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Content tagged with Test & Measurement Designline posted in November 2001
TEL enhances prober to handle mix of 200- and 300-mm wafers
News & Analysis  
11/30/2001   Post a comment
TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
Tessera says ITC won't review finding against Sharp in patent case
News & Analysis  
11/30/2001   Post a comment
SAN JOSE -- Tessera Technologies Inc. today said the U.S. International Trade Commission (ITC) has denied a request from Sharp Corp. for a review of an initial determination by an administrative law judge, who found Sharp in violation of chip-scale packaging patents held by Tessera (see Sept. 26 story).
2001 technology roadmap packs some 'unexpected' surprises
News & Analysis  
11/29/2001   Post a comment
SANTA CLARA, Calif. -- While it may not be a complete surprise that IC technology continues to accelerate faster than expected, there are some unanticipated conclusions in the new 2001 International Technology Roadmap for Semiconductors (ITRS), which is scheduled to be formally presented to the chip industry here today.
Hynix claims all but two Rambus patents dismissed in lawsuit
News & Analysis  
11/28/2001   Post a comment
SAN JOSE -- Hynix Semiconductor Inc. today said a U.S. district court in California has dismissed all but two patent claims out of 400 filed by Rambus Inc. in a dispute over DRAM technology rights.
Korea, Europe, Taiwan lead chip equipment sales lower in Q3, says SEMI
News & Analysis  
11/27/2001   Post a comment
SAN JOSE -- Worldwide semiconductor equipment sales dropped 20.2% sequentially in the third quarter to $5.63 billion from $7.07 billion in Q2, according to new market statistics released today by the SEMI trade group here.
Rambus to appeal injunction preventing DDR patent suits against Infineon
News & Analysis  
11/27/2001   Post a comment
LOS ALTOS, Calif. -- Rambus Inc. here vowed to "swiftly appeal" a final ruling from a Virginia federal court, which has issued a permanent injunction barring the company from filing new patent suits against Infineon Technologies AG involving double data rate (DDR) synchronous DRAMs based on JEDEC industry standards.
Insider Trading (November 2001)
News & Analysis  
11/21/2001   Post a comment
Insider Trading (November 2001)
IC fab utilization plunges to record low 64.2% in Q3, says new report
News & Analysis  
11/21/2001   Post a comment
SAN JOSE -- Wafer-processing IC plants worldwide were operating at a record-low 64.2% capacity utilization in the third quarter, down from 73.1% in Q2 and sharply below 96.4% in same period last year, said a new manufacturing report released by the Semiconductor Industry Association (SIA) here this week.
Nvidia suspends employees accused of insider stock trading
News & Analysis  
11/20/2001   Post a comment
SANTA CLARA, Calif. -- Graphics chip supplier Nvidia Corp. today announced that 10 of its employees have been accused of insider trading violations by the U.S. government.
Analog Devices says pocket PCs--like Compaq's iPAQ--is hot spot for cellular chips
News & Analysis  
11/19/2001   Post a comment
HOUSTON -- Compaq Computer Corp. today became the first handheld PC maker to announce it was using GSM/GPRS chip sets from Analog Devices Inc. to provide wireless communications over digital 2.5-G cellular networks.
More job and pay cuts at Agilent
News & Analysis  
11/19/2001   Post a comment
Agilent Technologies is cutting another 4,000 jobs and enforcing 5% pay reductions on all remaining staff
IEEE passes compromise 54-Mbit/s wireless LAN proposal
News & Analysis  
11/16/2001   Post a comment
At a voting session that ran into Thursday (Nov. 15) evening, the IEEE passed a proposal for a new wireless LAN standard that will boost data rates in the 2.45-GHz spectrum from the present 11-Mbits/second rate of the existing 802.11b standard, to a maximum of 54 Mbits/s for the new standard, to be called 802.11g.
Westell will keep buying Virata broadband chips under suit settlement
News & Analysis  
11/16/2001   Post a comment
SANTA CLARA, Calif.--Virata Corp. today announced settlement of its lawsuit with broadband chip customer Westell Technologies Inc., which earlier this week said it had also reached separate agreements to drop suits filed by Alcatel Microelectronics N.V and the PAC TEL division of La France Corp.
Intersil says task group vote will speed use of faster wireless data networks
News & Analysis  
11/16/2001   Post a comment
IRVINE, Calif.--Intersil Corp. today gave a loud endorsement to an industry task group, which voted on Thursday to move ahead with plans to set standards for higher-speed wireless networks with data rates up to 54 megabits per second in the 2.4-GHz spectrum.
More job and pay cuts at Agilent
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11/16/2001   Post a comment
Test Trade-Offs at ITC 2001
News & Analysis  
11/15/2001   Post a comment
This year's International Test Conference (ITC) focused on test tradeoffs for chip and chip-based systems. Agilent's Rob Aitken, this year's co-chair and ITC 2002's chair, reviews the conference's keynote address along with other pertinent presentations, panels, and papers covering key test issues.
LTX promises to lower the cost of test with new ATE system
News & Analysis  
11/13/2001   Post a comment
WESTWOOD, Mass. -- In a move to reduce the cost of test, LTX Corp. here rolled out a new version of its Fusion line of testers. The new Fusion CX from Westwood-based LTX is designed for use in testing analog, mixed-signal, and wireless chips, said Roger W. Blethen, president and chief executive of LTX. "The Fusion CX expands the range of devices, such as Bluetooth and 802.11, that can be tested economically on Fusion," Blethen said.
LTX believes it hit low point for tester orders in last quarter
News & Analysis  
11/13/2001   Post a comment
WESTWOOD, Mass.--Automatic test equipment supplier LTX Corp. here today reported a net loss of $9.4 million on sharply lower sales of $33.0 million in the company's fiscal first quarter, ended Oct. 31. LTX's revenues were 66% lower than $98 million in the fiscal quarter last year due to the severe downturn in semiconductor test markets.
IDT hires former Intel VP as new president
News & Analysis  
11/12/2001   Post a comment
SANTA CLARA, Calif. -- Integrated Device Technology Inc. here today announced it has hired a former vice president at Intel Corp. as its new president. The move is part of a strategy to increase IDT's business in communications IC markets.
Motorola moves wafer-level burn-in/test to high-end processors
News & Analysis  
11/12/2001   Post a comment
AUSTIN, Tex. -- Motorola Inc. today announced a major extension of wafer-level burn-in and test processes to include high-performance, flip-chip microprocessors, which can now be offered as bare-die products with the same reliability as packaged devices.
Familiar drivers, new consumer systems will revive chip growth, says SIA
News & Analysis  
11/8/2001   Post a comment
For growth in the next several years, the chip industry will be banking heavily on a revival of communications applications, which were derailed in the current downturn, and solid increases in consumer electronics, optical storage and networks, and automotive electronics, according to the new autumn forecast from the Semiconductor Industry Association.
ITC 2001 Emphasizes More Cooperation, Less Test Cost
News & Analysis  
11/8/2001   2 comments
Activities and products at the recent International Test Conference focused on making manufacturing test faster and less expensive. Jim Lipman, TechOnLine's Content Director, discusses ITC's major themes along with some of the show's more interesting product announcements.
SIA says slow 2002 chip recovery will be followed by 21% growth in 2003
News & Analysis  
11/7/2001   Post a comment
SAN JOSE -- After plunging 31% in 2001, chip revenues will begin a slow recovery in 2002, growing 6% to $150 billion, followed by 21% increase in 2003 to $181 billion, according to a new forecast released today by the Semiconductor Industry Association here.
Silicon wafer shipments fall 17% in Q3 over Q2, says SEMI
News & Analysis  
11/6/2001   Post a comment
SAN JOSE -- It's gone from bad to worse for suppliers of blank silicon wafers. Worldwide silicon wafer shipments declined by 17% in the third quarter of 2001, compared to the second period of this year, according to a new forecast from the Semiconductor Equipment and Materials International (SEMI) trade organization here. In its quarterly analysis of the silicon wafer industry, SEMI estimated that silicon wafer shipments were 824 million square inches in the third quarter of 2001.
Teradyne forms new board-test division after GenRad acquisition
News & Analysis  
11/6/2001   Post a comment
BOSTON -- Teradyne Inc. here today announced a new board-test division that combines its own operations with those from its recent acquisition of GenRad Inc. The board-test operation--called the Assembly Test Division--will be headed by Robert M. Dutkowsky. A long-time veteran in the automatic test equipment (ATE) business, Dutkowsky was chairman, president and CEO of GenRad.
Unisys plans big ATE push with burn-in tester for high-end processors
News & Analysis  
11/5/2001   Post a comment
CHANDLER, Ariz. -- Unisys Corp. is widely known as a provider of services in the information-technology (IT) sector, but the company also hopes to elevate its status in a surprising arena--automatic test equipment (ATE). Unisys' low-profile ATE unit--dubbed Unisys Unigen Operations (UUO)--here today announced a new burn-in test system that is specifically designed for high-end microprocessors, ASICs and other complex devices.
HyperTransport, RapidIO switch chips set to duel
News & Analysis  
11/5/2001   Post a comment
The race to define a post-PCI interconnect for communications systems will heat up Monday (Nov. 5) as two fabless design companies announce competing switch chips.
Credence, ISE Labs form chip-testing service center to lower ATE costs
News & Analysis  
11/5/2001   Post a comment
FREMONT, Calif. -- Credence Systems Corp. and International Semiconductor Engineering Laboratories (ISE Labs) here today announced the opening of a new center that will provide low-cost, chip-testing services for IC makers. The Credence Technology Center will provide chip makers with analog, logic, memory, and other chip-testing services. The center will use automatic test equipment (ATE) from Credence of Fremont.
SoC test requirements debated
News & Analysis  
11/2/2001   Post a comment
The prevalence and escalating cost of system-on-chip (SoC) designs are forcing a reexamination of existing approaches to design and test, according to EDA and test industry executives at a panel session during this week's International Test Conference.
Credence's DCI unit rolls out test socket to reduce IC costs
News & Analysis  
11/2/2001   Post a comment
SANTA CLARA, Calif. -- Dimensions Consulting Inc. (DCI) here rolled out a low-power engineering test socket line for use in prototyping complex ICs. The Model 1560 Thermal Control Socket System is a standalone device that enables the characterization of ICs in substantially less time than traditional forced-air thermal control systems, according to DCI of Santa Clara. DCI is a subsidiary of Credence Systems Corp., a supplier of automatic test equipment (ATE), in Fremont, Calif.
Test Insight rolls out test-generation software that reduces ATE costs
News & Analysis  
11/1/2001   Post a comment
BALTIMORE -- During the International Test Conference (ITC) here, Test Insight Ltd. here rolled out a line of software that promises to reduce the costs of chip-testing for IC makers. The first product is a new release of its test-program generation software line--dubbed Wave Wizard. This product generates test patterns in automated test equipment (ATE) from Verilog simulation environments. It also verifies and debugs IC test patterns and timing using a tester behavioral model.
Sales decline eases in chip markets; unit volumes grow in September, says SIA
News & Analysis  
11/1/2001   Post a comment
SAN JOSE -- Asia Pacific chip sales grew 2.6% in September compared to August, but all other regions declined again, causing worldwide revenues to slip 2.5% to $10.22 billion, said the Semiconductor Industry Association today.


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