Tin Transistors News & Analysis 9/18/2013 2 comments A Belgo-Japanese research team has developed an improved process for the integration of germanium-tin MOSFETs on silicon substrates. This opens up the possibility of strained GeSn pMOSFETs at sub-10 nm geometries.
True White LEDs on the Horizon News & Analysis 9/17/2013 12 comments Physicist Z. Valy Vardeny and his colleagues at the University of Utah inserted platinum atoms into an organic semiconductor to tune its light emission to different colors in the quest for emitting truly white light to replace future light bulbs.
Plastic Memory Firm Plans Pilot Line News & Analysis 9/17/2013 5 comments Thin Film, a developer of organic ferroelectric nonvolatile memory technology, has ordered equipment for a pilot production line in Linkoping, Sweden, and announced a plan to raise about US$23 million via the sale of shares.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.