Micron, Intel Flash 3D NAND News & Analysis 3/26/2015 1 comment Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Intel's Xeon Phi to House 72 Cores News & Analysis 3/25/2015 11 comments Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Marvell Touts MoChi, FLC in Shanghai News & Analysis 3/17/2015 6 comments The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
Layoffs Hit 1,600 in Cypress Deal News & Analysis 3/13/2015 1 comment Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
Marvell CEO: The Tinkerer at The Top News & Analysis 3/12/2015 10 comments Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
MWC Wrap-Up: 15 Curious Things We Spotted News & Analysis 3/6/2015 12 comments The Mobile World Congress has literally morphed into the Everything Connected Show. What we saw ranged from foldable “connected” electric bicycle to connected car keys, a Project Ara Phone, M2M and lots of slideware for the 5G network.
2D Material Beats Graphene News & Analysis 3/4/2015 2 comments Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
Spansion Adds RAM to HyperBus News & Analysis 3/2/2015 Post a comment Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
Graphene Polymer Speeds Electron Transport News & Analysis 2/27/2015 Post a comment Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Hi-Speed Transistors from Liquid Processing News & Analysis 2/26/2015 10 comments A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Flash for Even Commodity Servers News & Analysis 2/25/2015 Post a comment SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
Marvell Shakes Up SoCs, DRAMs News & Analysis 2/23/2015 10 comments Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
3D E-Beam Enables 3D NAND Flash News & Analysis 2/23/2015 2 comments Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Intel Carves Tiny SRAMs at 14nm News & Analysis 2/22/2015 17 comments Intel will describe at ISSCC advances based on its 14nm process technology including what it calls the world’s smallest SRAM cell and PCI Express circuit.
Quantum Transistor Harnesses New Effect News & Analysis 2/19/2015 2 comments Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.
Open-Silicon: ‘No Software Runs Without Hardware’ News & Analysis 2/9/2015 1 comment As the valuation of high-tech companies goes increasingly lopsided -- disproportionately favoring the software business -- the obvious question is: Who nowadays is willing to get their hands dirty designing high-cost, low-margin hardware?
1.5 nm Metrology Extends Moore's Law News & Analysis 2/6/2015 1 comment Even a ruler can nix Moore's Law. Rulers need to be as much as 10 times finer than the semiconductors they are measure. Thanks to researchers at some US national labs collaborating with industry, the finest metrology tool is now at 1.5 nanometers.
Rambus ReRAM Attracts First Commercial Customer News & Analysis 2/3/2015 8 comments Emerging memory has potential in niche applications for aerospace and military customers, according to licensee Tezzaron, with broad uses in the future to replace flash and perhaps DRAM in commercial applications
SanDisk's Flash to Go Auto-Grade News & Analysis 2/2/2015 5 comments Now with its memory chips AEC-Q100 certified, SanDisk hopes to make automotive a strong focus, meeting the design and supply needs of Tier Ones and car OEMs.
Quantum Entanglement Now On-a-Chip News & Analysis 1/28/2015 6 comments Uncrackable encryption and quantum computers enabled by tiny 20 micron source of entangled photons according to Italian scientist at di Università degli Studi di Pavia.
Maxim Exits Consumer MEMS, Touch Sensors News & Analysis 1/27/2015 3 comments Maxim Integrated Products Inc. has decided to get out of consumer MEMS and consumer touch sensor markets and focus its sensor business on the automotive sensor. Meanwhile Maxim is making moves into wearable equipment, mainly with the provision of power management ICs.
Increased Functionally Drives Flash Array Adoption News & Analysis 1/24/2015 1 comment Early all-flash arrays were dedicated to a single application, but enterprises are looking for vendors that support mixed workloads and offer data services, and evaluating flash beyond just the cost per gigabyte
Wide-Spread SSD Encryption is Inevitable News & Analysis 1/23/2015 3 comments As vendors have steadily released self-encrypting SSDs for client devices over the past year, the trend is starting to hit enterprise storage and all-flash arrays, driven by customer demand and regulatory changes
FeFET to Extend Moore's Law News & Analysis 1/15/2015 10 comments The successful prototyping of a ferroelectric gate aims to extend Moore's Law beyond the end of the International Technology Roadmap for Semiconductors (ITRS) circa 2028.
Triple-Level Cell Memory Makes Gains in Storage News & Analysis 1/13/2015 1 comment Triple-level cell has “come out from under a rock,” with 3D NAND not likely to hit its stride until 2016. TLC will make inroads in the data center while single-level cell will be relegated to niche applications.
Memory Trends: A Look Ahead News & Analysis 1/7/2015 7 comments EE Times recently spoke with Jennie Grosslight, the memory test product manager at Keysight Technologies, about what she thinks will be the prevailing memory trends in 2015.
Samsung Bolsters Mobile Memory News & Analysis 1/7/2015 1 comment Higher quality video processing, increasing expectations for compute power, IoT, and sensors are driving demand for mobile memory. Samsung hopes to meet this need with its LPDDR4 and wearable-specific chips.
Memory Design Trends in 2014 News & Analysis 12/19/2014 1 comment Memory transitions, increased-density drive design trends: Customers are looking for subsystems that can accommodate both DDR3 and DDR4, while constraint-based design is par for the course as denser memory makes manufacturing more complex.
True 3D Chips Harness Nanotubes News & Analysis 12/19/2014 14 comments Stanford University has learned how to stack any number of layers atop a standard CMOS chip by using low-temperature RRAM for memory and carbon nanotube transistors for logic.
Vote for the Engineer of the Year News & Analysis 12/17/2014 3 comments Finalists announced, survey below. The award, sponsored by National Instruments, includes a $10,000 grant and will be given out at DesignCon 2015.
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...