Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Sony PS4 Goes Monolithic, Says Chipworks Slideshow 11/15/2013 17 comments The PS4 uses a single die CPU/GPU and one main shared 8GB memory array. We therefore expected to see a single die under the main processor package, with no separate DRAM die in package, and no embedded DRAM on the main die. This is indeed what we have found. A huge monolithic die of 20 x 20mm.
UFS Set to Eclipse e-MMC News & Analysis 11/11/2013 2 comments Vendors such as Toshiba see UFS meeting demand for high performance and capacity as early as next year, but don’t write off e-MMC just yet.
EE Times Community Weighs In on Toyota Case News & Analysis 11/7/2013 27 comments EE Times readers took Toyota’s unintended acceleration case to heart. After all, Toyota’s failures, pointed out by the expert witnesses, aren’t just Toyota’s problems. Its failures are relevant to all the hard choices engineers make.
Apple iPad Air Packs Faster A7 News & Analysis 11/1/2013 14 comments Early teardown results suggest a slightly faster A7 in the Apple iPad Air than in the iPhone 5 but few other surprises, according to Chipworks and iFixit.
Toyota Case: Vehicle Testing Confirms Fatal Flaws News & Analysis 10/31/2013 68 comments With gag orders, code reviews locked in windowless rooms, and a car attached to a dynamometer, Bookout v Toyota had enough engineering intrigue to make a good thriller. But what the experts found was serious stuff. Here's how they showed the defects that cause unintended acceleration.
SK Hynix Licenses BeSang's 3D IC News & Analysis 10/29/2013 8 comments Besang's 3D IC technology finds a home at SK Hynix, which has licensed it for undisclosed future chips – probably 3D DRAM that is 100-times denser than stacked die.
Perfect iPad Add-On for Engineers Uses MEMS News & Analysis 10/11/2013 11 comments Kickstarter project leverages MEMS magnetometers from STMicroelectronics to create iSketchnote, an iPad cover that tracks a passive pen with a permanent magnet as the user draws on plain paper.
Mike Noonen, GloFo Executive VP, Resigns News & Analysis 10/7/2013 19 comments Mike Noonen has resigned from his position as the executive vice president at GlobalFoundries. Noonen was responsible for global products, design, sales, and marketing at the world’s second largest foundry.
IEDM Set to Stage FinFET vs. FDSOI News & Analysis 9/27/2013 28 comments The leading-edge of semiconductor technology becomes more complex, and IEDM is there to bear witness -- and stage FinFET versus FDSOI, the battle for sub-20nm semiconductors.
Freescale, Micron Extend Memory Research News & Analysis 9/24/2013 2 comments Freescale Semiconductor and Micron Technology have extended separate memory research partnerships in attempts to add to their capabilities at the leading-edge of chip production and find technology that can scale beyond the limits of NAND flash memory.