Latest Content tagged with Memory Designline
Samsung Spinoff Likely to Grab Foundry Share
News & Analysis 5/16/2017 8 comments
Samsung's chip operations consisting of memory and system LSI will be split into three, making the foundry business an independent unit. The move is expected to increase Samsung’s share at the expense of TSMC and smaller rivals.
HPE Builds Big Data Server
News & Analysis 5/16/2017 4 comments
Hewlett Packard Enterprise built its first full-scale version of the Machine, a 160-TByte research prototype to test benefits of a big main memory.
Imec Tips Novel AI Chips
News & Analysis 5/16/2017 2 comments
The Imec research institute described work on two low cost self-learning chips that use MRAM and ReRAM arrays rather than neural networks.
Cray Rolls Clustered Supercomputers for AI
News & Analysis 5/12/2017 1 comment
Cray's new CS-Storm 500GT and CS-Storm 500NX supercomputers are optimized for artificial intelligence applications with massive arrays of Nvidia Tesla GPU accelerators that perform deep machine learning.
iNAND Drives Toward Automotive Market
News & Analysis 5/11/2017 1 comment
SanDisk's flash technology, now a part of Western Digital, has seen most of its development on the mobile front, but automotive applications will outpace smartphones with its demands for flash storage.
Future Cars Face Terabyte Memory Load
News & Analysis 5/10/2017 2 comments
For a highly automated car in, say, 2020, how much memory capacity, to capture, process and store data, will be enough? An industry consensus is this connected vehicle will require data storage of close to a terabyte.
3-D Graphene Boosts Electronics
News & Analysis 5/2/2017 1 comment
A three dimensional form of graphene is being explored as a next-generation electronics material by Nobel Prize winners for graphene research at the Moscow Institute of Physics and Technology.
DoE Claims 1nm Fab Record
News & Analysis 5/1/2017 3 comments
Department of Energy's (DoE's) Brookhaven National Laboratory has demonstrated how to use an electron beam microscope to lithographically pattern at the 1nm feature size, thus creating novel new materials and devices.
Politics Muddy Toshiba Bidding
News & Analysis 4/29/2017 8 comments
As the second round of bidding for Toshiba’s coveted memory business draws near, the opaque process is exposing a deep schism of interests in Japan among politicians, bureaucrats and bankers. But did anyone ask what engineers want?
Faster Networks Push Interface Development
News & Analysis 4/28/2017 2 comments
Rambus' memory and interface portfolio, including its recently launched 56G SerDes PHY, is being guided by long-reach backplane requirements for 400 GB Ethernet applications, as well as 5G wireless networks
Intel Boosts CapEx 20%
News & Analysis 4/27/2017 5 comments
Intel will boost capital spending 20 percent this year and next to ramp 3D NAND and 3DXP memories, it said reporting quarterly financial gains.
KKR, INCJ Team For New Toshiba Bid
News & Analysis 4/21/2017 9 comments
The U.S. private equity fund KKR will be partnering with a Japanese public-private fund – Innovation Network Corp. of Japan (INCJ) – to bid jointly for Toshiba’s memory unit, Japan’s economic newspaper Nikkei reported Friday.
Single-Pixel Camera Mimics Human Eye
News & Analysis 4/21/2017 3 comments
A single-pixel camera is ultra-inexpensive requiring only a single scanning photocell the works smart by targeting details with higher-resolution and backgrounds with less.
Rambus, Microsoft Heat Up With Cold DRAM
News & Analysis 4/17/2017 4 comments
Rambus, in collaboration with Microsoft researchers, has succeeded in prototyping DRAM operating below 90 kelvin. Cryogenic memory will be essential to data centers, “currently the fastest growing consumer of memory” in the industry, said Rambus chief scientist.
Quantum Photons Emitted
News & Analysis 4/12/2017 3 comments
Japanese researchers discover that nitrogen-doped gallium-arsenide beat quantum dots in consistency as single-photon emitters for future quantum computers.
Hon Hai Bids $27 Billion for Toshiba Chip Unit
News & Analysis 4/11/2017 17 comments
Hon Hai, the world’s largest electronics contract manufacturer, has topped rival bidders with a 3 trillion yen ($27 billion) offer to force through the acquisition of Toshiba Corp’s semiconductor unit, according to press reports.
Machine Learning Comes to Chip Design
News & Analysis 4/6/2017 3 comments
Chip designers are hearing AI’s footsteps as it encroaches on their design work. Solido Design Automation, which has been applying its home-grown machine-learning algorithms to its software, is making its crown jewel available to customers via Machine Learning Labs.
Intel Shows Life Beyond CMOS
News & Analysis 4/3/2017 2 comments
At the International Symposium on Physical Design Intel presented more than dozen different ways to get beyond the limitations of conventional complementary metal oxide semiconductors while using the same fabs.