4DS Memristors Target ReRAMs News & Analysis 10/20/2016 6 comments 4DS Memories Ltd. (West Perth, Western Australia) has achieved the 40-nanometer milestone that puts it on the path to competing effectively with flash it its $40 billion market.
Oxygen Layer May Extend Moore's Law News & Analysis 10/19/2016 2 comments Mears Silicon Technology (MST) at Atomera Inc. (Los Gatos, Calif.) increases the carrier mobility and drive current, while reducing the leakage current for any CMOS transistor.
IBM Weaves New 25G Link News & Analysis 10/14/2016 5 comments IBM announced OpenCAPI, a 25G interconnect for processors, accelerators and memories with backing from seven partners.
Specs Pave Roads Around Xeon News & Analysis 10/11/2016 3 comments Two groups – CCIX and Gen-Z—announced chip interconnects meant to provide open alternatives for the data center to Intel’s Xeon interfaces.
Startup Digs Deep Learning, Snags Big Backers News & Analysis 10/6/2016 3 comments ThinCI, architecture designer for deep learning graph analysis, has come out of stealth mode. The startup picked up Denso and Magna as its investors, while Dadi Perlmutter, former Intel executive vp is giving the startup’s technology a thumbs-up.
Flash Extends Life of Magnetic Tape Machines News & Analysis 10/4/2016 1 comment Magnetic tape has long been a stalwart storage technology, and machines are still alive and well in many industries where it doesn't make financial sense to upgrade to more modern technologies
pMTJ Is Where the MRAM Action Is News & Analysis 9/27/2016 1 comment Another emerging player is ramping up as another layer memory has presented itself as a destination for MRAM and other alternative technologies such as 3D XPoint
Allied with Intel, CEA-Leti Shoots for Moon News & Analysis 9/27/2016 3 comments CEA-Leti's CEA calls the new five-year research contract with Intel a "moonshot." Included in the research framework is for the French institute to provide technologies that enable the next-generation communicationo for Internet of Things.
Chip Market to Go Down, says Future Horizons News & Analysis 9/26/2016 Post a comment Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline for the global semiconductor industry.
Persistent Memory Needs Apps News & Analysis 9/20/2016 6 comments A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Emerging Memories: Ship First, Perfect Later News & Analysis 9/20/2016 1 comment MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
ARM Raises Bar for Safety, Determinism News & Analysis 9/19/2016 4 comments ARM is rolling out what the company describes as its “most advanced processor for safety.” The new processor, dubbed Cortex-R52, is aimed at automotive, industrial and healthcare applications that demand functional safety.
Transistor Trick Beats Moore News & Analysis 9/14/2016 7 comments Zeno Semiconductor, a Zvi-OrBach startup, claims it has discovered a More-that-Moore architecture that can instantly convert any MOSFET to a high-power bipolar-junction transistor (BJT), or even FinFETs.
SGI Supercomputes Ireland News & Analysis 9/8/2016 Post a comment SGI and Irish Centre for High-End Computing (ICHEC) collaborate on the world's most accurate climate modeling aiming to provide accurate weather forecasts.
2016 IC Industry: Who Grabbed What...So Far News & Analysis 9/2/2016 11 comments Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
IC Industry M&A: Who's Left to Buy? News & Analysis 8/31/2016 4 comments Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
SPD Codes Continue to Find Role News & Analysis 8/26/2016 Post a comment JEDEC's JC-45 Committee has approved the 2016 annual release of codes for the SPD for DDR4/DDR4E and for LPDDR3/LPDDR4. What does it mean for device designers?
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
Micron Moves 3D NAND Into Mobile News & Analysis 8/16/2016 Post a comment Micron's first foray into mobile 3D NAND is a 32GB offering aimed at the high and mid-end smartphone segment and is the first to use the Universal Flash Storage 2.1 standard
Cypress New CEO to Bring ‘Outsider’ Perspective News & Analysis 8/11/2016 3 comments Cypress’ new CEO said that the key to success for a semiconductor company is to “become relevant to your customers.” Cypress hopes to become “a tech company that customers want to partner with,” he said.
DRAMs to drag ICs to -2% in 2016 News & Analysis 8/11/2016 Post a comment The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer News & Analysis 8/11/2016 5 comments Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Micron demos 3D XPoint in drives News & Analysis 8/9/2016 2 comments Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
2-D PV to Rival Graphene News & Analysis 8/8/2016 1 comment Department of Energy (DoE) funded researchers have discovered that thinning out the photovoltaic (PV) material called halide perovskite could provide a high-mobility high-power material for future transistors that rivals graphene, but is easier to fabricate.
Oxides Make Ultra Conductor News & Analysis 8/1/2016 Post a comment University of Utah researchers discover how to interface two insulators can make an ultra-high electron density conductor at their interface.
Western Digital Claims First 64-layer 3D NAND Memory News & Analysis 7/27/2016 6 comments Disk drive vendor Western Digital Corp. has claimed that it -- with Toshiba Corp. -- has developed the world's first 64-layer 3D NAND memory and that it is in pilot production at joint-venture production facilities at Yokkaichi, Japan.
Report: Tsinghua Takes Control of XMC News & Analysis 7/27/2016 Post a comment China's Tsinghua Unigroup Ltd., a state-controlled conglomerate that has acquired numerous chip companies, has taken over XMC, otherwise known as Wuhan Xinxin Semiconductor Manufacturing Corp., according to a Bloomberg report.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.