FDSOI Driving ST's Automotive Biz News & Analysis 5/27/2016 Post a comment STMicroelectronics says the fully-depleted silicon-on-insulator chip manufacturing process it championed has become almost the default choice for digital manufacturing within its automotive and discrete group.
Ultra-Dense 3-D Packaging for IoT News & Analysis 5/25/2016 2 comments The next generation of Internet of Things (IoT) devices will keep shrinking their package sizes, instead of transistor sizes, thus extending beyond the end of Moore's Law.
Foundries' Sales Show Hard Times Continuing News & Analysis 5/23/2016 2 comments Taiwanese foundries TSMC and UMC, two partial bellwethers of the semiconductor sector, have both indicate with recent sales figures that a chip market slow down that lasted through the winter is not yet over.
Graphene Patterned at Room Temp News & Analysis 5/5/2016 3 comments Graphene is easily grown with chemical vapor deposition (CVD) on copper foil, but a simple way of etching out the necessary circuit patterns and transferring them to a non-metallic substrate has eluded engineers. Now researchers at the University of Illinois (Urbana-Champaign) claim to have a one-step room temperature process for quickly patterning and transferring graphene circuits to flexible substrates using a simple shadow mask.
Former Intel Exec Perlmutter to Chair ReRam Startup News & Analysis 5/4/2016 5 comments David Perlmutter, a former executive vice president and chief product officer at Intel, has agreed to be non-executive chairman of Weebit Nano, a startup formed to commercialize silicon dioxide resistive RAM technology.
Analog Brain to Simulate Real Thing News & Analysis 5/4/2016 3 comments The Moscow Institute of Physics and Technology (MIPT) is working on building electronic brains using analog components that operate like real biological brains, unlike the digitally emulated electronic brains being built in the best by companies like IBM.
Activist Investor Attacks Vex Chipmakers News & Analysis 5/4/2016 10 comments Beyond Yahoo, Apple and Sony, chip vendors have been targeted by activist investors. The big change now is that hedge fund investors -- whose focus used to be on small to medium companies -- are now getting much bolder.
Chip Sales Edge Up Slightly News & Analysis 5/3/2016 2 comments The Semiconductor Industry Association reported that chip sales increased slightly in March compared with February, but sales for the first quarter were down sequentially and year-over-year.
JEDEC Adds UFS Card Spec News & Analysis 4/28/2016 Post a comment The Universal Flash Storage (UFS) family of standards have been updated along with the introduction of a new removable memory card option for the mobile device market
Fab Tool Book-to-Bill Rises News & Analysis 4/22/2016 1 comment North American manufacturers of semiconductor capital equipment posted a book-to-bill ratio above parity for the fourth consecutive month in March, according to the SEMI trade group.
Russia, U.S. Get Closer to Universal Memory News & Analysis 4/18/2016 4 comments Researchers have collaborated to grow an ultra-thin ferroelectric film on silicon, which they believe could become the favored "universal" non-volatile memory material of the future as well as for memristors in brain-line cognitive neuromorphic computers.
Micron Makes More Moves Toward Storage News & Analysis 4/14/2016 Post a comment The memory company outlined a lot of its intentions for the future, including a bigger emphasis on software, but it doesn't change the realities of the DRAM and NAND flash business
Superconductor Nearing Room Temp News & Analysis 4/12/2016 1 comment Superconductors are getting closer and closer to room-temperature operation now that University of Houston has found errors in its theory and Universidad del País Vasco has uncovered its quantum-wave nature.
Sayonara, Japan Semiconductor Inc. News & Analysis 4/12/2016 20 comments The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
Winbond Stacks NOR, NAND Flash News & Analysis 4/11/2016 1 comment SpiStack W25M Series stacks homogeneous or heterogeneous flash to provide memories of varying densities for code and data storage for smaller M2M and IoT devices.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.