Moore’s Law Hits Middle Age News & Analysis 4/14/2015 6 comments Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Energy Harvesters Power Wearables News & Analysis 4/13/2015 1 comment Researchers at North Carolina State University are developing nanotechnology-enabled energy harvesting and storage for ultra-low power sensors. The federally-funded research aims to create battery-free, body-powered wearable health monitors.
A New Kilogram Standard Made of Silicon? News & Analysis 3/23/2015 Post a comment For years, scientists around the globe pondered how a new definition for the kilogram could look like a definition less prone to aging and impermanence than the current standard kilogram, a small cylinder made of an alloy of platinum and iridium. The German institute for metrology PTB now claims to have the recipe.
Patent Filings: Who Made the Cut for Top 50? News & Analysis 3/19/2015 5 comments We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Benchmark Stresses Big Chips News & Analysis 2/26/2015 6 comments The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
2nd TransAsia To Crash in a Year News & Analysis 2/4/2015 35 comments The second TransAsia Airway's French-made ATR-72 aircraft to crash within a year indicates technology problems with engines despite pristine record for craft over last decade.
Backplanes Hit a Wall at 56G News & Analysis 1/29/2015 11 comments Backplane-based systems are hitting a wall at 56 Gbit/second speeds, driving a debate over a need for new materials, signaling and equalization, said a Rambus engineer at DesignCon.
TSVs to Split More Chips: Re-Integration is the Focus News & Analysis 1/28/2015 1 comment At the European 3D TSV summit which took place in Grenoble's Minatec center last week, all of the speakers seemed to agree on one thing: in many fields including the consumer market, 2.5D integration (through the use of interposers) is going to remain cost-competitive for a while with real 3D vertical integration. And this could lead to major shifts in the electronics manufacturing landscape.
Fried Cable Sparked EE Profession News & Analysis 1/27/2015 7 comments The electrical engineering profession was sparked in the late 1800s by a fried transatlantic telegraph cable, said a DesignCon keynoter and Stanford professor.
Memory Trends: A Look Ahead News & Analysis 1/7/2015 7 comments EE Times recently spoke with Jennie Grosslight, the memory test product manager at Keysight Technologies, about what she thinks will be the prevailing memory trends in 2015.
Vote for the Engineer of the Year News & Analysis 12/17/2014 3 comments Finalists announced, survey below. The award, sponsored by National Instruments, includes a $10,000 grant and will be given out at DesignCon 2015.
Researchers Superconduct at 140 Degrees News & Analysis 12/15/2014 8 comments Researchers have demonstrated a method of making superconductors at temperatures as high as 140 degrees Fahrenheit using lasers. If successful, everything from the electric grid to mobile electronics will experience a tremendous speed-up while simultaneously running much cooler.
Tiny Spectrometer Targets IoT News & Analysis 12/12/2014 35 comments NanoLambda has developed an ultra-compact, low-cost spectrometer-on-a-chip to measure concentration and density based on wavelength. The chip is accurate to 1 nm with 10nm resolution for consumer and medical uses.
AMS Acquires Sensor Company News & Analysis 12/8/2014 3 comments Analog chipmaker ams now will acquire acam-messelectronic, a vendor of highly accurate time-based measurement technology and related sensor solutions.
Hot Technologies: Looking Ahead to 2015 News & Analysis 12/3/2014 3 comments EDN and EE Times explore some of the hot technologies in 2014 that will shape technology trends for next year and beyond as engineers bring even more innovative ideas to reality.
Breathalyzer Detects Diseases News & Analysis 11/14/2014 19 comments What if, with one big breath, you could determine your liver function or glucose levels? Researchers at the State University of New York, Stony Brook have developed a diagnostic breathalyzer that will make connotations with blood alcohol content a thing of the past.
Touchdown! ESA Lands on Comet News & Analysis 11/14/2014 2 comments See how a mission 20 years in the making made history when a spacecraft successfully achieved a bouncy but soft landing on a comet.
Tiny Tattoos Sense Health News & Analysis 11/13/2014 3 comments Researchers at the University of California San Diego Center for Wearable Sensors have prototypes for several tiny, inexpensive sensors, including tattoos and micro needles, that will target the health market.
Dell Research Updates Progress News & Analysis 11/10/2014 3 comments A year after its formation, Dell’s research arm is making strides in communications and focus on big data in medicine. Dell Research head Jai Menon talks future development in mobility, security, and machine learning.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.