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Content tagged with Test & Measurement Designline posted in January 2001
Yokogawa, Ando team up to accelerate chip tester growth
News & Analysis  
1/31/2001   Post a comment
TOKYO -- Yokogawa Electric Corp. and Ando Electric Co. Ltd. today announced plans to collaborate in semiconductor test and measurement systems. At the same time, NEC Corp. disclosed it was planning to sell all of its shares in Ando to Yokogawa.
Teradyne system takes probers out of package test
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1/30/2001   Post a comment
Making a more aggressive push into the wafer-probe space, Teradyne Inc. has unveiled a memory test system with an architecture specifically designed for high-parallel test and repair of DRAM wafers.
California's 102 fabs deal with uncertain power outlook
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1/29/2001   Post a comment
SAN JOSE -- California's electricity crisis is causing some chip makers with wafer fabs and related facilities in the state to re-examine their manufacturing strategies. If California's power problems keep growing, a sizable portion of the U.S. chip-manufacturing capacity could be threatened, according to wafer fab statistics.
Java chip vendors set for cellular skirmish
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1/29/2001   Post a comment
As NTT Docomo releases its long-promised Java-based service this week for more than 17 million i-Mode subscribers in Japan, Java silicon vendors, feeling vindicated, say the time is ripe for their Java acceleration solutions.
NEC joins suppliers backing Quad Data Rate SRAMs
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1/29/2001   Post a comment
SAN JOSE -- NEC Corp. today announced it was joining Cypress Semiconductor Corp. and Micron Technology Inc. to support new Quad Data Rate (QDR) static RAMs for high-performance memories in switches, routers, and other systems applications with data rates above 200 MHz.
Axcelis blasts Applied for statements about review of patent claim
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1/26/2001   Post a comment
BEVERLY, Mass.--Axcelis Technologies Inc. today said Applied Materials Inc. admitted in court that it had attempted to anonymously challenge the validity of an Axcelis patent for radio-frequency linear accelerator technology used in high-energy ion implantation.
Vendors prep arsenals for DRAM architecture battle
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1/26/2001   Post a comment
This year could be pivotal in the battle over DRAM architectures as PC-133, double-data-rate and Rambus memories all make their way into the hands of PC vendors, which are as anxious as their memory and chip set suppliers to learn the market's preferences.
Philips Semi, Gemplus, Intermec propose compatible RFID protocol
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1/26/2001   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors here along with partners Gemplus S.A. of France and U.S.-based Intermec Technologies Corp. announced a joint proposal for compatible radio-frequency ID systems used in smart cards, identification tags, labels, and other RFID applications.
Court suspends Axcelis lawsuit against Applied
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1/25/2001   Post a comment
SANTA CLARA, Calif. -- Applied Materials Inc. today said a federal court in Massachusetts has suspended a patent lawsuit filed by Axcelis Technologies Inc., which claims that Applied's new Swift ion implanters were violating its technology (see Jan. 8 story).
Taiwan looks to shift manufacturing to the mainland
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1/25/2001   Post a comment
As the Taiwan government prepares to relax restrictions on investments in China, the sound of blueprints unrolling across boardroom tables can be heard throughout Taipei. They call it "mainland fever," the lure of cheap labor and land just 80 miles across the Taiwan Strait.
Chip equipment index at lowest point in two years during December
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1/23/2001   Post a comment
SAN JOSE -- The book-to-bill ratio for North American-based suppliers of chip-production tools slipped to 1.03 in December from a revised reading of 1.12 in November, reported the Semiconductor Equipment and Materials International (SEMI) trade group today.
Auto consortium releases in-vehicle electronics spec
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1/23/2001   Post a comment
The Automotive Multimedia Interface Collaboration Inc. (AMI-C) published the initial release of its specifications for in-vehicle electronic devices on Monday (Jan. 22). The specs, now available on the AMI-C Web site, represent the first attempt by some of the world's biggest automakers to establish a common interface for adding cell phones, personal digital assistants, navigation systems, CD players, video screens, digital radios, in-car PCs and a host of othe
Corning will buy Tropel to expand into metrology, precision optics
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1/23/2001   Post a comment
CORNING, N.Y. -- Corning Inc. here today announced plans to acquire Tropel Corp., a supplier of optical products and metrology instruments, for about $190 million in cash and stock.
1394 serial-bus group aims to link with wireless standards
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1/22/2001   Post a comment
SANTA CLARA, Calif.---Jan. 22, 2001--Branching out from its original serial-bus focus, the 1394 Trade Association today announced efforts to create a new wireless working group to address connectivity with radio-frequency networks between computers, peripherals, and consumer electronics.
Fairchild to buy Intersil's power chip business for $338 million
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1/22/2001   Post a comment
SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. has announced plans to acquire the discrete power chip business from Intersil Corp. for $338 million in cash. The purchase is aimed at making Fairchild the world's second largest supplier of power MOSFET devices with about 20% of the $3 billion market.
Blackouts cost Silicon Valley 'millions,' says group
News & Analysis  
1/19/2001   Post a comment
SAN JOSE -- California's power companies halted the rolling blackouts in the state--at least for today. But the damages are still being felt by electronics companies in California and elsewhere. Following a severe energy crisis in the state, a significant number of IC makers, chip-equipment suppliers, contract manufacturers, and OEMs in northern and central California were hit with power outages on Wednesday and Thursday
Axcelis seeks injunction against Applied's Swift implanters
News & Analysis  
1/19/2001   Post a comment
BEVERLY, Mass. -- A patent fight between Axcelis Technologies Inc. here and Applied Materials Inc. heated up this week with Axcelis asking a federal court in Massachusetts to stop its rival from selling a new ion implantation system. Axcelis' CEO added that Applied was "trampling" the company's intellectual property rights and competing unfairly.
Silicon Image chips add audio support to DVI link
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1/18/2001   Post a comment
Silicon Image has developed a new version of the Digital Visual Interface that includes support for audio for the first time. Though not yet accepted as the next spin of the DVI standard, the work is stirring the ongoing debate over which digital interface, DVI or IEEE 1394, will become the mainstay for consumer electronics systems such as set-top boxes.
Micron validates DDR modules, plans higher speed grades
News & Analysis  
1/18/2001   Post a comment
BOISE, Idaho--Micron Technology Inc. today announced validation of double data rate (DDR) SDRAM modules by Advanced Micron Devices Inc. and Via Technologies Inc. The DDR SDRAM dual in-line memory modules were validated with AMD's 760 and Via's Apollo Pro266 chip sets, said Micron.
Credence prepares for year-long downturn in chip-tester markets
News & Analysis  
1/18/2001   Post a comment
FREMONT, Calif.--Credence Systems Corp. here warned of lower-than-expected revenues for IC testers in its current fiscal quarter, ending Jan. 31, and the company's CEO said it could take up to one year for the industry to pull out of its apparent downturn in demand.
TI locates 3G wireless center in India
News & Analysis  
1/17/2001   Post a comment
Texas Instruments (India) is setting up a 3G Wireless Center in Bangalore, its first in India and its third worldwide.
Teradyne expects 20% drop in tester shipments in Q1
News & Analysis  
1/17/2001   Post a comment
BOSTON--Test equipment supplier Teradyne Inc. here posted $789.2 million in sales and a net income of $117.7 million for the fourth quarter of 2000, but the company also lowered projections for system shipments by 20% in Q1 this year from the just-ended period.
Amkor adds halide-free BGAs to environmentally friendly IC packages
News & Analysis  
1/16/2001   Post a comment
CHANDLER, Ariz.--Amkor Technology Inc. today announced an expansion of its "environmentally friendly" chip-packaging products with new halide-free versions of ball-grid arrays (BGAs).
inSilicon rolls out latest core for single-chip USB 2.0 designs
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1/16/2001   Post a comment
SAN JOSE --In a move to support single-chip designs for the Universal Serial Bus 2.0 specification, inSilicon Corp. today announced its initial USB 2.0 physical layer (PHY) core aimed at reducing component count in systems with integrated mixed-signal functions. The mixed-signal USB 2 PHY core results from inSilicon's collaboration with Tality LLP, a design services supplier spun out of Cadence Design Systems Inc.
Amkor to open China IC-packaging/test plant
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1/16/2001   Post a comment
CHANDLER, Ariz.--Amkor Technology Inc. today announced plans to open its first chip assembly and testing plant in China as competition for IC-manufacturing services heats up in the communist country. Amkor said its new facility in Shanghai will initially assemble and test finished ICs for baseband processors and controllers in the third quarter of 2001.
Qualcomm invests in ChipPac's China expansion for guaranteed capacity
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1/16/2001   Post a comment
SAN DIEGO--Qualcomm Inc. here today announced a $25 million investment in ChipPac Inc.'s semiconductor assembly and test operations in China. The investment and a new supply agreement guarantees backend chip-production capacity to Qualcomm for wireless modem ICs in China.
Rambus revenues jump to $34.7 million as SDRAM royalties kick in
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1/11/2001   Post a comment
LOS ALTOS, Calif. -- A surge in DRAM-related royalties pushed Rambus Inc.'s net revenues to a record $34.7 million in the company's first fiscal quarter, ended Dec. 31. Rambus' revenues were 191% higher than $11.9 million in the same quarter a year ago, and 29% above the prior three-month period.
NEC to expand Shanghai fab with $300 million investment
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1/11/2001   Post a comment
TOKYO--NEC Corp. today announced plans to invest 35 billion yen ($300 million) to expand a joint-venture wafer fab in Shanghai and increase its output from 20,000 to 30,000 eight-inch wafers per month.
Karl Suss develops probe head for measurements up to 110 GHz
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1/11/2001   Post a comment
MUNICH -- Karl Suss, a unit of Suss MicroTec AG, has introduced a new probe head for testing advanced communications devices with measurements up to 110 GHz. The PH300HF has been designed for stable measurements in the very high frequency (VHF) range without phase errors, said the company.
TI sues Linear Technology over alleged patent infringement
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1/11/2001   Post a comment
MILPITAS, Calif. -- Linear Technology Corp. here said it has been sued by Texas Instruments Inc. over seven patents related to analog circuits and manufacturing process technologies.
Matsushita won't join Mitsubishi on 300-mm fab
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1/11/2001   Post a comment
TOKYO -- Mitsubishi Electric Corp. has invited the Matsushita Group to join the company in sharing the cost of a new 300-mm wafer fab, which was announced this week for Mitsubishi's production site in Kochi, Japan (see Jan. 9 story). But Matsushita, which has partnered with Mitsubishi in system-on-chip (SoC) process development, has rebuffed the proposal.
TI offers royalty-free access to 22-Mbit/sec. wireless LAN technology
News & Analysis  
1/10/2001   Post a comment
SANTA ROSA, Calif. -- In a move to accelerate the use of high-speed wireless networking systems, Texas Instruments Inc. today announced it will offer royalty-free access to patents related to its proposal for a faster implementation of the IEEE 802.11b standard.
Mitsubishi announces plans for $1.7 billion 300-mm fab
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1/9/2001   Post a comment
Mitsubishi Electric Corp. today became the latest chip company to announce a 300-mm fab-a $1.7 billion facility at its main Kochi, Japan, fab complex that will begin production in 2003.
Rambus may withhold synchronous interface patents from litigants
News & Analysis  
1/9/2001   Post a comment
NEW YORK -- Rambus Inc. is threatening to impose higher royalty payments or even refuse licensing rights to three semiconductor manufacturers, which have engaged in a series of court battles with the intellectual property (IP) developer rather than agreeing to patent license terms.
August Technology claims major improvement in 3-D inspection
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1/9/2001   Post a comment
BLOOMINGTON, Minn.--August Technology Corp. here today claimed a breakthrough in three-dimensional inspection technology by combining confocal microscopy with new a new optical design and software algorithms.
VerticalNet CEO leaves b2b exchange for "bricks-and-mortar" world
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1/8/2001   Post a comment
Joseph Galli, who took the helm of b2b exchange operator in July, will become president and chief executive officer of housewares makers Newell Rubbermaid Inc. Michael Hagan, VerticalNet's co-founder and chief operating officer, will take over the position of president and CEO, the Horsham, Pa., company said.
ASML plans to refile for U.S. review of SVG purchase
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1/8/2001   Post a comment
VELDHOVEN, the Netherlands -- ASM Lithography N.V. today announced plans to refile a petition for U.S. review of its planned purchase of Silicon Valley Group Inc., which must receive government approval under a law covering foreign acquisitions technologies considered crucial for defense systems.
Philips invests in Bluetooth partner Silicon Wave
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1/5/2001   Post a comment
LAS VEGAS--Silicon Wave Inc. today announced an alliance with Philips Components to jointly develop PC peripheral products incorporating radio modem ICs, controllers, and protocol stack software for Bluetooth wireless communications systems.
Hyundai, ChipPac forge foundry/backend assembly alliance
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1/4/2001   Post a comment
SANTA CLARA, Calif. -- ChipPac Inc. here and its former parent company, Hyundai Electronics Industries Co. Ltd. of South Korea, today expanded their ties by announcing a major service and supply agreement for silicon foundry customers.
LSI Logic launches ADSL front-end chips from Datapath acquisition
News & Analysis  
1/4/2001   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. has added a pair of integrated analog front-end ICs to its portfolio of broadband products for asymmetric digital subscriber line (ADSL) systems. The two new SpeedReach devices require a single power supply--unlike competing solutions--and LSI Logic said mixed-signal integration reduces the number of components required in systems.
ChipPac presses ahead with expansion of chip-assembly services
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1/4/2001   Post a comment
SANTA CLARA, Calif. -- Nearly two years after being spun out of South Korea's Hyundai Electronics Industries Co. Ltd., IC-packaging and testing giant ChipPAC Inc. is plotting a bold new strategy to double its market share by 2005.
Aehr to develop wafer-level burn-in/test systems with U.S. funding
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1/3/2001   Post a comment
FREMONT, Calif. -- Aehr Test Systems here today announced plans to develop wafer-level burn-in and test systems for production of known good die under a $6.5 million agreement with the U.S. Defense Advanced Research Projects Agency (Darpa).
Rambus wins ITC decisions in SDRAM patent case
News & Analysis  
1/3/2001   Post a comment
WASHINGTON -- The U.S. International Trade Commission in a year-end action upheld Rambus Inc.'s request to withdraw its synchronous DRAM patent infringement case against Hyundai Electronics Industries Co., while overturning restrictions on Rambus on future new cases that might be filed with the ITC.
Chip sales moving back to normal 17% growth in Q1, says SIA
News & Analysis  
1/3/2001   Post a comment
SAN JOSE -- Worldwide chip sales are heading back to normal annual growth rates of 17% in the first quarter of 2001 after increasing 37.1% in 2000, said George Scalise, president of the Semiconductor Industry Association. The U.S. trade group president today insisted that the outlook for semiconductor markets remains strong despite a slowdown in growth that began in September when major chip customers started delaying orders to clear out their inventories.
Mitsubishi inks SDRAM, DDR pact with Rambus
News & Analysis  
1/2/2001   Post a comment
MOUNTAIN VIEW, Calif. -- Mitsubishi Electric Corp. today became the seventh chip maker to announced it was licensing Rambus Inc.'s patents for synchronous DRAMs, double data rate (DDR) memories, and controllers that interface to those devices.
Chip sales up 31% in 2000; Toshiba passes NEC as No. 2 supplier
News & Analysis  
1/2/2001   Post a comment
SAN JOSE -- Semiconductor sales increased 31% to $222.1 billion in 2000 from $169.1 billion in 1999 despite a slight slowdown in revenue growth during the final months of the year, according to preliminary estimates released today by Dataquest Inc.
Tegal licenses dual-frequency etch patents to Applied Materials
News & Analysis  
1/2/2001   Post a comment
PETALUMA, CALIF. -- Tegal Corp. here today announced it has granted a non-exclusive license to Applied Materials Inc. for U.S. patents covering dual-frequency etch technology. Under the pact, Applied Materials will pay Tegal an undisclosed one-time sum for use of the company's patents for specific wafer-processing applications.


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