Cypress Expands Error Correcting Code For SRAM News & Analysis 4/24/2015 Post a comment As overall SRAM market shrinks, Cypress sees uptick in automotive, IoT and wearables segments, while adding on-board error-correcting code to meet reliability requirements and protect against the effects of radiation
WSTS Marks America Up for 2015 Boom News & Analysis 4/21/2015 Post a comment The market for semiconductors in the Americas region will grow by 15 percent in 2015, according to a revised estimate from the World Semiconductor Trade Statistics (WSTS) organization.
TI Obsoletes FPGA News & Analysis 4/21/2015 47 comments Texas Instruments is out to kill the FPGA with a nine processor chip that can downsize avionics, military and medical applications to portable size -- from backpack radars to portable MRIs.
NVM Express SSDs Hit Servers, Workstations News & Analysis 4/20/2015 1 comment HGST begins shipping its Ultrastar SN100 series for servers announced last year as part of its flash fabric, while Samsung aims its latest offering at the PC and workstation segment.
Paper Memory Ready to Roll News & Analysis 4/17/2015 3 comments Researchers at the Finish VTT Technical Research Centre have demonstrated they could print memory circuits directly on paper, using simple roll-to-roll printing techniques with a particular mix of commercially available metallic inks.
Moore's Law: Dead or Alive News & Analysis 4/17/2015 22 comments Moore's Law is still alive and kicking after 50 years, but here are the technologies that are busting and boosting it in the 21st century.
TSMC Cuts Capex by $1 Billion News & Analysis 4/16/2015 4 comments Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
IBM vs. Intel in Supercomputer Bout News & Analysis 4/15/2015 9 comments The Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) project financed by the Department of Energy (DoE) will bring home to the U.S. the fastest supercomputers in the world made by Cray, IBM, Intel and Nvidia.
Intel Does Balancing Act News & Analysis 4/15/2015 Post a comment In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Moore’s Law Hits Middle Age News & Analysis 4/14/2015 6 comments Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Graphene Spintronics Beats All News & Analysis 4/14/2015 7 comments Chalmers University of Technology claims graphene's high-electron mobility enables longer wires without repeaters for future spintronics that encode information on the spin of individual electrons instead of their charge like today.
3D Testing Standardized by SRC News & Analysis 4/14/2015 Post a comment The Semiconductor Research Corp. has standardized Design-for-Test method for 3D chips that has fast throughput by using a single probe to touch several TSV microbumps at the same time.
IBM Sets Memory Density Record News & Analysis 4/9/2015 8 comments IBM set yet another world record in recording density on magnetic tape, maintaining its dominance for archiving and backup, even in the cloud.
Toshiba Ups Ante in 3D NAND Fray News & Analysis 3/31/2015 1 comment Toshiba’s 48-layer BiCS technology will be a stepping stone for the transition from 2D planar NAND with 3D NAND flash production likely to ramp up for all major memory makers in 2016
Why MediaTek Pushes Cross-Device Sharing News & Analysis 3/30/2015 5 comments MediaTek is creating a technology, called CrossMount, that will link and share software and hardware resources of televisions and handheld devices in ways that would fulfill their unrealized potential. What’s behind the Taiwanese IC giant’s ambition?
Researchers Claim 44x Power Cuts News & Analysis 3/30/2015 2 comments Researchers at the University of Illinois invented the worlds first on/off transceiver fast enough for commercialization, saving up to $870 million per year in datacenter power bills.
Micron, Intel Flash 3D NAND News & Analysis 3/26/2015 1 comment Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Intel's Xeon Phi to House 72 Cores News & Analysis 3/25/2015 12 comments Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Marvell Touts MoChi, FLC in Shanghai News & Analysis 3/17/2015 6 comments The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
Layoffs Hit 1,600 in Cypress Deal News & Analysis 3/13/2015 1 comment Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
Marvell CEO: The Tinkerer at The Top News & Analysis 3/12/2015 10 comments Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
MWC Wrap-Up: 15 Curious Things We Spotted News & Analysis 3/6/2015 12 comments The Mobile World Congress has literally morphed into the Everything Connected Show. What we saw ranged from foldable “connected” electric bicycle to connected car keys, a Project Ara Phone, M2M and lots of slideware for the 5G network.
2D Material Beats Graphene News & Analysis 3/4/2015 2 comments Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
Spansion Adds RAM to HyperBus News & Analysis 3/2/2015 Post a comment Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
Graphene Polymer Speeds Electron Transport News & Analysis 2/27/2015 Post a comment Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Hi-Speed Transistors from Liquid Processing News & Analysis 2/26/2015 10 comments A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Flash for Even Commodity Servers News & Analysis 2/25/2015 Post a comment SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
Marvell Shakes Up SoCs, DRAMs News & Analysis 2/23/2015 10 comments Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
3D E-Beam Enables 3D NAND Flash News & Analysis 2/23/2015 2 comments Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Intel Carves Tiny SRAMs at 14nm News & Analysis 2/22/2015 17 comments Intel will describe at ISSCC advances based on its 14nm process technology including what it calls the world’s smallest SRAM cell and PCI Express circuit.
Quantum Transistor Harnesses New Effect News & Analysis 2/19/2015 2 comments Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.