Quantum Entanglement Now On-a-Chip News & Analysis 1/28/2015 6 comments Uncrackable encryption and quantum computers enabled by tiny 20 micron source of entangled photons according to Italian scientist at di Università degli Studi di Pavia.
Maxim Exits Consumer MEMS, Touch Sensors News & Analysis 1/27/2015 3 comments Maxim Integrated Products Inc. has decided to get out of consumer MEMS and consumer touch sensor markets and focus its sensor business on the automotive sensor. Meanwhile Maxim is making moves into wearable equipment, mainly with the provision of power management ICs.
Increased Functionally Drives Flash Array Adoption News & Analysis 1/24/2015 1 comment Early all-flash arrays were dedicated to a single application, but enterprises are looking for vendors that support mixed workloads and offer data services, and evaluating flash beyond just the cost per gigabyte
Wide-Spread SSD Encryption is Inevitable News & Analysis 1/23/2015 2 comments As vendors have steadily released self-encrypting SSDs for client devices over the past year, the trend is starting to hit enterprise storage and all-flash arrays, driven by customer demand and regulatory changes
FeFET to Extend Moore's Law News & Analysis 1/15/2015 10 comments The successful prototyping of a ferroelectric gate aims to extend Moore's Law beyond the end of the International Technology Roadmap for Semiconductors (ITRS) circa 2028.
Triple-Level Cell Memory Makes Gains in Storage News & Analysis 1/13/2015 1 comment Triple-level cell has “come out from under a rock,” with 3D NAND not likely to hit its stride until 2016. TLC will make inroads in the data center while single-level cell will be relegated to niche applications.
Memory Trends: A Look Ahead News & Analysis 1/7/2015 7 comments EE Times recently spoke with Jennie Grosslight, the memory test product manager at Keysight Technologies, about what she thinks will be the prevailing memory trends in 2015.
Samsung Bolsters Mobile Memory News & Analysis 1/7/2015 1 comment Higher quality video processing, increasing expectations for compute power, IoT, and sensors are driving demand for mobile memory. Samsung hopes to meet this need with its LPDDR4 and wearable-specific chips.
Fonts Could Set IoT Devices Apart News & Analysis 1/5/2015 9 comments Aesthetically pleasing and scalable typefaces might be the factor that makes one IoT device stand out from others, according to Monotype Imaging.
Memory Design Trends in 2014 News & Analysis 12/19/2014 1 comment Memory transitions, increased-density drive design trends: Customers are looking for subsystems that can accommodate both DDR3 and DDR4, while constraint-based design is par for the course as denser memory makes manufacturing more complex.
True 3D Chips Harness Nanotubes News & Analysis 12/19/2014 14 comments Stanford University has learned how to stack any number of layers atop a standard CMOS chip by using low-temperature RRAM for memory and carbon nanotube transistors for logic.
Vote for the Engineer of the Year News & Analysis 12/17/2014 3 comments Finalists announced, survey below. The award, sponsored by National Instruments, includes a $10,000 grant and will be given out at DesignCon 2015.
Foundry Sales Growing Faster Than Chip Market News & Analysis 12/8/2014 4 comments Global foundry IC revenues will grow by 13 percent to $47.9 billion in 2014, following on from annual growth of 13 percent in 2013 and 18 percent in 2012, according to a report produced jointly by the Global Semiconductor Alliance (GSA) and market researcher IC Insights.
eSilicon Offers Try-Before-You-Buy IP Tool News & Analysis 12/3/2014 5 comments eSilicon launched the IP MarketPlace web-based tool for SoC designers. It facilitates browsing IP, encouraging designers to tinker, build, and generate a complete memory subsystem before making a purchase decision.
Hot Technologies: Looking Ahead to 2015 News & Analysis 12/3/2014 3 comments EDN and EE Times explore some of the hot technologies in 2014 that will shape technology trends for next year and beyond as engineers bring even more innovative ideas to reality.
Cypress Bids $4B For Spansion News & Analysis 12/1/2014 13 comments Cypress and Spansion struck a deal to merge into a $2 billion embedded chip company with half its business in memory and an expanded microcontroller portfolio with a strong focus on automotive.
HMC Spec Update Signals Healthy Adoption News & Analysis 11/26/2014 6 comments The release of the Hybrid Memory Cube specification 2.0, along with early-stage products that make use of the potential successor to DRAM, suggests it will gain traction, starting with high-performance computing and networking applications.
OCZ Cuts Into Read-Intensive SSD Segment News & Analysis 11/24/2014 1 comment The SATA-based Saber 1000 Series is yet another option in a crowded market of SSDs specifically targeting read-intensive workloads such as web hosting and distributed computing environments.
Putting Memory on Paper News & Analysis 11/18/2014 6 comments Research shows that paper holds great potential as a low-cost, biodegradable surface for printing electronic circuits and components.
IBM to Build DoE's Next-Gen Coral Supercomputers News & Analysis 11/14/2014 10 comments Bring the processing to the data: IBM won two contracts with the DoE's Collaboration of Oak Ridge, Argonne, and Livermore (Coral) program, which aims to outperform its current supercomputers by not moving data.
Spansion’s Foray Into e.MMC Market News & Analysis 11/11/2014 Post a comment Spansion has rolled out a family of “industrial-grade” embedded MultiMediaCard memory products by using its high-density MLC NAND flash. The company is playing catchup with Micron and Toshiba.
Dense Flash Arrays Find New Niches News & Analysis 11/10/2014 1 comment Skyera's latest all-flash array is an example of how lower prices, as compared to spinning disks, are not the only factor driving adoption of flash arrays inside and outside the data center.
Superconductivity Predicted by Supercomputer News & Analysis 11/5/2014 4 comments Tower Semiconductor Ltd. (Migdal Haemek, Israel) has started manufacturing the military grade MAXL-OL-2000 MEMS-based accelerometer family for fabless chip company Physical Logic AG (Zurich, Switzerland) using a thick-film silicon-on-insulator (SOI) version of its 180nm modular MEMS process.
IoT Data Must Be Prioritized News & Analysis 11/3/2014 2 comments The proliferation of Internet of Things devices may contribute to the big data onslaught, but ultimately this growth of information to be processed by memory and flash must be triaged like any other incoming data.
China Blamed for Microchip Dip News & Analysis 10/30/2014 4 comments Microchip Technology Inc. reported financial results for the second quarter of fiscal 2015 ending Sept. 30. Officials said the company's decrease in sales is a reflection of the economic climate in China rather than internal issues.
Some Memories Never Die News & Analysis 10/28/2014 16 comments When a major memory producer decides a product has hit end of life, there are often customers who still have long-term use for it and there are companies willing to step up to keep those memories alive.
Intel, IBM Dueling 14nm FinFETS News & Analysis 10/21/2014 25 comments The duel of the FinFETs will take place between Intel and GlobalFoundries now that it has taken over manufacturing of semiconductors from IBM with the details of architectures here.
IC Industry Slowdown: True or False? News & Analysis 10/15/2014 10 comments Did Microchip Technology get ahead of itself by suggesting that its downward revenue forecast was a negative bellwether for the whole semiconductor market? Or is there a macro-economic weakness that bodes ill for the chip industry?
PCM Has Muddy Future News & Analysis 10/7/2014 2 comments Phase-change memory faces numerous challenges for mainstream adoption, but some niche applications remain, and even some new use cases only recently developed.
ARM Partners Explore M7 Horizon News & Analysis 10/2/2014 5 comments ARM partners discussed new use cases for the Cortex-M7 MCU, which promises high performance at 5 CoreMark/MHz and 2.14 DMIPs/MHz. Freescale is one of several early ARM partners deploying the M7 in its SoCs; other partners include Dolby and Atmel.
LPDDR3 Is A Half-Step News & Analysis 9/30/2014 Post a comment The rapid evolution of smartphones drove the quick adoption of LPDDR3, but its successor is more thought out and will take over relatively quickly.
Securing Trustworthy & Resilient Chips News & Analysis 9/23/2014 4 comments The National Science Foundation and the Semiconductor Research Corp. are funding a $10 million three-year project to make chips secure, trustworthy, assured, and resilient against hackers.