Metallic Nanoparticles May Lower Solar Cost News & Analysis 7/29/2015 Post a comment While the domestic solar energy industry grew 34% last year, fundamental technical breakthroughs are still needed to hit the national goal of reducing the cost of solar electricity to 6 cents per kilowatt-hour. Researchers at Rice University say they have found a way reduce the costs of photovoltaic solar cells.
Bell Labs Bucks Short-Term Research Trend News & Analysis 7/15/2015 Post a comment Solving networking problems is both an immediate and long-term goal for Bell Labs, as well as an interesting insight into its research strategy. While some legacy laboratories favor 2- or 3-year projects, Bell Labs emphasizes longer-term research.
Bell Labs Plugs in to the Network News & Analysis 7/9/2015 Post a comment The famed Bell Labs is not dead, President Marcus Weldon said. While some may think the multi-Nobel Prize winning research institute has fallen from glory in the past few years, the Alcatel-Lucent facility has kicked networking research into high gear.
Crash Test Dummy Tenses Up Before Impact News & Analysis 7/8/2015 1 comment Toyota adds posture simulation to its virtual THUMS (Total Human Model for Safety) crash test dummy, making it possible to simulate different body postures during subsequent phases of a collision.
Samsung Boosts Batteries with Graphene News & Analysis 7/6/2015 Post a comment Researchers from Samsung’s Advanced Institute of Technology (SAIT), the company’s R&D hub, have found a way to extend lithium-ion battery life using silicon and graphene. The carbide-free graphene combats expansion to increase battery life by 1.8x over conventional lithium-ion batteries.
Intel President, Execs Step Down News & Analysis 7/2/2015 11 comments Intel President Renée James is among several top executives who announced plans to resign from the chip giant. Three other executives from various divisions will also leave the company.
TI Offers Wearable Evaluation Kit News & Analysis 6/11/2015 Post a comment Texas Instrument's (TI's) digital light processing (DLP) LightCrafter Display 4710 evaluation module (EVM) allows engineers to assess its smallest 1080p .47-inch tilt and roll pixel (TRP) array for wearables and other small electronic devices like screenless TVs and pico-projectors.
Free Service Compares Devices News & Analysis 6/8/2015 4 comments The General Purpose Input/Output free service for engineers tests in their independent lab, and compares, all the integrated circuits (ICs) in specific categories, then posts results online, which often differ sharply from those published in the manufacturers specification sheet.
Google Gestures at 60 GHz News & Analysis 5/29/2015 3 comments Google unveiled a radar-on-chip for fine gesture control with the goal of expanding increasingly small screens and interfaces. While the radar technology isn’t yet authorized by the FCC, Google’s ATAP team wants to fine tune its Soli chip for wearables.
EAG Adds IC Analytical Tools News & Analysis 5/18/2015 Post a comment The company that specializes in failure analysis and testing has invested in new IR emission microscopes, scanning acoustic microscopy, and decapsulation tools.
Moore’s Law Hits Middle Age News & Analysis 4/14/2015 6 comments Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Energy Harvesters Power Wearables News & Analysis 4/13/2015 1 comment Researchers at North Carolina State University are developing nanotechnology-enabled energy harvesting and storage for ultra-low power sensors. The federally-funded research aims to create battery-free, body-powered wearable health monitors.
A New Kilogram Standard Made of Silicon? News & Analysis 3/23/2015 Post a comment For years, scientists around the globe pondered how a new definition for the kilogram could look like a definition less prone to aging and impermanence than the current standard kilogram, a small cylinder made of an alloy of platinum and iridium. The German institute for metrology PTB now claims to have the recipe.
Patent Filings: Who Made the Cut for Top 50? News & Analysis 3/19/2015 5 comments We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Benchmark Stresses Big Chips News & Analysis 2/26/2015 6 comments The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
2nd TransAsia To Crash in a Year News & Analysis 2/4/2015 35 comments The second TransAsia Airway's French-made ATR-72 aircraft to crash within a year indicates technology problems with engines despite pristine record for craft over last decade.
Backplanes Hit a Wall at 56G News & Analysis 1/29/2015 11 comments Backplane-based systems are hitting a wall at 56 Gbit/second speeds, driving a debate over a need for new materials, signaling and equalization, said a Rambus engineer at DesignCon.
TSVs to Split More Chips: Re-Integration is the Focus News & Analysis 1/28/2015 1 comment At the European 3D TSV summit which took place in Grenoble's Minatec center last week, all of the speakers seemed to agree on one thing: in many fields including the consumer market, 2.5D integration (through the use of interposers) is going to remain cost-competitive for a while with real 3D vertical integration. And this could lead to major shifts in the electronics manufacturing landscape.
Fried Cable Sparked EE Profession News & Analysis 1/27/2015 7 comments The electrical engineering profession was sparked in the late 1800s by a fried transatlantic telegraph cable, said a DesignCon keynoter and Stanford professor.
Memory Trends: A Look Ahead News & Analysis 1/7/2015 7 comments EE Times recently spoke with Jennie Grosslight, the memory test product manager at Keysight Technologies, about what she thinks will be the prevailing memory trends in 2015.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.