Micron, Samsung in Flash Battle News & Analysis 2/5/2016 5 comments Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
Chip Sales Dipped Slightly in 2015 News & Analysis 2/1/2016 Post a comment Despite formidable economic headwinds, semiconductor sales in 2015 fell just short of the record total established in 2014, according to the Semiconductor Industry Association.
Russians' Report Memristors News & Analysis 1/29/2016 2 comments Marvin Minsky, inventor of the Perceptron, may have died, but Russian scientists report they've made the first polymer memristor based Perceptron come alive.
FDSOI Carries on Despite ST Re-org, Says COO News & Analysis 1/28/2016 6 comments STMicroelectronics' withdrawal from the set-top-box business and the transfer of engineers to microcontroller and digital automotive work will not stop the adoption of fully-depleted silicon-on-insulator (FDSOI) manufacturing process, according to Jean-Marc Chery, ST's chief operating officer.
Toshiba to Gut Chip Biz Sans NAND News & Analysis 1/22/2016 2 comments Toshiba Corp. has decided to gut the company’s semiconductor business—except for its NAND flash memory products, Japan’s economic newspaper Nikkei reported Saturday morning.
3D XPoint Steps Into the Light News & Analysis 1/14/2016 8 comments With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
Cypress Unveils Traveo OTA Update MCUs News & Analysis 1/12/2016 Post a comment Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
Chip Forecasts, Drivers Diverge News & Analysis 1/12/2016 5 comments Chip revenues could contract 3%, expand 4% or something in between this year, said analysts at the SEMI trade group's annual executive forum.
Imec Melds Flash/III-V News & Analysis 1/8/2016 7 comments Just as III-V channels can speed the operation of planar silicon transistors, so can vertical flash structures we sped up with InGaAs channels.
China Is Chip Market's Only Growth Region News & Analysis 1/5/2016 1 comment The three-month average of global chip sales for November 2015 declined by 3.0 percent compared with the figure for the same month a year before, according to numbers from World Semiconductor Trade Statistics (WSTS) as reported by the Semiconductor Industry Association (SIA).
AMD Tips Next Graphics Chip News & Analysis 1/4/2016 1 comment Advanced Micro Devices said its next-generation graphics processor, Polaris, will deliver nearly twice the performance/Watt of today’s Nvidia GPUs.
DARPA Funds Atoms-to-Products Breakthrough News & Analysis 12/29/2015 2 comments DARPA funds Atoms-to-Products program with undisclosed funding amounts allotted to 10 companies and universities to maintain quantum nanoscale properties at the millimeter scale of microchips.
Toshiba Reorg Cuts Consumer Unit News & Analysis 12/21/2015 3 comments Toshiba will exit an ailing consumer notebook market but hang on to its profitable NAND flash business in a reorganization that includes 6,800 layoffs.
Microchip Named as Atmel Bidder News & Analysis 12/17/2015 4 comments Microcontroller vendor Microchip Technology Inc. (Chandler, Ariz.) is the company that has made a $3.8 billion unsolicited offer for Atmel Corp. (San Jose, Calif.), according to a Reuters report that referenced an unnamed source.
Leti Strains to Improve FDSOI News & Analysis 12/17/2015 Post a comment French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
TSMC Work on 5nm Process Leaves EUV Undecided News & Analysis 12/15/2015 3 comments Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it has started work on a 5nm process to push ahead its most advanced technology, yet the company remains undecided on the adoption of extreme ultraviolet lithography at that node.
M&A Pace to Accelerate in 2016, Says Survey News & Analysis 12/11/2015 1 comment Semiconductor industry business leaders predict that the number of mergers and acquisitions in 2016 will match or exceed 2015, according to an annual survey of semiconductor industry business leaders conducted by business.
Novel Phase of Carbon Shows Enhanced Electronic Properties News & Analysis 12/3/2015 3 comments Researchers from the North Carolina State University (Rayleigh, NC) have reported the discovery of a novel phase of solid carbon, known as Q-carbon, distinct from the already known phases of graphite and diamond and allotropes such as carbon-60, carbon nanotubes and graphene.
Tsinghua, Infineon Kicking Renesas' Tires News & Analysis 11/23/2015 10 comments Renesas Electronics has become an investment target to suitors outside Japan, including China’s Tsinghua Unigroup and Infineon Technologies in Germany, as Innovation Network Corp. of Japan (INCJ), a government-backed turnaround fund, plans to draw down its investment.
Micron Commits to Pushing OpenMP Standard News & Analysis 11/23/2015 1 comment API for popular shared-memory parallel programming model has gained widespread use for developing parallel applications for platforms ranging from embedded systems and to multicore systems and shared-memory systems
Samsung on Intel's Heels in Chip Vendor Ranking News & Analysis 11/19/2015 2 comments Samsung is set to make in-roads into Intel's lead as the world's largest chip manufacturer in 2015, according to a list of chip companies ranked by forecast chip revenues from market research firm IC Insights.
Report: China Has $47bn Chip Fund Focused on U.S. M&A News & Analysis 11/17/2015 3 comments Tsinghua Unigroup intends to spend 300 billion yuan (about $47 billion) over the next five years to build up China's position in the chip industry, according to the company chairman speaking in an interview given to Reuters.
Intel Scales System Framework News & Analysis 11/16/2015 5 comments Intel is defining a scalable system framework that all its vendors can participate in to create and interoperable ecosystem for all computers, from handhelds to supercomputers.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments