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Micron, Intel Flash 3D NAND
News & Analysis  
3/26/2015   1 comment
Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Intel's Xeon Phi to House 72 Cores
News & Analysis  
3/25/2015   11 comments
Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Micron Tweaks Consumer MLC for Enterprise Storage
News & Analysis  
3/24/2015   Post a comment
FortisFlash provides customers with more tools to fine tune MLC NAND flash for specific use cases and systems while better balancing endurance and performance than eMLC.
Optical Color Shifter Computes Cognitively
News & Analysis  
3/20/2015   2 comments
All optical computers using the neural network paradigm could by pass the speed of silicon computers by using light only and chalcogenide as their material.
Marvell Touts MoChi, FLC in Shanghai
News & Analysis  
3/17/2015   6 comments
The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
Counterfeit SD Card Problem is Widespread
News & Analysis  
3/17/2015   5 comments
Many consumers and corporate buyers find great deals online for SD cards, but find out too late they are counterfeit. Vendors have no real avenue to combat the problem.
Layoffs Hit 1,600 in Cypress Deal
News & Analysis  
3/13/2015   1 comment
Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
Marvell CEO: The Tinkerer at The Top
News & Analysis  
3/12/2015   10 comments
Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
SanDisk, Samsung Ramp Up Smartphone Performance
News & Analysis  
3/10/2015   Post a comment
SanDisk is overprovisioning TLC NAND to be formatted as SLC where needed, while Samsung speeds up performance using UFS 2.0; both have increased storage capacity to handle more multimedia
Intel's 1st Xeon SoC Twists ARM
News & Analysis  
3/9/2015   23 comments
Intel hopes it first Xeon SoC -- the D-1500 -- will be an ARM killer in the micro server market.
MWC Wrap-Up: 15 Curious Things We Spotted
News & Analysis  
3/6/2015   12 comments
The Mobile World Congress has literally morphed into the Everything Connected Show. What we saw ranged from foldable “connected” electric bicycle to connected car keys, a Project Ara Phone, M2M and lots of slideware for the 5G network.
2D Material Beats Graphene
News & Analysis  
3/4/2015   2 comments
Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
Spansion Adds RAM to HyperBus
News & Analysis  
3/2/2015   Post a comment
Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Hi-Speed Transistors from Liquid Processing
News & Analysis  
2/26/2015   10 comments
A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Flash for Even Commodity Servers
News & Analysis  
2/25/2015   Post a comment
SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
Marvell Shakes Up SoCs, DRAMs
News & Analysis  
2/23/2015   10 comments
Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Violin Doubles Down on Flash Fabric Architecture
News & Analysis  
2/23/2015   Post a comment
Veteran all-flash array maker is targeting a wider market for its platform with enterprise-grade data services and aims to be cost-competitive with traditional storage vendors
3D E-Beam Enables 3D NAND Flash
News & Analysis  
2/23/2015   2 comments
Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Intel Carves Tiny SRAMs at 14nm
News & Analysis  
2/22/2015   17 comments
Intel will describe at ISSCC advances based on its 14nm process technology including what it calls the world’s smallest SRAM cell and PCI Express circuit.
Quantum Transistor Harnesses New Effect
News & Analysis  
2/19/2015   2 comments
Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.
Samsung Makes New Package for Smartphones
News & Analysis  
2/17/2015   10 comments
New ePoP package combines DRAM, eMMC, and controller together to reduce footprint in smartphones that could allow for smaller devices, larger batteries or additional features
IBM Adds All Vendors to its Cloud-of-Clouds
News & Analysis  
2/17/2015   1 comment
IBM turns its attention to management software that manages both its own and the cloud-based servers of other vendors in hybrid clouds of clouds.
NeuroMem IC Matches Patterns, Sees All, Knows All
News & Analysis  
2/17/2015   7 comments
NeuroMem, a startup, spun out of General Vision, is betting the farm on the growing demand for pattern recognition in data analytics.
Embedded Engineers: 10 Skills You Need Now
News & Analysis  
2/9/2015   15 comments
From open source software to developing apps, industry professionals urge embedded engineers to get out of their comfort zone and acquire new skills to stay relevant.
Open-Silicon: ‘No Software Runs Without Hardware’
News & Analysis  
2/9/2015   1 comment
As the valuation of high-tech companies goes increasingly lopsided -- disproportionately favoring the software business -- the obvious question is: Who nowadays is willing to get their hands dirty designing high-cost, low-margin hardware?
1.5 nm Metrology Extends Moore's Law
News & Analysis  
2/6/2015   1 comment
Even a ruler can nix Moore's Law. Rulers need to be as much as 10 times finer than the semiconductors they are measure. Thanks to researchers at some US national labs collaborating with industry, the finest metrology tool is now at 1.5 nanometers.
Synopsys Adds Verification IP For Mobile Memories
News & Analysis  
2/4/2015   Post a comment
Consumer applications for UFS, UniProSM and eMMC are driving demand for verification tools to deliver products with tight timelines as the specifications for all three continue to be updated.
Out Googling Google on Big Data Searches
News & Analysis  
2/4/2015   4 comments
Northwestern University professor Luis Amaral has come up with a superior search algorithm that out Google's Google and he is giving it away free.
Rambus ReRAM Attracts First Commercial Customer
News & Analysis  
2/3/2015   8 comments
Emerging memory has potential in niche applications for aerospace and military customers, according to licensee Tezzaron, with broad uses in the future to replace flash and perhaps DRAM in commercial applications
Diamond Qubits: Everybody's Best Friend
News & Analysis  
2/3/2015   1 comment
Quantum computers got a big boost recently when scientists at MIT found a way to embed then in artificial diamonds.
SanDisk's Flash to Go Auto-Grade
News & Analysis  
2/2/2015   5 comments
Now with its memory chips AEC-Q100 certified, SanDisk hopes to make automotive a strong focus, meeting the design and supply needs of Tier Ones and car OEMs.
Quantum Entanglement Now On-a-Chip
News & Analysis  
1/28/2015   6 comments
Uncrackable encryption and quantum computers enabled by tiny 20 micron source of entangled photons according to Italian scientist at di Università degli Studi di Pavia.
Maxim Exits Consumer MEMS, Touch Sensors
News & Analysis  
1/27/2015   3 comments
Maxim Integrated Products Inc. has decided to get out of consumer MEMS and consumer touch sensor markets and focus its sensor business on the automotive sensor. Meanwhile Maxim is making moves into wearable equipment, mainly with the provision of power management ICs.
Increased Functionally Drives Flash Array Adoption
News & Analysis  
1/24/2015   1 comment
Early all-flash arrays were dedicated to a single application, but enterprises are looking for vendors that support mixed workloads and offer data services, and evaluating flash beyond just the cost per gigabyte
Wide-Spread SSD Encryption is Inevitable
News & Analysis  
1/23/2015   3 comments
As vendors have steadily released self-encrypting SSDs for client devices over the past year, the trend is starting to hit enterprise storage and all-flash arrays, driven by customer demand and regulatory changes
FeFET to Extend Moore's Law
News & Analysis  
1/15/2015   10 comments
The successful prototyping of a ferroelectric gate aims to extend Moore's Law beyond the end of the International Technology Roadmap for Semiconductors (ITRS) circa 2028.
SSDs, USB Drives, SD Cards Debut at CES
News & Analysis  
1/14/2015   2 comments
Vendors including Toshiba, SanDisk, Samsung and Kingston all unveiled new or updated flash-based products with more capacity, performance and features
Tablets Will Drive Healthy Mobile DRAM Growth
News & Analysis  
1/13/2015   1 comment
Here’s a closer look at global demand for DRAM through 2018 according to recently released research.
Triple-Level Cell Memory Makes Gains in Storage
News & Analysis  
1/13/2015   1 comment
Triple-level cell has “come out from under a rock,” with 3D NAND not likely to hit its stride until 2016. TLC will make inroads in the data center while single-level cell will be relegated to niche applications.
The Hot, the Odd and the Risky -- Spotted at CES
News & Analysis  
1/13/2015   27 comments
A ton of interesting stuff always surfaces at the International CES. Taken together, it weaves into a tapestry of technology whose threads offer clues to the possibilities we might explore in 2015.
Memory Trends: A Look Ahead
News & Analysis  
1/7/2015   7 comments
EE Times recently spoke with Jennie Grosslight, the memory test product manager at Keysight Technologies, about what she thinks will be the prevailing memory trends in 2015.
Samsung Bolsters Mobile Memory
News & Analysis  
1/7/2015   1 comment
Higher quality video processing, increasing expectations for compute power, IoT, and sensors are driving demand for mobile memory. Samsung hopes to meet this need with its LPDDR4 and wearable-specific chips.
Fonts Could Set IoT Devices Apart
News & Analysis  
1/5/2015   10 comments
Aesthetically pleasing and scalable typefaces might be the factor that makes one IoT device stand out from others, according to Monotype Imaging.
Universal Memory for Instant-On Computing
News & Analysis  
12/24/2014   27 comments
A combination mag/ferro material uses 10X less energy to switch bits.
Memory Design Trends in 2014
News & Analysis  
12/19/2014   1 comment
Memory transitions, increased-density drive design trends: Customers are looking for subsystems that can accommodate both DDR3 and DDR4, while constraint-based design is par for the course as denser memory makes manufacturing more complex.
True 3D Chips Harness Nanotubes
News & Analysis  
12/19/2014   14 comments
Stanford University has learned how to stack any number of layers atop a standard CMOS chip by using low-temperature RRAM for memory and carbon nanotube transistors for logic.
Vote for the Engineer of the Year
News & Analysis  
12/17/2014   3 comments
Finalists announced, survey below. The award, sponsored by National Instruments, includes a $10,000 grant and will be given out at DesignCon 2015.
Keysight Donates EDA Software to Georgia Tech
News & Analysis  
12/15/2014   1 comment
Keysight Technologies continues a tradition that started when the company was part of Agilent.
Emerging NVM Express Spec Has Busy Year
News & Analysis  
12/15/2014   1 comment
Since the organization's incorporation in March, more NVMe products have appeared, the specification has been updated, and new technical workgroups have formed.
Page 1 / 2   >   >>


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Max Maxfield

Teensy-Weensy GPAK4 Mixed Signal FPGAs
Max Maxfield
Post a comment
The vast majority of the embedded designers I know typically create MCU-based systems -- they rarely even consider using a Field-Programmable Gate Array (FPGA).

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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