California's 102 fabs deal with uncertain power outlook News & Analysis 1/29/2001 Post a comment SAN JOSE -- California's electricity crisis is causing some chip makers with wafer fabs and related facilities in the state to re-examine their manufacturing strategies. If California's power problems keep growing, a sizable portion of the U.S. chip-manufacturing capacity could be threatened, according to wafer fab statistics.
Java chip vendors set for cellular skirmish News & Analysis 1/29/2001 Post a comment As NTT Docomo releases its long-promised Java-based service this week for more than 17 million i-Mode subscribers in Japan, Java silicon vendors, feeling vindicated, say the time is ripe for their Java acceleration solutions.
NEC joins suppliers backing Quad Data Rate SRAMs News & Analysis 1/29/2001 Post a comment SAN JOSE -- NEC Corp. today announced it was joining Cypress Semiconductor Corp. and Micron Technology Inc. to support new Quad Data Rate (QDR) static RAMs for high-performance memories in switches, routers, and other systems applications with data rates above 200 MHz.
Vendors prep arsenals for DRAM architecture battle News & Analysis 1/26/2001 Post a comment This year could be pivotal in the battle over DRAM architectures as PC-133, double-data-rate and Rambus memories all make their way into the hands of PC vendors, which are as anxious as their memory and chip set suppliers to learn the market's preferences.
Philips Semi, Gemplus, Intermec propose compatible RFID protocol News & Analysis 1/26/2001 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors here along with partners Gemplus S.A. of France and U.S.-based Intermec Technologies Corp. announced a joint proposal for compatible radio-frequency ID systems used in smart cards, identification tags, labels, and other RFID applications.
Taiwan looks to shift manufacturing to the mainland News & Analysis 1/25/2001 Post a comment As the Taiwan government prepares to relax restrictions on investments in China, the sound of blueprints unrolling across boardroom tables can be heard throughout Taipei. They call it "mainland fever," the lure of cheap labor and land just 80 miles across the Taiwan Strait.
Auto consortium releases in-vehicle electronics spec News & Analysis 1/23/2001 Post a comment The Automotive Multimedia Interface Collaboration Inc. (AMI-C) published the initial release of its specifications for in-vehicle electronic devices on Monday (Jan. 22). The specs, now available on the AMI-C Web site, represent the first attempt by some of the world's biggest automakers to establish a common interface for adding cell phones, personal digital assistants, navigation systems, CD players, video screens, digital radios, in-car PCs and a host of othe
1394 serial-bus group aims to link with wireless standards News & Analysis 1/22/2001 Post a comment SANTA CLARA, Calif.---Jan. 22, 2001--Branching out from its original serial-bus focus, the 1394 Trade Association today announced efforts to create a new wireless working group to address connectivity with radio-frequency networks between computers, peripherals, and consumer electronics.
Fairchild to buy Intersil's power chip business for $338 million News & Analysis 1/22/2001 Post a comment SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. has announced plans to acquire the discrete power chip business from Intersil Corp. for $338 million in cash. The purchase is aimed at making Fairchild the world's second largest supplier of power MOSFET devices with about 20% of the $3 billion market.
Blackouts cost Silicon Valley 'millions,' says group News & Analysis 1/19/2001 Post a comment SAN JOSE -- California's power companies halted the rolling blackouts in the state--at least for today. But the damages are still being felt by electronics companies in California and elsewhere.
Following a severe energy crisis in the state, a significant number of IC makers, chip-equipment suppliers, contract manufacturers, and OEMs in northern and central California were hit with power outages on Wednesday and Thursday
Axcelis seeks injunction against Applied's Swift implanters News & Analysis 1/19/2001 Post a comment BEVERLY, Mass. -- A patent fight between Axcelis Technologies Inc. here and Applied Materials Inc. heated up this week with Axcelis asking a federal court in Massachusetts to stop its rival from selling a new ion implantation system. Axcelis' CEO added that Applied was "trampling" the company's intellectual property rights and competing unfairly.
Silicon Image chips add audio support to DVI link News & Analysis 1/18/2001 Post a comment Silicon Image has developed a new version of the Digital Visual Interface that includes support for audio for the first time. Though not yet accepted as the next spin of the DVI standard, the work is stirring the ongoing debate over which digital interface, DVI or IEEE 1394, will become the mainstay for consumer electronics systems such as set-top boxes.
Micron validates DDR modules, plans higher speed grades News & Analysis 1/18/2001 Post a comment BOISE, Idaho--Micron Technology Inc. today announced validation of double data rate (DDR) SDRAM modules by Advanced Micron Devices Inc. and Via Technologies Inc. The DDR SDRAM dual in-line memory modules were validated with AMD's 760 and Via's Apollo Pro266 chip sets, said Micron.
Teradyne expects 20% drop in tester shipments in Q1 News & Analysis 1/17/2001 Post a comment BOSTON--Test equipment supplier Teradyne Inc. here posted $789.2 million in sales and a net income of $117.7 million for the fourth quarter of 2000, but the company also lowered projections for system shipments by 20% in Q1 this year from the just-ended period.
inSilicon rolls out latest core for single-chip USB 2.0 designs News & Analysis 1/16/2001 Post a comment SAN JOSE --In a move to support single-chip designs for the Universal Serial Bus 2.0 specification, inSilicon Corp. today announced its initial USB 2.0 physical layer (PHY) core aimed at reducing component count in systems with integrated mixed-signal functions. The mixed-signal USB 2 PHY core results from inSilicon's collaboration with Tality LLP, a design services supplier spun out of Cadence Design Systems Inc.
Amkor to open China IC-packaging/test plant News & Analysis 1/16/2001 Post a comment CHANDLER, Ariz.--Amkor Technology Inc. today announced plans to open its first chip assembly and testing plant in China as competition for IC-manufacturing services heats up in the communist country. Amkor said its new facility in Shanghai will initially assemble and test finished ICs for baseband processors and controllers in the third quarter of 2001.
Rambus revenues jump to $34.7 million as SDRAM royalties kick in News & Analysis 1/11/2001 Post a comment LOS ALTOS, Calif. -- A surge in DRAM-related royalties pushed Rambus Inc.'s net revenues to a record $34.7 million in the company's first fiscal quarter, ended Dec. 31. Rambus' revenues were 191% higher than $11.9 million in the same quarter a year ago, and 29% above the prior three-month period.
Karl Suss develops probe head for measurements up to 110 GHz News & Analysis 1/11/2001 Post a comment MUNICH -- Karl Suss, a unit of Suss MicroTec AG, has introduced a new probe head for testing advanced communications devices with measurements up to 110 GHz. The PH300HF has been designed for stable measurements in the very high frequency (VHF) range without phase errors, said the company.
Matsushita won't join Mitsubishi on 300-mm fab News & Analysis 1/11/2001 Post a comment TOKYO -- Mitsubishi Electric Corp. has invited the Matsushita Group to join the company in sharing the cost of a new 300-mm wafer fab, which was announced this week for Mitsubishi's production site in Kochi, Japan (see Jan. 9 story). But Matsushita, which has partnered with Mitsubishi in system-on-chip (SoC) process development, has rebuffed the proposal.
VerticalNet CEO leaves b2b exchange for "bricks-and-mortar" world News & Analysis 1/8/2001 Post a comment Joseph Galli, who took the helm of b2b exchange operator in July, will become president and chief executive officer of housewares makers Newell Rubbermaid Inc. Michael Hagan, VerticalNet's co-founder and chief operating officer, will take over the position of president and CEO, the Horsham, Pa., company said.
ASML plans to refile for U.S. review of SVG purchase News & Analysis 1/8/2001 Post a comment VELDHOVEN, the Netherlands -- ASM Lithography N.V. today announced plans to refile a petition for U.S. review of its planned purchase of Silicon Valley Group Inc., which must receive government approval under a law covering foreign acquisitions technologies considered crucial for defense systems.
Philips invests in Bluetooth partner Silicon Wave News & Analysis 1/5/2001 Post a comment LAS VEGAS--Silicon Wave Inc. today announced an alliance with Philips Components to jointly develop PC peripheral products incorporating radio modem ICs, controllers, and protocol stack software for Bluetooth wireless communications systems.
LSI Logic launches ADSL front-end chips from Datapath acquisition News & Analysis 1/4/2001 Post a comment MILPITAS, Calif. -- LSI Logic Corp. has added a pair of integrated analog front-end ICs to its portfolio of broadband products for asymmetric digital subscriber line (ADSL) systems. The two new SpeedReach devices require a single power supply--unlike competing solutions--and LSI Logic said mixed-signal integration reduces the number of components required in systems.
Rambus wins ITC decisions in SDRAM patent case News & Analysis 1/3/2001 Post a comment WASHINGTON -- The U.S. International Trade Commission in a year-end action upheld Rambus Inc.'s request to withdraw its synchronous DRAM patent infringement case against Hyundai Electronics Industries Co., while overturning restrictions on Rambus on future new cases that might be filed with the ITC.
Chip sales moving back to normal 17% growth in Q1, says SIA News & Analysis 1/3/2001 Post a comment SAN JOSE -- Worldwide chip sales are heading back to normal annual growth rates of 17% in the first quarter of 2001 after increasing 37.1% in 2000, said George Scalise, president of the Semiconductor Industry Association. The U.S. trade group president today insisted that the outlook for semiconductor markets remains strong despite a slowdown in growth that began in September when major chip customers started delaying orders to clear out their inventories.
Mitsubishi inks SDRAM, DDR pact with Rambus News & Analysis 1/2/2001 Post a comment MOUNTAIN VIEW, Calif. -- Mitsubishi Electric Corp. today became the seventh chip maker to announced it was licensing Rambus Inc.'s patents for synchronous DRAMs, double data rate (DDR) memories, and controllers that interface to those devices.
Tegal licenses dual-frequency etch patents to Applied Materials News & Analysis 1/2/2001 Post a comment PETALUMA, CALIF. -- Tegal Corp. here today announced it has granted a non-exclusive license to Applied Materials Inc. for U.S. patents covering dual-frequency etch technology. Under the pact, Applied Materials will pay Tegal an undisclosed one-time sum for use of the company's patents for specific wafer-processing applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.