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Content tagged with Test & Measurement Designline posted in October 2000
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Chipworks will buy ICE to increase reverse engineering services
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10/31/2000   Post a comment
SCOTTSDALE, Ariz. -- Integrated Circuit Engineering Corp. (ICE), one of the chip industry's oldest market and technology research firms here, has agreed to be acquired by Chipworks Inc., an Ottawa-based company specializing in reverse engineering services. Chipworks today said its purchase of ICE will result in the world's largest reverse engineering service provider for the microelectronics markets.
Taiwan's Mosel Vitelic moves closer to 300-mm fab in Canada
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10/31/2000   Post a comment
SAN DIEGO -- During a forecasting conference here, Mosel Vitelic Inc. officials disclosed the company is one step closer to moving ahead with an ambitious 300-mm wafer fab project in Canada. However, managers with the Taiwanese chip maker also indicated that the company would not look for a joint technology partner in the venture as previously thought.
Diodes to acquire FabTech, 5-inch wafer fab in Missouri
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10/30/2000   Post a comment
WESTLAKE VILLAGE, Calif.--Diodes Inc. here today announced an agreement to acquire a 5-inch wafer-processing plant, called FabTech Inc., for $25 million and additional funds, if specific earnings targets are reach in the next four year. The facility, located in Lee's Summit, Mo., specializes in Schottky products and will be used by Diodes to support value-added products.
AMD says DDR platforms are ready to roll with new Athlon, chip set
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10/30/2000   Post a comment
TOKYO--During a press conference here and around the world, Advanced Micro Devices Inc. today claimed to be the first chip supplier to offer a PC platform supporting double data rate (DDR) memory. The solution includes the AMD-760 chip set and a new Athlon processor with a 266-MHz front-side bus for the highest grade of DDR memory available, according to the company.
Taiwan approves S3-Via graphics chip venture after delay
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10/30/2000   Post a comment
SANTA CLARA, Calif.--After a three-month delay, Taiwan's government has given its blessing to a graphics chip joint venture between S3 Inc. and Via Technologies Inc., which today announced they are moving ahead with plans to formally launch the new company.
Micron aims to move up in flash ranking with SyncFlash, wireless memories
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10/30/2000   Post a comment
BOISE, Idaho -- DRAM giant Micron Technology Inc. aims to turn itself into a Top 10 flash memory supplier by 2002. To do that, the company has begun ramping up volume production of low-power flash devices here for wireless handsets, and today, Micron officially introduces its first SyncFlash chip, which replaces synchronous DRAMs in a range of embedded nonvolatile memory applications.
ADE claims KLA-Tencor violating wafer inspection patent
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10/27/2000   Post a comment
WESTWOOD, Mass. -- ADE Corp. here has announced a patent infringement suit against metrology giant KLA-Tencor Corp., claiming that its technology for distinguishing pits from particles in wafer inspection was being violated.
TI invests in U.K.-based RadioScape, plans DSPs for digital radio
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10/27/2000   Post a comment
LONDON -- Texas Instruments Inc. today announced plans to develop digital baseband chip solutions using its digital signal processor (DSP) technology and software from RadioScape Ltd., a London startup. TI also said it has invested an undisclosed amount of money in four-year-old RadioScape, which is focused on software for the Eureka-147 digital radio standard for consumer products.
ASE Test reports 51.7% growth in Q3 sales, hikes spending plans
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10/26/2000   Post a comment
TAIPEI, Taiwan -- ASE Test Ltd. here today reported a 51.7% increase in net sales to $120.8 million in the third quarter compared to $79.6 million in the same period last year. The contract chip-testing company said its net revenues were 17.6% higher than $102.7 million in the second quarter.
Former CEO of Burr-Brown to head TI's catalog analog unit
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10/26/2000   Post a comment
TUCSON, Ariz. -- Syrus Madavi, credited by analysts for turning around Burr-Brown Corp. during his seven-year tenure as CEO, has been named vice president at Texas Instruments Inc. and the head of TI's Advanced Analog Products (AAP) organization.
MindReady gears up to buy Yelo
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10/26/2000   Post a comment
Credence buys tester IP supplier NewMillennia Solutions
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10/26/2000   Post a comment
FREMONT, Calif.--Credence Systems Corp. here today announced it has acquired full ownership of NewMillennia Solutions Inc., a supplier of design-for-test technology and embedded intellectual property (IP) used in system-on-chip designs. The purchase is aimed at increasing Credence's ability to support next-generation test requirements in complex ICs.
Tower presses ahead with new fab, reports $800,000 loss in Q3
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10/26/2000   Post a comment
MIGDAL HAEMEK, Israel -- Silicon foundry supplier Tower Semiconductor Ltd. here posted third-quarter sales of $27.6 million, a 47% increase from $18.2 million in the same period last year and an 8% gain sequentially from $25.6 million in the second quarter this year. Tower posted a net loss of $800,000 for the quarter, but it said it is moving ahead to complete investment agreements for a new $1.25 billion fab at its headquarters.
Intel expands technology partnership with LG Electronics
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10/24/2000   Post a comment
SEOUL -- Intel Corp. today signed an expanded technology agreement with South Korea's LG Electronics Co. to jointly develop technology for digital TV, home networking systems, Internet access appliances, and notebook PCs.
Lexar says trial set for flash dispute with SanDisk
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10/24/2000   Post a comment
FREMONT, Calif. -- Lexar Media Inc. today announced that a federal judge in California has ruled that SanDisk Corp. must go to trial for alleged fraud, patent violations, and unfair competition in a dispute over flash memory technology.
Chip equipment market slows slightly in September, says SEMI report
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10/23/2000   Post a comment
SAN JOSE --- After a year-long period of sizzling growth, the chip production equipment market is beginning to cool off-at least to some degree, according to new figures from the Semiconductor Equipment and Materials International (SEMI) trade organization here. North American-based manufacturers of semiconductor equipment posted orders of $2.8 billion in September of 2000, thereby resulting in a book-to-bill ratio of 1.16, according to SEMI. A book-to-bill of 1.16 means that orders was 16% hig
India's Wipro to roll range of Bluetooth basebands
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10/23/2000   Post a comment
EDINBURGH, Scotland ( ChipWire) — Wipro Technologies has developed a range of baseband controller core solutions that it says complies with Bluetooth 1.0b — the latest version of the short-range wireless communications technology that could revolutionize connectivity in electronic equipment.
Conexant offers tri-band amp for GSM, GPRS handsets
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10/23/2000   Post a comment
NEWPORT BEACH, Calif. -- Conexant Systems Inc. here today announced a low-cost, tri-band power amplifier line designed for handsets based on the Global System for Mobile communications (GSM) and General Packet Radio Service (GPRS) standards.
Cohu expects rebound in chip-test handler orders
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10/20/2000   Post a comment
SAN DIEGO -- Cohu Inc. this week said it was encouraged by industry forecasts showing a potential uptick in demand for semiconductor-test handlers in the next several years as backend assembly and chip-testing operations catch up with strong growth in wafer fabs. On Thursday, Cohu reported its sales grew 25% to $77.2 million in the third quarter, compared to $61.7 million in the period last year.
NEC introduces faster CAN controllers for cars
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10/19/2000   Post a comment
DETROIT — NEC Electronics unveiled an automotive microcontroller design this week that enables controller-area network (CAN) modules to pass messages at least five times faster than existing systems.
Silicon Wave radio modem IC gets Bluetooth qualification
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10/19/2000   Post a comment
SAN DIEGO ( ChipWire) — Silicon Wave Inc. here has become the first silicon vendor to receive Bluetooth qualification for its Bluetooth radio modem IC, according to David Lyon, the company's chairman and chief executive officer.
Atmel wins four-year patent case against SST, Sanyo and Winbond
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10/17/2000   Post a comment
SAN JOSE -- Atmel Corp. today declared victory in a nonvolatile-memory patent infringement case against Silicon Storage Technologies Inc., Sanyo Electric Co. Ltd., and Winbond Electronics Corp. following a final ruling by the U.S. International Trade Commission. The ITC declared that Atmel's U.S. patent No. 4,451,903 was valid, enforceable, and infringed upon by the three companies, said the San Jose company.
LSI Logic aims at 300-mm production in 2002
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10/16/2000   Post a comment
LONDON -- LSI Logic Corp. aims to move to production based on 300-millimeter (12-inch) wafers for its next, 0.13-micron process. Wilf Corrigan, chairman and chief executive officer, said the company plans to have production running at its Santa Clara, Calif., wafer fab on 12-inch wafers by the end of 2002.
Infiniband silicon nears as specification rolls out
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10/13/2000   Post a comment
NEW YORK -- The hard-fought Infiniband 1.0 specification will be unveiled later this month in Las Vegas at the first Infiniband developer's conference. Hard on the heels of the 1.0 rollout will come silicon announcements from startups such as Banderacom Inc. in Austin, Tex., and HiBand Semiconductors Inc. in Scotts Valley, Calif. The Israel-based Mellanox Technologies Ltd. is also reportedly preparing chips, and a few companies -- such as Lucent Microelectronics and IBM Corp.'s Microelectronics
U.K. silicon foundry ESM on comeback trail
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10/13/2000   Post a comment
SANTA CLARA, Calif. -- At the Fabless Semiconductor Association (FSA) conference here, ESM Ltd. of the United Kingdom disclosed its strategy to re-establish itself in the silicon foundry business. ESM--the south Wales chip fab formerly owned by now-defunct Newport Wafer Fab Ltd.--said it plans to boost its overall wafer capacity, expand its workforce, and focus on a few key process technologies.
TI, Troy develop cell-phone wireless printing with Bluetooth chips
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10/13/2000   Post a comment
DALLAS -- Texas Instruments Inc. here said it is collaborating with a subsidiary of Troy Group Inc. to enable wireless printing from cellular phones using Bluetooth technology. The capability will use TI's recently introduced Bluetooth chip set, which is fabricated in 0.18-micron process technology and claimed to be the first semiconductor solution to fully integrate software for the wireless standard in ROM (see Sept. 19 story).
Applied, Varian settle PVD suits; litigation with Novellus continues
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10/12/2000   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. and Varian Semiconductor Equipment Associates Inc. today announced settlement of lawsuits filed against each other in connection with patent claims for physical vapor deposition (PVD) technology.
Motorola, Tundra strike R&D alliance for RapidIO technology
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10/12/2000   Post a comment
AUSTIN, Tex. -- Motorola Inc. today announced an alliance with Canada's Tundra Semiconductor Corp. to develop new RapidIO interface technology for embedded processors and other products in the fast-growing communications and networking applications. The alliance will focus on technology for new Motorola PowerPC host processors, PowerQuicc integrated processors, and C-Port network processors as well as new Tundra systems interconnect products using the RapidIO communications links.
K&S to buy test-interconnect supplier Cerprobe for $225 million
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10/12/2000   Post a comment
WILLOW GROVE, Pa.--Kulicke & Soffa Industries Inc. here today announced it will acquire Cerprobe Corp. of Gilbert, Ariz., for $225 million in cash to expand its business into chip-testing and wafer-probe interconnect systems. Under an agreement approved by directors of both companies, K&S will pay $20 in cash for Cerprobe common stock.
Israeli minister proposes $250 million grant for Tower's new fab
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10/11/2000   Post a comment
MIGDAL HAEMEK, Israel --Tower Semiconductor Ltd. today said a proposed $250 million grant from the Israeli government would be enough to continue its plans for a new 8-inch wafer fab at its headquarters here. For nearly two years, Tower has been seeking government assistance to help it build a second fab for wafer-processing foundry services.
Kilby surprised to win Nobel Prize as IC inventor
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10/10/2000   Post a comment
DALLAS -- Jack Kilby, who invented the integrated circuit over 40 years ago, said today that he was shocked but pleased to win half the Nobel Prize in physics for his contribution to the computer revolution.
University fails to stop Stanford Microdevices from using name
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10/10/2000   Post a comment
SUNNYVALE, Calif. -- Cellular-phone chip maker Stanford Microdevices Inc. here today announced that it has prevailed in a recent decision regarding ongoing trademark litigation with Stanford University.
Mentor sues Aptix to recoup legal costs in Quickturn case
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10/10/2000   Post a comment
WILSONVILLE, Ore. -- The failed attempt by Mentor Graphics Corp. and Aptix Corp. to sue the Quickturn subsidiary of Cadence Design Systems Inc. has now turned into a three-way battle. Mentor has filed a new lawsuit charging Aptix with fraud and civil conspiracy.
IBM plans 300-mm fab for copper, SOI chips in N.Y.
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10/10/2000   Post a comment
EAST FISHKILL, N.Y.--IBM Corp. today announced plans to build the world's most advanced chip-making facility here, including a 300-mm wafer processing fab that will process ICs with copper and low-k dielectric technologies as well as silicon-on-insulator (SOI) substrates. The investment is set at $2.5 billion and part of a total $5 billion capital spending plan to support a major worldwide expansion of IBM's Microelectronics Division.
Intel's change in MPU management comes at crucial time, say analysts
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10/10/2000   Post a comment
SANTA CLARA, Calif. -- Intel Corp.'s shuffling of its microprocessor management team comes at a critical time for the world's largest chip maker, said industry analysts reacting to the company's realignment of leadership in its Technology and Manufacturing Group and the Intel Architecture Group (see Oct. 9 story). According to some Intel observers, the moves are aimed at solving chronic manufacturing problems and slow production ra
Signal and noise levels underline ADSL line driver, receiver design
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10/10/2000   Post a comment
ADSL transmissions are affected by signal and noise levels on the telephone line, which appear in specific segments of the frequency spectrums. TI's Jim Quarfoot offers pointers for driver/receiver design.
Intel shuffles management to ensure smooth ramp of new processors
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10/9/2000   Post a comment
SANTA CLARA, Calif.-- In a move apparently aimed at solving manufacturing problems in advanced microprocessors, Intel Corp. today shuffled the responsibilities of top managers overseeing its highest performing products. Mike Splinter, 50, was named executive vice president and general manager of Intel's Technology and Manufacturing Group. Splinter was previously senior vice president in the group, but he is also being given additional responsibilities by Intel to guarantee the successful ramp of
Applied Materials reports U.S. probe of its licensing practices
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10/9/2000   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. here has reported that the U.S. Department of Justice is investigation of its technology licensing practices. Details about the probe were not immediately available.
Rambus plans U.S. suit against Hyundai, asks for change of venue
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10/9/2000   Post a comment
MOUNTAIN VIEW, Calif.--Rambus Inc. has filed a motion to change the venue of a U.S. patent suit filed by Hyundai Electronics Industries Co. Ltd. from San Jose to a federal court in Virginia. Rambus here also said it plans to file its own U.S. patent suit against Hyundai in response to the South Korean company's case, which attempts to invalidate the company's claims on technology rights to high-speed synchronous DRAM interfaces.
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