TEL enhances prober to handle mix of 200- and 300-mm wafers News & Analysis 11/30/2001 Post a comment TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
2001 technology roadmap packs some 'unexpected' surprises News & Analysis 11/29/2001 Post a comment SANTA CLARA, Calif. -- While it may not be a complete surprise that IC technology continues to accelerate faster than expected, there are some unanticipated conclusions in the new 2001 International Technology Roadmap for Semiconductors (ITRS), which is scheduled to be formally presented to the chip industry here today.
Rambus to appeal injunction preventing DDR patent suits against Infineon News & Analysis 11/27/2001 Post a comment LOS ALTOS, Calif. -- Rambus Inc. here vowed to "swiftly appeal" a final ruling from a Virginia federal court, which has issued a permanent injunction barring the company from filing new patent suits against Infineon Technologies AG involving double data rate (DDR) synchronous DRAMs based on JEDEC industry standards.
IC fab utilization plunges to record low 64.2% in Q3, says new report News & Analysis 11/21/2001 Post a comment SAN JOSE -- Wafer-processing IC plants worldwide were operating at a record-low 64.2% capacity utilization in the third quarter, down from 73.1% in Q2 and sharply below 96.4% in same period last year, said a new manufacturing report released by the Semiconductor Industry Association (SIA) here this week.
IEEE passes compromise 54-Mbit/s wireless LAN proposal News & Analysis 11/16/2001 Post a comment At a voting session that ran into Thursday (Nov. 15) evening, the IEEE passed a proposal for a new wireless LAN standard that will boost data rates in the 2.45-GHz spectrum from the present 11-Mbits/second rate of the existing 802.11b standard, to a maximum of 54 Mbits/s for the new standard, to be called 802.11g.
Test Trade-Offs at ITC 2001 News & Analysis 11/15/2001 Post a comment This year's International Test Conference (ITC) focused on test tradeoffs for chip and chip-based systems. Agilent's Rob Aitken, this year's co-chair and ITC 2002's chair, reviews the conference's keynote address along with other pertinent presentations, panels, and papers covering key test issues.
LTX promises to lower the cost of test with new ATE system News & Analysis 11/13/2001 Post a comment WESTWOOD, Mass. -- In a move to reduce the cost of test, LTX Corp. here rolled out a new version of its Fusion line of testers.
The new Fusion CX from Westwood-based LTX is designed for use in testing analog, mixed-signal, and wireless chips, said Roger W. Blethen, president and chief executive of LTX. "The Fusion CX expands the range of devices, such as Bluetooth and 802.11, that can be tested economically on Fusion," Blethen said.
LTX believes it hit low point for tester orders in last quarter News & Analysis 11/13/2001 Post a comment WESTWOOD, Mass.--Automatic test equipment supplier LTX Corp. here today reported a net loss of $9.4 million on sharply lower sales of $33.0 million in the company's fiscal first quarter, ended Oct. 31. LTX's revenues were 66% lower than $98 million in the fiscal quarter last year due to the severe downturn in semiconductor test markets.
IDT hires former Intel VP as new president News & Analysis 11/12/2001 Post a comment SANTA CLARA, Calif. -- Integrated Device Technology Inc. here today announced it has hired a former vice president at Intel Corp. as its new president. The move is part of a strategy to increase IDT's business in communications IC markets.
Familiar drivers, new consumer systems will revive chip growth, says SIA News & Analysis 11/8/2001 Post a comment For growth in the next several years, the chip industry will be banking heavily on a revival of communications applications, which were derailed in the current downturn, and solid increases in consumer electronics, optical storage and networks, and automotive electronics, according to the new autumn forecast from the Semiconductor Industry Association.
ITC 2001 Emphasizes More Cooperation, Less Test Cost News & Analysis 11/8/2001 2 comments Activities and products at the recent International Test Conference focused on making manufacturing test faster and less expensive. Jim Lipman, TechOnLine's Content Director, discusses ITC's major themes along with some of the show's more interesting product announcements.
Silicon wafer shipments fall 17% in Q3 over Q2, says SEMI News & Analysis 11/6/2001 Post a comment SAN JOSE -- It's gone from bad to worse for suppliers of blank silicon wafers. Worldwide silicon wafer shipments declined by 17% in the third quarter of 2001, compared to the second period of this year, according to a new forecast from the Semiconductor Equipment and Materials International (SEMI) trade organization here.
In its quarterly analysis of the silicon wafer industry, SEMI estimated that silicon wafer shipments were 824 million square inches in the third quarter of 2001.
Teradyne forms new board-test division after GenRad acquisition News & Analysis 11/6/2001 Post a comment BOSTON -- Teradyne Inc. here today announced a new board-test division that combines its own operations with those from its recent acquisition of GenRad Inc.
The board-test operation--called the Assembly Test Division--will be headed by Robert M. Dutkowsky. A long-time veteran in the automatic test equipment (ATE) business, Dutkowsky was chairman, president and CEO of GenRad.
Unisys plans big ATE push with burn-in tester for high-end processors News & Analysis 11/5/2001 Post a comment CHANDLER, Ariz. -- Unisys Corp. is widely known as a provider of services in the information-technology (IT) sector, but the company also hopes to elevate its status in a surprising arena--automatic test equipment (ATE).
Unisys' low-profile ATE unit--dubbed Unisys Unigen Operations (UUO)--here today announced a new burn-in test system that is specifically designed for high-end microprocessors, ASICs and other complex devices.
Credence, ISE Labs form chip-testing service center to lower ATE costs News & Analysis 11/5/2001 Post a comment FREMONT, Calif. -- Credence Systems Corp. and International Semiconductor Engineering Laboratories (ISE Labs) here today announced the opening of a new center that will provide low-cost, chip-testing services for IC makers.
The Credence Technology Center will provide chip makers with analog, logic, memory, and other chip-testing services. The center will use automatic test equipment (ATE) from Credence of Fremont.
SoC test requirements debated News & Analysis 11/2/2001 Post a comment The prevalence and escalating cost of system-on-chip (SoC) designs are forcing a reexamination of existing approaches to design and test, according to EDA and test industry executives at a panel session during this week's International Test Conference.
Credence's DCI unit rolls out test socket to reduce IC costs News & Analysis 11/2/2001 Post a comment SANTA CLARA, Calif. -- Dimensions Consulting Inc. (DCI) here rolled out a low-power engineering test socket line for use in prototyping complex ICs.
The Model 1560 Thermal Control Socket System is a standalone device that enables the characterization of ICs in substantially less time than traditional forced-air thermal control systems, according to DCI of Santa Clara. DCI is a subsidiary of Credence Systems Corp., a supplier of automatic test equipment (ATE), in Fremont, Calif.
Test Insight rolls out test-generation software that reduces ATE costs News & Analysis 11/1/2001 Post a comment BALTIMORE -- During the International Test Conference (ITC) here, Test Insight Ltd. here rolled out a line of software that promises to reduce the costs of chip-testing for IC makers.
The first product is a new release of its test-program generation software line--dubbed Wave Wizard. This product generates test patterns in automated test equipment (ATE) from Verilog simulation environments. It also verifies and debugs IC test patterns and timing using a tester behavioral model.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.