Lossy Adesto Preps IPO News & Analysis 10/8/2015 Post a comment Fabless nonvolatile memory company Adesto Technologies Corp. (Sunnyvale, Calif.) has plans to raise up to $56.6 million via an initial public offering of shares in the company.
M'soft Attacks Apple with Win 10 News & Analysis 10/6/2015 2 comments Microsoft unveiled new Surface, Lumia and Microsoft Band devices on Tuesday, highlighting how its new hardware will take advantage of Windows 10 for enterprise.
ARM Joins Semiconductor Research Corp. News & Analysis 10/1/2015 Post a comment Processor intellectual property licensor ARM Holdings plc (Cambridge, England) has joined the global research collaboration program operated by the Semiconductor Research Corp. (Research Triangle, North Carolina).
IBM Nanotubes May Redefine Future of Moore's Law News & Analysis 10/1/2015 24 comments A new carbon nanotube transistor breakthrough from IBM Research could leave silicon transistors behind in the dust. IBM researchers say they can achieve angstrom (1/10 of a nanometer) scale nanotube transistors someday, starting at the 3-to-5 nanometer node.
ASICs Memory Bandwidth Issue Fix Offered News & Analysis 10/1/2015 8 comments Open-Silicon claims to have solved the memory bandwidth problem to ASICs by integrating 3D stacked memory chips inside the same system-in-package with a 1,024-bit wide interface that beats all off-chip memory architectures.
3D Memory Chips May Beat 3D Hybrid Memory Cube News & Analysis 9/30/2015 Post a comment A memory chip goes beyond Micron's 3D Hybrid Memory Cube by doubling the number of memory die to eight, but now its adding analog, mixed signal, MEMS and the sensors to the mix--enabling systems-on-chip to pack at lease 18 layers into the same footprint of its Integrated Sensor Platform.
PCs, Not Profits, Drive Chip Companies News & Analysis 9/29/2015 4 comments while PCs are refreshed twice a year and a company could have a design win every six months. When two public companies have to respond to investors and continue to innovate at a rapid clip, even short-term success in a flat market is preferable to long-term innovation that won’t immediately pay off
Optical Phase-Change Memory Can Increase Bandwidth News & Analysis 9/28/2015 1 comment A research team from the universities of Oxford and Muenster has developed a phase-change, non-volatile memory that is programmed and read using light and which could be interfaced to conventional electronic processor for higher bandwidth.
Neuromorphic Chip Market to Rise News & Analysis 9/24/2015 26 comments Markets-and-Markets predicts that the neuromorphic chip market will finally take off in 2016, after repeated such predictions every decade since 1980.
Dresden Memory Startup To Debut At Semicon Europa News & Analysis 9/15/2015 4 comments A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
4K Video Drives Up LPDDR4 Densities News & Analysis 9/14/2015 1 comment Mobile phones producing high-quality video make them a high priority target for DRAM, although devices such as smart appliances and automotive systems are also a growing market.
AMD Forms Graphics Chip Business Group News & Analysis 9/10/2015 2 comments AMD, which was reportedly considering spinning off its graphics chip business earlier this summer, has created the Radeon Technologies group to “solidify position as graphics industry leader.”
DARPA Enlists Civilians to Secure U.S. Tech Lead News & Analysis 9/10/2015 4 comments The Defense Advanced Research Projects Agency (DARPA) hosts a three-day conference called "Wait What?" (St. Louis, Mo.) for researchers in industry, academia and government to share ideas that will keep the U.S. ahead of the rest of the world in technology.
Apple Unveils New Chips For Mobile News & Analysis 9/9/2015 2 comments Apple rented out the Bill Graham Civic Auditorium -- a 7,000 person capacity arena in downtown San Francisco -- to unveil a handful of devices that are much, much smaller. The company’s new iPad and iPhone will run new processors with an updated architecture.
Post-Silicon Tech Compared News & Analysis 9/9/2015 4 comments The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flash Patents Reduce SMB Storage Costs News & Analysis 9/1/2015 Post a comment Although the price of flash is dropping, not all enterprises can afford to overprovision SSDs. Patents recently granted to StorTrends optimize use of flash and extend its longevity.
3D NAND Debuts in Storage Arrays News & Analysis 8/28/2015 1 comment Kaminario said it will offer an all-flash storage array with 3D TLC NAND at a buck per gig. It’s ahead of the curve for now, but lower cost flash seems inevitable as does the downfall of spinning disk
EUV Breaks Through to Angstrom News & Analysis 8/27/2015 10 comments A new type of extreme ultraviolet (EUV) microscope designed at the University of Colorado can take optical images with angstrom resolution.
Quantum Highway Frictionless News & Analysis 8/24/2015 4 comments Marrying topological insulators with ferromagnets yields a quantum highway that could be adapted to encode, transmit and receive qubits using novel transistor designs, according to MIT researchers.
SK Hynix Invests in Hyperspectral Sensor Startup News & Analysis 8/21/2015 1 comment SK Hynix has invested 2.2 billion won (about $1.8 million) in Stratio Technology Inc. (Menlo Park, Calif.), a startup developing germanium-based hyperspectral image sensors, according to Korea Times article. SK Hynix has acquired a 9.1 percent stake the article said.
Intel Memory Bus Draws Fire News & Analysis 8/20/2015 26 comments Intel’s plans to sell memory cards using proprietary extensions to the DDR4 bus is drawing fire from potential customers and competitors afraid of being locked in or out of its 3D XPoint technology.
Rambus to Enter Fabless Chip Biz News & Analysis 8/17/2015 9 comments Seizing the opportunity in a growing market of datacenters, Rambus is unveiling a server memory interface chipset. The move is significant because the company will enter a fabless chip business for the first time, instead of IP business.
Samsung Slims Phones, Boosts Displays News & Analysis 8/13/2015 Post a comment Banking on trends toward larger screens, Samsung unveiled two new smartphones with larger displays in a smaller form factor. The Samsung S6 Edge+ and Note 5 will be available in the U.S. and Canada on Aug. 21.
RRAM Breaks Records with Graphene News & Analysis 8/13/2015 17 comments Rice University professor James Tour and his group have developed a new type of nonvolatile resistive random access memory (RRAM) that overcomes the density limits of other designs by requiring no transistors, switches or diodes for bit cells, and it can be processed at low-temperatures for easy stacking in three dimensions (3D).
Samsung Drives Up 3-D Flash News & Analysis 8/11/2015 1 comment Samsung announced a handful of novel products using its 3-D NAND flash chips, but the mass market for such products may be more than a year away, said analysts.
CoolCube Circuit Stacking Moves to FinFET Process News & Analysis 8/5/2015 3 comments The CEA-Leti research laboratory at Grenoble France, has reported that its CoolCube 3D interconnect technology is suitable for use with FinFET manufacturing processes as well as with fully-depleted silicon-on-insulator manufacturing processes.
Indian Fab Project Hires Former GloFo Exec News & Analysis 8/3/2015 7 comments Indian foundry fab will be located near Indore in Madhya Pradesh. The company reports that talks are moving the project forward on all fronts including: funding, technology and customers.
NASA Preps Venus ICs News & Analysis 8/3/2015 Post a comment NASA is sending a mission to Venus, where the surface temperature is up to 932 degrees Fahrenheit--hot enough to melt lead and to turn aluminum into a slurry. What electronics could survive? One company uses silicon carbide wafers and a mystery metal to fabricate the mixed signal chips for the Venus Landsailing Rover.