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TSMC Cuts Capex by $1 Billion
News & Analysis  
4/16/2015   2 comments
Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
Odds of Success of Mie Fujitsu, Japan’s Pure-Play Foundry
News & Analysis  
4/16/2015   2 comments
Mie Fujitsu Semiconductor is a foundry born from Fujitsu’s lack of any better options. Its genesis raises questions about the odds of Mie Fujitsu’s survival. We asked Mie Fujitsu President hard questions.
NFC Tags Check Food Freshness
News & Analysis  
4/16/2015   Post a comment
In December last year, researchers at the Massachusetts Institute of Technology (MIT) had designed simple gas sensors relying on nanotubes-based chemiresistors (electrical circuits whose resistance changes when exposed to a particular chemical).
Data Centers Drive SDN, Bandwidth
News & Analysis  
4/16/2015   2 comments
A Microsoft engineer described two new networking initiatives Web-scale engineers are driving to lower costs and get more bandwidth.
Nokia, AlcaLu Leapfrog Huawei
News & Analysis  
4/15/2015   4 comments
Wireless is the likely target of layoffs after Nokia bid $16.6 billion for Alcatel-Lucent to create the world’s second largest telecom vendor.
Apple Buys Array Camera Firm LinX
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4/15/2015   Post a comment
Apple has acquired Israeli startup LinX Computational Imaging Ltd., the developer of an array camera for mobile equipment, for a purchase price estimated at about $20 million.
Imagination Tunes in Wi-Fi, BT
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4/15/2015   Post a comment
Imagination Technologies hopes to leverage the communications experience of its Ensigma division to bring low power wireless connection to Internet of Things and wearable devices. Imagination hopes its built-for-IoT IP will prove valuable in a market that currently uses dumbed-down mobile chips
Module Makes BLE a Drop-In Design Element
News & Analysis  
4/14/2015   5 comments
The EZ-BLE radio module is fully self-contained, making Bluetooth Low Energy connectivity easy to add.
Moore’s Law Hits Middle Age
News & Analysis  
4/14/2015   6 comments
Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Taiwan Chipmakers Prepare to Transport Water as Drought Worsens
News & Analysis  
4/10/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest chip foundry, and other chipmakers on the island say they are prepared to ship water supplies to their fabs here if drought conditions worsen.
Parallel Processing Spawns Non-MPEG Codec
News & Analysis  
4/10/2015   13 comments
V-Nova will next week at NAB demonstrate a new video codec called Perseus. It's designed to do hierarchical and scalable video encoding by leveraging massive parallel processing, while sidestepping the complexity of block-based compression algorithms.
Sony Tips Billion-Dollar Capex for Stacked Image Sensors
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4/9/2015   Post a comment
Sony Corp. has announced an additional $375 million of spending planned for the 2015 fiscal year to further increase its ability to manufacture stacked CMOS image sensors.
On Semi Wins Image Sensor Slot
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4/9/2015   Post a comment
A tear down of the Hero entry-level sports camera from GoPro Inc. by market research firm IHS Technology reveals that Hero is based on the A7LS34 image processing chip from Amberella Inc. and a CMOS image sensor from Aptina, now part of On Semi.
Intel's 'Plans' for Atom x3 in IoT/Wearables, Bargain Smartphones
News & Analysis  
4/9/2015   1 comment
Intel's Developer Forum in Shenzhen kicked off a major effort to woo Chinese firms and developers to Atom for wearables, mobiles and IoT.
Nokia Demos 10 Gbits on High Frequency
News & Analysis  
4/9/2015   8 comments
Nokia Networks will demonstrate several next-generation cellular communications strategies at the Brooklyn 5G Summit, highlighting 10 Gbit/second data rates on over high frequencies. The Summit is co-hosted by NYU Wireless and Nokia to bring together wireless/mobile research and development leaders from around the world.
Samsung Galaxy S6: A New Slate
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4/8/2015   Post a comment
Samsung has invested in maturing its Shannon architecture and as such has ousted Qualcomm and others as the phone’s core chipset and system architecture, says analyst team at Teardown.com.
RTG4 -- Latest Family of Radiation-Tolerant FPGAs from Microsemi
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4/8/2015   Post a comment
Typical uses for RTG4 FPGAs include remote sensing space payloads, such as radar, imaging and spectrometry in civilian, scientific and commercial applications.
IC Insights Halves Sensor Growth Forecast
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4/7/2015   Post a comment
Market research firm IC Insights Inc. has more than halved the growth it expects to see in the sensors and actuators semiconductor category during 2015 and 2016.
Sony Licenses Bonding Technology from Ziptronix
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4/2/2015   Post a comment
Ziptronix Inc., a developer and provider of low-temperature direct bonding interconnect (DBI) technology for 3D integration, has announced a patent licensing agreement with Sony Corp. for the application of its technology to image sensors.
Thread, ZigBee Knit IoT Stacks
News & Analysis  
4/2/2015   4 comments
The Thread group and the ZigBee Alliance will define a spec to run the application-level Zigbee Cluster Library over native–IP Thread networks.
10 Apple Acquisitions: What Do They Mean?
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4/2/2015   Post a comment
Apple has a habit of buying tech companies. Let's look at its most recent acquisitions and in what ways each might enhance the company's future.
IoT Snags $25M in Europe
News & Analysis  
4/1/2015   3 comments
EuropeCPS aims to spend $25 million over three years helping companies create designs for the Internet of Things using boards from Intel, STMicro and others.
Why MediaTek Pushes Cross-Device Sharing
News & Analysis  
3/30/2015   5 comments
MediaTek is creating a technology, called CrossMount, that will link and share software and hardware resources of televisions and handheld devices in ways that would fulfill their unrealized potential. What’s behind the Taiwanese IC giant’s ambition?
OFC: Facebook Engineer Wants Silicon Photonics Now
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3/30/2015   Post a comment
At the annual panel session for editors and analysts, an engineer from Facebook pushed engineers from suppliers to lower costs while at the same time increasing data rates.
How Will Deep Learning Change SoCs?
News & Analysis  
3/30/2015   5 comments
Deep learning is changing the way computers see, hear and identify objects -- but will it ever migrate into smartphones or vision SoCs for cars? Has anybody come up with SoCs optimized for neural networks?
Linux Seeks Security, Unity
News & Analysis  
3/27/2015   3 comments
Linux needs greater security, unity and interoperability to meet its potential in the emerging Internet of Things said speakers at the Embedded Linux Conference.
OFC: Transceiver Module Spec Prevents Mismatching
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3/26/2015   Post a comment
A keyed CDFP optical module prevents cables from being plugged into the wrong receptacle.
Drones Eyed for Aid Missions
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3/25/2015   Post a comment
About a dozen volunteers have formed The Syrian Air Project in an effort to find a way to use drones to deliver medical goods and food to civilians under siege.
OFC: Networks Cost Too Much
News & Analysis  
3/25/2015   9 comments
At OFC 2015, Pradeep Sindhu of Juniper Networks told attendees that networks must change to a lower-cost business model.
Ericsson on Power: We Need To Rethink Structure
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3/25/2015   Post a comment
Next-generation cellular communications will require a drastic reduction in energy consumption, something researchers at Ericsson are calling “ultra-lean transmission.” A focus on power management software could alleviate some of these issues.
Tektronix Returns to the High-speed Oscilloscope Game
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3/24/2015   Post a comment
With the introduction of the DPO7000SX, Tektronix gets back in the oscilloscope bandwidth race, quelling speculation the the company was lagging behind competitors.
Optical Specs Plug Into Data Center
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3/23/2015   Post a comment
Microsoft’s data center group is leading a new effort to define interfaces to plug optical cables directly into server and switch boards.
Apple A9 Orders Pivot to TSMC
News & Analysis  
3/23/2015   1 comment
Apple will ramp up production of A9 for its yet-to-be-announced iPhone 6S. Originally, a majority of A9 orders were said to have gone to Samsung, but sources say TSMC snatched Apple A9 orders from Samsung on yield issues.
Sensor Network on Board of ISS Secures Air Quality
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3/23/2015   Post a comment
Environmental conditions such as temperature, atmospheric pressure, and air composition are vital for the life at the International Space Station (ISS). To collect these data at high accuracy and reliability, the German aerospace research centre DLR and Airbus Defence & Space developed and installed the Wise-Net wireless sensor network at the ISS; the measurement campaign was more successful than expected.
New Usecases Broaden Mobile ID, NFC
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3/20/2015   Post a comment
Strong smartcard and mobile ID solutions can help provide secure access and identification for devices, services, and official documents.
Amazon Drones Need a Few Breaks from the FAA
News & Analysis  
3/20/2015   2 comments
Amazon received an “experimental airworthiness certificate” from the FAA, but it isn't quite a breakthrough?. Not so much. Here’s why Amazon Prime Air’s dream of package delivery via drones is still a long shot.
MediaTek Sees IoT as Its Next Growth Driver
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3/19/2015   Post a comment
MediaTek, Taiwan’s largest chip designer, says it expects IoT to become its next big growth driver once the smartphone business starts to lose steam.
Patent Filings: Who Made the Cut for Top 50?
News & Analysis  
3/19/2015   5 comments
We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Broadcom v ASICs, Part 2
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3/18/2015   Post a comment
Broadcom announced the first 28nm versions of its StrataDNX chips from its Dune acquisition, driving deeper into competition with OEM ASICs.
Industrial IoT Drives Microsemi-Vitesse Merger
News & Analysis  
3/18/2015   Post a comment
Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
Marvell Touts MoChi, FLC in Shanghai
News & Analysis  
3/17/2015   6 comments
The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
Counterfeit SD Card Problem is Widespread
News & Analysis  
3/17/2015   5 comments
Many consumers and corporate buyers find great deals online for SD cards, but find out too late they are counterfeit. Vendors have no real avenue to combat the problem.
ams and ST Team Up to Secure NFC Mobile Payments
News & Analysis  
3/16/2015   1 comment
There are some problems and security issues with NFC. ams AG and STMicroelectronics have collaborated to introduce an NFC system reference design that assures easy, reliable and secure contactless transactions while suiting the form factor of mobile and wearable devices.
5G Challenges Ahead, Experts Say
News & Analysis  
3/13/2015   4 comments
5G was undoubtedly a hot topic at Mobile World Congress, with industry officials and vendors excited about the next-generation communications system. A bevy of legal and economic requirements, however, may temper a bit of the excitement.
PC Drop & iPhone Rumors Color Intel Forecast
News & Analysis  
3/13/2015   9 comments
Intel’s forecast warning raise the issue of its ability to diversify its business. A recent report that Intel’s LTE modems “getting into iPhones in 2016” stirred some noise, but it’s still a rumor at this point.
Smart Glasses Go To Work
News & Analysis  
3/12/2015   1 comment
Epson, Google, Sony and others are seeking traction for their smart glasses among business users, according to exhibitors at an event on wearable devices.
Marvell CEO: The Tinkerer at The Top
News & Analysis  
3/12/2015   10 comments
Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
Sigfox, Sequans: Tale of Two French IoT Firms
News & Analysis  
3/11/2015   4 comments
There is an underlying thread in both 5G and IoT: Diversification. Diversified networks, network topologies and network infrastructures are necessary to enable both. Carriers realize that there will be no one-size-fits-all network for either 5G or IoT.
Taking on Industrial IoT with Real-Time DDS
News & Analysis  
3/11/2015   1 comment
Building on its experience in high reliability Data Distribution Services for the military/aerospace market, Prismtech launchs a "DDS for things" platform for networked devices requiring real-time, deterministic delivery.
SanDisk, Samsung Ramp Up Smartphone Performance
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3/10/2015   Post a comment
SanDisk is overprovisioning TLC NAND to be formatted as SLC where needed, while Samsung speeds up performance using UFS 2.0; both have increased storage capacity to handle more multimedia
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