Surprising jump in Q3 wafer capacity could spell trouble News & Analysis 11/30/2000 Post a comment SAN JOSE -- Wafer processing capacity worldwide took a sudden and somewhat unexpected jump in the third quarter, based on new data released by the Semiconductor Industry Association here. The SIA's quarterly capacity report shows wafer starts in chip-fabrication plants surging 6.8% in the third quarter from volume run rates in the second quarter, putting this year on a record pace for increased unit output, said industry observers, who worry about the timing of the growth.
TI claims 30% market share in data-over-cable modem chips News & Analysis 11/29/2000 Post a comment HOUSTON -- Texas Instruments Inc. is predicting that it will ship nearly 3 million of the world's 10 million chips for data-over-cable services in 2000. Using market projections from Dataquest Inc., TI's digital signal processor division here said it expects to grab 30% of the market for DOCSIS integrated circuits in 2000, less than a year-and-a-half after the company entered the cable-modem chip business.
NEC-Hitachi DRAM venture plans $1.4 billion 300-mm fab in Japan News & Analysis 11/28/2000 Post a comment TOKYO -- Elpida Memory Inc.--the DRAM joint venture between NEC Corp. and Hitachi Ltd.--today announced plans to build a 300-mm wafer fab for volume production of 256-megabit memories using a 0.13-micron process. Construction on the fab in Hiroshima, Japan, will begin in January and the initial production is slated to start in the first half of 2002.
Altera names Daane as new president and CEO News & Analysis 11/27/2000 Post a comment SAN JOSE -- Altera Corp. here today named John Daane, the former communications chip chief at LSI Logic Corp., as its new president and chief executive.
Daane replaces Rodney Smith, who announced his intention to retire late last year. Smith, who will remain chairman of Altera, said the San Jose-based supplier of programmable logic devices will not change its focus as a result of the management changes.
Kawasaki, Sonicblue (formerly S3) back ComSilica for wireless LAN technology News & Analysis 11/27/2000 Post a comment MAKUHARI, Japan -- Kawasaki Steel Corp. and Sonicblue Inc.--formerly known as S3 Inc.--announced a joint investment in ComSilica Inc., a Berkeley, Calif.-based startup focused on broadband wireless technology for the IEEE 802.11a standard. Both Kawasaki Steel and Sonicblue said they hoped to use technology from ComSilica to offer new products for next-generation wireless local area networks.
PMC-Sierra enters 3G infrastructure arena with DSP for power amplifiers News & Analysis 11/27/2000 Post a comment BURNABY, British Columbia -- PMC-Sierra Inc today announced its entry into the wireless-infrastructure chip market with the launch of a new series of digital signal processor ICs aimed at power amplifier architectures for third-generation wireless networks. The company said the PM7800 Palandin-10 chip allows traffic over all major digital 3G standards to be transmitted through new digitally-controlled power amplifier architectures.
KLA-Tencor files counterclaims against ADE in patent fight News & Analysis 11/27/2000 Post a comment SAN JOSE--KLA Tencor Corp. here has filed counterclaims against ADE Corp. in response to a U.S. lawsuit alleging infringement of patented technology in wafer inspection systems. KLA-Tencor, the world's largest metrology supplier to chip makers, is accusing Westwood, Mass.-based ADE of violating three patents for data analysis, process control, and optical scanning techniques in wafer-surface inspection tools.
Mitsubishi Silicon America finds no serious problems from chemical spill News & Analysis 11/22/2000 Post a comment SALEM, Ore.--Mitsubishi Silicon America today said it accepted responsibility for an accidental spill of sulfuric acid into a creek here last spring, but officials insisted that the silicon wafer materials supplier acted responsibly to minimize damage to the environment and to prevent accidents from happening again.
Beijing plans huge microelectronics base in China News & Analysis 11/21/2000 Post a comment BEIJING The Beijing municipal government has rolled out heady plans to establish a huge microelectronics base here, encouraged by the fast-growing IC design and manufacturing industry in cities like Shanghai. If all goes as planned, the Beijing area will ultimately embrace as many as 20 advanced semiconductor-processing lines and dozens of chip design houses, as well as related materials and equipment producers.
LSI Logic reorganizes following the departure of its top communications chip executive News & Analysis 11/21/2000 Post a comment MILPITAS, Calif. -- LSI Logic Corp. here today announced a major reorganization in its operations following the resignation of John Daane, its top communications chip executive.
Daane, a 15-year veteran of LSI Logic and executive vice president of the Communications Product Group, has resigned to become chief executive of an undisclosed high-tech company, according to officials from the Milpitas, Calif.-based chip maker.
Intel, Broadcom settle trade secret suit News & Analysis 11/21/2000 Post a comment SANTA CLARA, Calif. -- Intel Corp. here today announced it has reached an out-of-court settlement in its bitter suit against Broadcom Corp. over alleged trade secret violations in the communications chip space.
At the same time, Broadcom of Irvine, Calif. also settled its cross-complaint against Intel. Both companies expressed satisfaction with the terms of the settlement agreement, which are confidential.
Dallas Semiconductor CEO Prothro dies of heart attack News & Analysis 11/16/2000 Post a comment DALLAS -- Dallas Semiconductor Corp. president, CEO and chairman C.V. ("Vin") Prothro died today of a sudden heart attack. Prothro, 58, founded Dallas Semiconductor in 1984 and was previously president of Mostek Corp., a leading DRAM maker in the Dallas area during the 1970s and '80s.
Teamasia to set up 6-inch wafer fab in India News & Analysis 11/15/2000 Post a comment BANGALORE, India -- Teamasia Semiconductors (India) Ltd., a privately owned manufacturer of discrete semiconductors in India, plans to spend about $40 million to set up a 6-inch wafer fabrication facility and design center in the south Indian city of Hyderabad.
SanDisk, Lexar to pay each other in settlement of flash patent suits News & Analysis 11/15/2000 Post a comment SUNNYVALE, Calif.-- SanDisk Corp. here and Lexar Media Inc. today announced a settlement to a two-year-old battle over patented flash memory technologies. The two sides agreed to settle patent-infringement suits, with Lexar paying SanDisk $8 million in royalties, and SanDisk paying Lexar $2 million for a fully-paid up license.
K&S to acquire Probe Technology for $65 million News & Analysis 11/14/2000 Post a comment WILLOW GROVE, Pa.--Kulicke & Soffa Industries Inc. today announced an agreement to acquire Probe Technology Corp. of Santa Clara, Calif., a 25-year-old supplier of probe cards for semiconductor testing. The privately-held company will be purchased for about $65 million in cash, under the agreement.
NetChip rolls out controller for USB 2.0 applications News & Analysis 11/13/2000 Post a comment MOUNTAIN VIEW, Calif. -- NetChip Technology Inc. here today announced a controller designed to meet the specifications for the new, high-speed Universal Serial Bus (USB) 2.0 standard. Targeted for digital audio players, printers, mass storage devices, and scanners, the NET2270 controller from NetChip has a data transfer rate of up to 480-megabits-per-second--about 40 time faster than the chip-level products based on the USB 1.1 standard.
World trade group slightly more bullish than SIA about 2000 growth News & Analysis 11/9/2000 Post a comment SAN JOSE -- It appears semiconductor companies worldwide are slightly more optimistic about chip growth in 2000 than U.S. chip suppliers. That's one conclusion that could be drawn from a comparison of new forecasts from the U.S.-based Semiconductor Industry Association (SIA) and the World Semiconductor Trade Statistics (WSTS) group.
TSMC seeks 99% stake in U.S.-based WaferTech, plans next 300-mm fab News & Analysis 11/7/2000 Post a comment HSINCHU, Taiwan --In a move to increase its foundry capacity and services in North America, Taiwan Semiconductor Manufacturing Co. Ltd. here today announced plans to increase its ownership in U.S.-based WaferTech LLC to 99% from 66.89% today. Four-year-old WaferTech in Camas, Wash., is a joint-venture foundry company between TSMC, Altera Corp., Analog Devices Inc., and Integrated Silicon Solution Inc. (ISSI).
Intel, Motorola, National, and others expand charter for HomeRF Working Group News & Analysis 11/6/2000 Post a comment PORTLAND, Ore. -- A group led by six major chip makers and OEMs here today announced plans to revise the charter and promote the developments of the emerging HomeRF Working Group.
The newly expanded HomeRF Working Group will now include six so-called "promoter" companies, including Compaq, Intel, Motorola, National Semiconductor, Proxim and Siemens.
Lucent spin-out SynChip shrinks GPS receiver with chip-scale technology News & Analysis 11/6/2000 Post a comment WARREN, N.J. ( ChipWire) -- A company spun off from Lucent New Ventures is using chip-scale integration technology developed at Bell Labs to deliver what it claims is the smallest complete receiver for the global positioning system (GPS) standard to date. SyChip here said it has packed the SiRFstarII GPS receiver IC from SiRF Technology of San Jose into an 11 x 14 x 3.5-mm module that includes a 12-channel RF section, baseband and memory.
ASML's purchase of SVG clears U.S. antitrust review News & Analysis 11/6/2000 Post a comment VELDHOVEN, the Netherlands -- ASM Lithography N.V. today announced its planned acquisition of Silicon Valley Group Inc. has cleared antitrust review in the United States. The purchase was announced a month ago, and it still must clear reviews by U.S. and other international agencies as well as win the final approval from shareholders.
Cypress, Malaysia's 1st Silicon in talks for foundry alliance News & Analysis 11/3/2000 Post a comment SAN JOSE -- Looking to outsource more of its chip production, Cypress Semiconductors Inc. is in discussions to invest and strike a major manufacturing agreement with silicon foundry startup 1st Silicon (Malaysia) Sdn. Bhd. If reached, the deal is expected to be announced within the next couple of weeks, SBN has learned.
Chip sales hit another record in September, says SIA News & Analysis 11/2/2000 Post a comment SAN JOSE--Worldwide chip sales set another monthly record in September at $18.40 billion, an increase of 45.2% from $12.67 billion in the same month last year, said the Semiconductor Industry Association today. Using a three-month moving average, the SIA said chip sales in September were 1.9% higher than $18.06 billion in August.
Qualcomm claims it's first to have chips shipped in 3G handsets News & Analysis 11/2/2000 Post a comment SAN DIEGO -- Apparently beating Texas Instruments Inc. and other IC rivals to the punch, Qualcomm Inc. here is claiming an early lead in the race to supply chips for new third-generation (3G) cellular phones. The San Diego company told SBN this week that its chip sets are now being shipped in the world's first 3G-enabled handsets.
Sumitomo plans U.S. wafer-making plant for GaAs, InP substrates News & Analysis 11/2/2000 Post a comment HILLSBORO, Ore.-- Japan's Sumitomo Electric Industries Ltd. today announced plans to produce compound-material semiconductor wafers, starting with 150-mm gallium-arsenide (GaAs) substrates, at a facility here. A second-phase expansion to the new facility will add large-diameter indium phosphide (InP) wafers to the output, said Sumitomo.
SIA sees slight slowdown in 2002 followed by rebound in 2003 News & Analysis 11/1/2000 Post a comment SAN JOSE -- Worldwide chip sales will rise 37% to $205 billion this year, followed by a 22% increase to $249 billion in 2001, but revenue growth will cool off a bit to 10% in 2002, according to a new forecast released today by the Semiconductor Industry Association here.
Samsung becomes fifth DRAM maker to license Rambus SDRAM patents News & Analysis 11/1/2000 Post a comment MOUNTAIN VIEW, Calif.-- Rambus Inc. here today announced it has added Samsung Electronics Co. Ltd. to its list of DRAM companies agreeing to license patented technologies for SDRAM, double data rate (DDR) memories, and controllers interfacing to those chips. The South Korean memory giant joins Japan's NEC, Toshiba, Hitachi, and Oki in paying extra royalties for those Rambus patents.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.