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TSMC, GF/Samsung Battle at 7nm
News & Analysis  
10/21/2016   12 comments
Globalfoundries and Samsung will detail at IEDM a 7nm process with EUV it claims has the highest density to date.
DRAM Pushes Up Chip Forecast
News & Analysis  
10/20/2016   Post a comment
IC sales could grow 1% this year, up from a previous forecast of a 2% decline, according to a new report from IC Insights.
4DS Memristors Target ReRAMs
News & Analysis  
10/20/2016   6 comments
4DS Memories Ltd. (West Perth, Western Australia) has achieved the 40-nanometer milestone that puts it on the path to competing effectively with flash it its $40 billion market.
ST Blends Security, Performance in IoT MCUs
News & Analysis  
10/20/2016   Post a comment
The STM32H7 series provides high performance and enhanced security along with rich memory resources to simplify high-end IoT design.
Startup Taps Kickstarter To Manufacture Wireless Flash Device
News & Analysis  
10/19/2016   Post a comment
iLuun chose Kickstarter to fund the next phase of its business and validate that there was a market for wireless flash drive that enables users to stream transfer media content to and from their mobile device
Oxygen Layer May Extend Moore's Law
News & Analysis  
10/19/2016   2 comments
Mears Silicon Technology (MST) at Atomera Inc. (Los Gatos, Calif.) increases the carrier mobility and drive current, while reducing the leakage current for any CMOS transistor.
IBM Weaves New 25G Link
News & Analysis  
10/14/2016   5 comments
IBM announced OpenCAPI, a 25G interconnect for processors, accelerators and memories with backing from seven partners.
One-Nanometer Transistor Demonstrated
News & Analysis  
10/13/2016   11 comments
Lawrence Berkeley National Laboratory claims to have created the world's smallest transistor using a single one-nanometer wide carbon nanotube as the gate.
Specs Pave Roads Around Xeon
News & Analysis  
10/11/2016   3 comments
Two groups – CCIX and Gen-Z—announced chip interconnects meant to provide open alternatives for the data center to Intel’s Xeon interfaces.
Better DRAM with No New Materials
News & Analysis  
10/11/2016   12 comments
Kilopass' Vertical Layered Thyristor architecture eliminates the need for power-consuming refresh cycles
Startup Digs Deep Learning, Snags Big Backers
News & Analysis  
10/6/2016   3 comments
ThinCI, architecture designer for deep learning graph analysis, has come out of stealth mode. The startup picked up Denso and Magna as its investors, while Dadi Perlmutter, former Intel executive vp is giving the startup’s technology a thumbs-up.
Flash Extends Life of Magnetic Tape Machines
News & Analysis  
10/4/2016   1 comment
Magnetic tape has long been a stalwart storage technology, and machines are still alive and well in many industries where it doesn't make financial sense to upgrade to more modern technologies
Samsung Calls for New CPU Design
News & Analysis  
9/28/2016   6 comments
Samsung is working on a new processor architecture that leverages its dominance in memory, said a corporate strategist.
pMTJ Is Where the MRAM Action Is
News & Analysis  
9/27/2016   1 comment
Another emerging player is ramping up as another layer memory has presented itself as a destination for MRAM and other alternative technologies such as 3D XPoint
Allied with Intel, CEA-Leti Shoots for Moon
News & Analysis  
9/27/2016   3 comments
CEA-Leti's CEA calls the new five-year research contract with Intel a "moonshot." Included in the research framework is for the French institute to provide technologies that enable the next-generation communicationo for Internet of Things.
Chip Market to Go Down, says Future Horizons
News & Analysis  
9/26/2016   Post a comment
Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline for the global semiconductor industry.
Get Online Help for Memory, I/O Optimization
News & Analysis  
9/21/2016   Post a comment
eSilicon is upgrading with the launch of Star Navigator, new additions to the company’s online tool suite, this time focused on memory IP and I/O libraries.
Startup Tips Machine Learning Chip
News & Analysis  
9/21/2016   3 comments
Wave Computing will describe a machine-learning chip at an event showing increasing specialization in microprocessor designs.
Persistent Memory Needs Apps
News & Analysis  
9/20/2016   6 comments
A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Emerging Memories: Ship First, Perfect Later
News & Analysis  
9/20/2016   1 comment
MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
ARM Raises Bar for Safety, Determinism
News & Analysis  
9/19/2016   4 comments
ARM is rolling out what the company describes as its “most advanced processor for safety.” The new processor, dubbed Cortex-R52, is aimed at automotive, industrial and healthcare applications that demand functional safety.
GF Debuts 7nm, Embedded MRAM
News & Analysis  
9/15/2016   18 comments
Globalfoundries described its 7nm FinFET process for 2018 and an embedded MRAM option for its 22nm FD-SOI process.
Linde Starts Specialty Gases R&D in Taiwan
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9/14/2016   Post a comment
Linde Group, one of the world’s largest suppliers of specialty gases for the semiconductor industry, has established what it says will be a world-leading R&D facility in Taiwan.
Transistor Trick Beats Moore
News & Analysis  
9/14/2016   7 comments
Zeno Semiconductor, a Zvi-OrBach startup, claims it has discovered a More-that-Moore architecture that can instantly convert any MOSFET to a high-power bipolar-junction transistor (BJT), or even FinFETs.
SGI Supercomputes Ireland
News & Analysis  
9/8/2016   Post a comment
SGI and Irish Centre for High-End Computing (ICHEC) collaborate on the world's most accurate climate modeling aiming to provide accurate weather forecasts.
2016 IC Industry: Who Grabbed What...So Far
News & Analysis  
9/2/2016   11 comments
Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
Fujitsu Is Licensee of Nantero's Carbon-Nanotube RAM
News & Analysis  
9/1/2016   16 comments
Fabless chip company Fujitsu Semiconductor and foundry Mie Fujitsu Semiconductor have both announced that they are licensees of carbon-nanotube non-volatile memory technology from Nantero Inc. (Woburn, Mass.).
Non-Volatile Memories Morph Industry Collaboration
News & Analysis  
9/1/2016   Post a comment
Emerging technologies benefit from early interaction with customers, particularly new paradigms such as NVMe.
IC Industry M&A: Who's Left to Buy?
News & Analysis  
8/31/2016   4 comments
Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
SPD Codes Continue to Find Role
News & Analysis  
8/26/2016   Post a comment
JEDEC's JC-45 Committee has approved the 2016 annual release of codes for the SPD for DDR4/DDR4E and for LPDDR3/LPDDR4. What does it mean for device designers?
Laser Slicing to Slash SiC Wafer Costs, Boost Yield
News & Analysis  
8/22/2016   1 comment
Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
Micron Moves 3D NAND Into Mobile
News & Analysis  
8/16/2016   Post a comment
Micron's first foray into mobile 3D NAND is a 32GB offering aimed at the high and mid-end smartphone segment and is the first to use the Universal Flash Storage 2.1 standard
Cypress New CEO to Bring ‘Outsider’ Perspective
News & Analysis  
8/11/2016   3 comments
Cypress’ new CEO said that the key to success for a semiconductor company is to “become relevant to your customers.” Cypress hopes to become “a tech company that customers want to partner with,” he said.
DRAMs to drag ICs to -2% in 2016
News & Analysis  
8/11/2016   Post a comment
The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer
News & Analysis  
8/11/2016   5 comments
Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Intel to Acquire Deep Learning Nervana
News & Analysis  
8/10/2016   Post a comment
Intel intends to acquire Nervana Systems for its upcoming deep-learning accelerator chip along with its Neon cloud service.
Micron demos 3D XPoint in drives
News & Analysis  
8/9/2016   2 comments
Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
2-D PV to Rival Graphene
News & Analysis  
8/8/2016   1 comment
Department of Energy (DoE) funded researchers have discovered that thinning out the photovoltaic (PV) material called halide perovskite could provide a high-mobility high-power material for future transistors that rivals graphene, but is easier to fabricate.
Toshiba Samples 64-Layer 3D Flash at 256 Gbit Density
News & Analysis  
8/3/2016   1 comment
Toshiba Corporation has disclosed the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure, a 64-layer device that it claims as the first to start sample shipments.
Oxides Make Ultra Conductor
News & Analysis  
8/1/2016   Post a comment
University of Utah researchers discover how to interface two insulators can make an ultra-high electron density conductor at their interface.
China’s LeEco to Acquire Vizio for $2 Billion
News & Analysis  
7/29/2016   Post a comment
Upstart Chinese tech firm ponies up for one of North America's largest TV suppliers.
Rambus Aims DDR4 PHY at Data Centers
News & Analysis  
7/28/2016   Post a comment
Focus for company is improving interface between memory and CPU networking and data center customers
Marvell Swings to Loss in Delayed Report
News & Analysis  
7/27/2016   Post a comment
New CEO Matthew Murphy says he is looking to trim the fat and focus on profitable businesses.
Western Digital Claims First 64-layer 3D NAND Memory
News & Analysis  
7/27/2016   6 comments
Disk drive vendor Western Digital Corp. has claimed that it -- with Toshiba Corp. -- has developed the world's first 64-layer 3D NAND memory and that it is in pilot production at joint-venture production facilities at Yokkaichi, Japan.
Report: Tsinghua Takes Control of XMC
News & Analysis  
7/27/2016   Post a comment
China's Tsinghua Unigroup Ltd., a state-controlled conglomerate that has acquired numerous chip companies, has taken over XMC, otherwise known as Wuhan Xinxin Semiconductor Manufacturing Corp., according to a Bloomberg report.
ADI to Acquire Linear Tech for $14.8 Billion
News & Analysis  
7/26/2016   15 comments
Latest semiconductor industry blockbuster deal would combine analog chip heavyweights.
FDSOI to Get Embedded MRAM, Flash Options at 28nm
News & Analysis  
7/26/2016   1 comment
Samsung Foundry is going to offer both spin torque transfer magnetic RAM (STT-MRAM) and flash as embedded non-volatile memory options on its 28nm FDSOI manufacturing process.
TI Stays Steady Without Blockbuster Deal
News & Analysis  
7/25/2016   Post a comment
Texas Instruments, which has shied away from the sort of blockbuster acquisitions made by peers over the past two years, continues to post strong sales and profits.
Flash Media Data Destruction Guaranteed
News & Analysis  
7/25/2016   5 comments
If an SSD suddenly fails in an enterprise environment, it can't usually be wiped successfully, so DestructData created the FlashEx for optimal physical destruction
IP Pioneer Mark Templeton Dies
News & Analysis  
7/25/2016   Post a comment
Co-founder and former president of Artisan Components drown July 17 while kayaking on Oregon's Rogue River.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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