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Cypress Expands Error Correcting Code For SRAM
News & Analysis  
4/24/2015   Post a comment
As overall SRAM market shrinks, Cypress sees uptick in automotive, IoT and wearables segments, while adding on-board error-correcting code to meet reliability requirements and protect against the effects of radiation
EDA Tool Speeds FinFET Design
News & Analysis  
4/22/2015   Post a comment
Mentor Graphics new Calibre xACT tool extracts parasitic capacitance, resistance and inductance quickly and accurately.
Samsung Busts TSMC's 'Monopoly,' Analysts Say
News & Analysis  
4/21/2015   2 comments
Samsung has broken the monopoly in leading-edge foundry services recently held by Taiwan Semiconductor Manufacturing Co. (TSMC), according to analysts who cover the chipmakers.
WSTS Marks America Up for 2015 Boom
News & Analysis  
4/21/2015   Post a comment
The market for semiconductors in the Americas region will grow by 15 percent in 2015, according to a revised estimate from the World Semiconductor Trade Statistics (WSTS) organization.
TI Obsoletes FPGA
News & Analysis  
4/21/2015   47 comments
Texas Instruments is out to kill the FPGA with a nine processor chip that can downsize avionics, military and medical applications to portable size -- from backpack radars to portable MRIs.
NVM Express SSDs Hit Servers, Workstations
News & Analysis  
4/20/2015   1 comment
HGST begins shipping its Ultrastar SN100 series for servers announced last year as part of its flash fabric, while Samsung aims its latest offering at the PC and workstation segment.
Paper Memory Ready to Roll
News & Analysis  
4/17/2015   3 comments
Researchers at the Finish VTT Technical Research Centre have demonstrated they could print memory circuits directly on paper, using simple roll-to-roll printing techniques with a particular mix of commercially available metallic inks.
Moore's Law: Dead or Alive
News & Analysis  
4/17/2015   22 comments
Moore's Law is still alive and kicking after 50 years, but here are the technologies that are busting and boosting it in the 21st century.
TSMC Cuts Capex by $1 Billion
News & Analysis  
4/16/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
Odds of Success of Mie Fujitsu, Japan’s Pure-Play Foundry
News & Analysis  
4/16/2015   2 comments
Mie Fujitsu Semiconductor is a foundry born from Fujitsu’s lack of any better options. Its genesis raises questions about the odds of Mie Fujitsu’s survival. We asked Mie Fujitsu President hard questions.
IBM vs. Intel in Supercomputer Bout
News & Analysis  
4/15/2015   9 comments
The Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) project financed by the Department of Energy (DoE) will bring home to the U.S. the fastest supercomputers in the world made by Cray, IBM, Intel and Nvidia.
Intel Does Balancing Act
News & Analysis  
4/15/2015   Post a comment
In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Worldwide Semi Revenue Grew 7.9% in 2014, According to Gartner
News & Analysis  
4/15/2015   Post a comment
Booming DRAM market sees revenue increase 32 percent during 2014.
Moore’s Law Hits Middle Age
News & Analysis  
4/14/2015   6 comments
Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Graphene Spintronics Beats All
News & Analysis  
4/14/2015   7 comments
Chalmers University of Technology claims graphene's high-electron mobility enables longer wires without repeaters for future spintronics that encode information on the spin of individual electrons instead of their charge like today.
3D Testing Standardized by SRC
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4/14/2015   Post a comment
The Semiconductor Research Corp. has standardized Design-for-Test method for 3D chips that has fast throughput by using a single probe to touch several TSV microbumps at the same time.
Netlist Extends NVDIMMs with EXPRESSvault
News & Analysis  
4/13/2015   Post a comment
Latest non-volatile memory offering combines DRAM and MLC flash for use as a block storage or as a persistent memory extension
Intel, Samsung Up, Qualcomm, Toshiba Down in Chip Vendor Ranking
News & Analysis  
4/10/2015   Post a comment
Gartner Inc. has produced an updated top-ten chip vendor ranking for 2014 based on companies' final financial results.
Taiwan Chipmakers Prepare to Transport Water as Drought Worsens
News & Analysis  
4/10/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest chip foundry, and other chipmakers on the island say they are prepared to ship water supplies to their fabs here if drought conditions worsen.
Panzura Doubles Flash Controller Capacity
News & Analysis  
4/10/2015   Post a comment
Increasing flash at the edge allows for faster file access and synchronization for organizations will multiple offices that need to collaborate
IBM Sets Memory Density Record
News & Analysis  
4/9/2015   8 comments
IBM set yet another world record in recording density on magnetic tape, maintaining its dominance for archiving and backup, even in the cloud.
Nanotube Circuits Learn Functions
News & Analysis  
4/8/2015   1 comment
Durham University researchers teach nanotube circuits how to perform their functions by evolutionary learning.
Vote Today! Best Nanotech
News & Analysis  
4/7/2015   1 comment
The National Nanotechnology Initiative opens going voting on its best and brightest projects by clicking on its image in a special gallery.
CoolCube 3D Goes Monolithic
News & Analysis  
4/2/2015   4 comments
The University of Grenoble Alpes (France) has developed their CoolCube 3D chips using a monolithic method.
Toshiba Ups Ante in 3D NAND Fray
News & Analysis  
3/31/2015   1 comment
Toshiba’s 48-layer BiCS technology will be a stepping stone for the transition from 2D planar NAND with 3D NAND flash production likely to ramp up for all major memory makers in 2016
Why MediaTek Pushes Cross-Device Sharing
News & Analysis  
3/30/2015   5 comments
MediaTek is creating a technology, called CrossMount, that will link and share software and hardware resources of televisions and handheld devices in ways that would fulfill their unrealized potential. What’s behind the Taiwanese IC giant’s ambition?
Researchers Claim 44x Power Cuts
News & Analysis  
3/30/2015   2 comments
Researchers at the University of Illinois invented the worlds first on/off transceiver fast enough for commercialization, saving up to $870 million per year in datacenter power bills.
SanDisk Goes For Big Data Flash Market
News & Analysis  
3/27/2015   Post a comment
InfiniFlash storage platform puts company in competition with customers and aims to deliver flash capacity at a price point competitive with hard disk drives
Toughening Up LPDDR4 and Parallel NOR Flash For Automotive
News & Analysis  
3/27/2015   Post a comment
Ignoring the consumer market for now, Micron has introduced its newest generation of LDDR4 DRAMs and parallel NOR flash memory devices into the automotive market.
Micron, Intel Flash 3D NAND
News & Analysis  
3/26/2015   1 comment
Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Intel's Xeon Phi to House 72 Cores
News & Analysis  
3/25/2015   12 comments
Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Micron Tweaks Consumer MLC for Enterprise Storage
News & Analysis  
3/24/2015   Post a comment
FortisFlash provides customers with more tools to fine tune MLC NAND flash for specific use cases and systems while better balancing endurance and performance than eMLC.
Optical Color Shifter Computes Cognitively
News & Analysis  
3/20/2015   2 comments
All optical computers using the neural network paradigm could by pass the speed of silicon computers by using light only and chalcogenide as their material.
Marvell Touts MoChi, FLC in Shanghai
News & Analysis  
3/17/2015   6 comments
The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
Counterfeit SD Card Problem is Widespread
News & Analysis  
3/17/2015   5 comments
Many consumers and corporate buyers find great deals online for SD cards, but find out too late they are counterfeit. Vendors have no real avenue to combat the problem.
Layoffs Hit 1,600 in Cypress Deal
News & Analysis  
3/13/2015   1 comment
Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
Marvell CEO: The Tinkerer at The Top
News & Analysis  
3/12/2015   10 comments
Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
SanDisk, Samsung Ramp Up Smartphone Performance
News & Analysis  
3/10/2015   Post a comment
SanDisk is overprovisioning TLC NAND to be formatted as SLC where needed, while Samsung speeds up performance using UFS 2.0; both have increased storage capacity to handle more multimedia
Intel's 1st Xeon SoC Twists ARM
News & Analysis  
3/9/2015   23 comments
Intel hopes it first Xeon SoC -- the D-1500 -- will be an ARM killer in the micro server market.
MWC Wrap-Up: 15 Curious Things We Spotted
News & Analysis  
3/6/2015   12 comments
The Mobile World Congress has literally morphed into the Everything Connected Show. What we saw ranged from foldable “connected” electric bicycle to connected car keys, a Project Ara Phone, M2M and lots of slideware for the 5G network.
2D Material Beats Graphene
News & Analysis  
3/4/2015   2 comments
Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
Spansion Adds RAM to HyperBus
News & Analysis  
3/2/2015   Post a comment
Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Hi-Speed Transistors from Liquid Processing
News & Analysis  
2/26/2015   10 comments
A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Flash for Even Commodity Servers
News & Analysis  
2/25/2015   Post a comment
SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
Marvell Shakes Up SoCs, DRAMs
News & Analysis  
2/23/2015   10 comments
Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Violin Doubles Down on Flash Fabric Architecture
News & Analysis  
2/23/2015   Post a comment
Veteran all-flash array maker is targeting a wider market for its platform with enterprise-grade data services and aims to be cost-competitive with traditional storage vendors
3D E-Beam Enables 3D NAND Flash
News & Analysis  
2/23/2015   2 comments
Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Intel Carves Tiny SRAMs at 14nm
News & Analysis  
2/22/2015   17 comments
Intel will describe at ISSCC advances based on its 14nm process technology including what it calls the world’s smallest SRAM cell and PCI Express circuit.
Quantum Transistor Harnesses New Effect
News & Analysis  
2/19/2015   2 comments
Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.
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