JEDEC Adds UFS Card Spec News & Analysis 4/28/2016 Post a comment The Universal Flash Storage (UFS) family of standards have been updated along with the introduction of a new removable memory card option for the mobile device market
Fab Tool Book-to-Bill Rises News & Analysis 4/22/2016 1 comment North American manufacturers of semiconductor capital equipment posted a book-to-bill ratio above parity for the fourth consecutive month in March, according to the SEMI trade group.
Russia, U.S. Get Closer to Universal Memory News & Analysis 4/18/2016 4 comments Researchers have collaborated to grow an ultra-thin ferroelectric film on silicon, which they believe could become the favored "universal" non-volatile memory material of the future as well as for memristors in brain-line cognitive neuromorphic computers.
Micron Makes More Moves Toward Storage News & Analysis 4/14/2016 Post a comment The memory company outlined a lot of its intentions for the future, including a bigger emphasis on software, but it doesn't change the realities of the DRAM and NAND flash business
Superconductor Nearing Room Temp News & Analysis 4/12/2016 1 comment Superconductors are getting closer and closer to room-temperature operation now that University of Houston has found errors in its theory and Universidad del País Vasco has uncovered its quantum-wave nature.
Sayonara, Japan Semiconductor Inc. News & Analysis 4/12/2016 20 comments The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
Winbond Stacks NOR, NAND Flash News & Analysis 4/11/2016 1 comment SpiStack W25M Series stacks homogeneous or heterogeneous flash to provide memories of varying densities for code and data storage for smaller M2M and IoT devices.
China Facing Long-Term Memory Gap News & Analysis 4/8/2016 1 comment China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
10nm DDR4 DRAM Could Defy Moore News & Analysis 4/7/2016 5 comments Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Chip Market Decline Deepens News & Analysis 4/7/2016 3 comments A chip market decline that began mid-2015 looks set to continue through the first quarter of 2016 at least, with falling markets on an annual basis in all geographies except China.
microSD Cards Well-Suited for Drones News & Analysis 4/5/2016 Post a comment Latest video specs meet desire for high quality action video for consumers and professionals alike, while also supporting simultaneous writes for use in increasingly popular drones
Intel Plans A Future of CMOS News & Analysis 4/5/2016 2 comments Intel plans to continue scaling its CMOS cores by surrounding them with new circuitry using new architectures and materials, such as magnetic memories, Qubits, and GaN transistors.
Intel's Xeon E5 in the Clouds News & Analysis 4/3/2016 Post a comment Intel claims its new Xeon E5-2600v4 and 3-D NAND solid-state drives (SSDs) make migrate to software defined infrastructure in the clouds easier with special hardware features, higher performance and faster message passing/cryptology.
Open-Source Processor Core Ready For IoT News & Analysis 3/31/2016 4 comments Researchers at ETH Zurich and the University of Bologna have developed PULPino, an open-source processor optimized for low power consumption and application in wearables and the Internet of Things.
Ultrasonic LCDs Sans ITO News & Analysis 3/30/2016 2 comments Researchers have demonstrated a prototype liquid crystal display (LCD) that eliminates the need for transparent conductors, such as indium-tin-oxide (ITO), to control the LCD with electric fields, instead using targeted ultrasound to control pixels.
Flash Rides HPE’s Memory Bus News & Analysis 3/29/2016 2 comments Hewlett Packard Enterprise is shipping NVDIMM-N modules, the first in a new line of persistent memory cards analysts say will bolster servers.
3D NAND Fab Seen as Milestone for China News & Analysis 3/22/2016 3 comments Breaking of ground for construction of XMC fab that will eventually produce 200,000 wafers per month signals new phase in development of China's domestic semiconductor manufacturing industry, says analyst.
Apple Invents Emergency Alert System News & Analysis 3/11/2016 1 comment Apple has filed a patent for a medical monitor that can sound an alert based on irregularities in a user’s temperature, heart rate, oxygen level, or blood pressure.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.