Toshiba sues Italian DVD maker in patent dispute News & Analysis 12/28/2007 Post a comment Toshiba Corp. has filed a patent-infringement suit against Italian DVD disc replicator ACME SpA in a Milan court. The suit alleges the Italian company is manufacturing and selling DVDs without a license either from Toshiba or the DVD6C Licensing Group that acts as a one-stop shop for DVD patents from nine companies.
ODM module tests fiber-optic networks Product News 12/20/2007 Post a comment JDSU has introduced the Optical Dispersion Measurement (ODM) module for its T-BERD/MTS-6000 and T-BERD/MTS-8000 optical test platforms, which is used for field testing fiber-optic networks.
Certification begins for mobile WiMAX products News & Analysis 12/20/2007 Post a comment Certified Mobile WiMAX products should start appearing on the market early next year as the WiMAX Forum said that suppliers vendors can start submitting their 2.3 GHz and 2.5 GHz gear for testing to the forum's lead certification lab at AT4 Wireless in Spain.
Group focuses on camera phone image quality News & Analysis 12/18/2007 Post a comment The 22-member consortium looking to improve the image quality of camera phones is moving into the second phase of its efforts to develop repeatable, robust, test methods for evaluating the metrics associated with image quality -- both subjective and objective.
Microsoft hits back in mobile browser wars News & Analysis 12/17/2007 Post a comment Microsoft said it would strongly defend itself against complaints to the European Commission by mobile browser group Opera Software that it is illegally handicapping competition, and stressed it would not willingly unbundle Internet Explorer from its Windows browser.
USB, Kleer plug into digital TVs News & Analysis 12/17/2007 Post a comment USB Implementers Forum is developing a variant of its technology to link mobile devices and TVs, and startup Kleer Corp. is announcing it has characterized its proprietary wireless link for standard definition video.
FireWire turns up heat with 3.2 Gbit/s spec Product News 12/14/2007 Post a comment Tomorrow's FireWire interconnects will quadruple in maximum data rates, hitting 3.2 Gbits/second thanks to the S3200 specification from the 1394 Trade Association which sees the new link, in part, as a low-cost alternative to HDMI for carrying uncompressed video.
Probe card lowers IC test cost Product News 12/14/2007 Post a comment FormFactor, Inc. has expanded its TrueScale probe card family for wire bond SoC devices with the introduction of its PP40 wafer probe card. This probe card enables high-efficiency and high-parallelism wafer probing on advanced wire bond logic and SoC devices.
Greenpeace urges console makers to play the game News & Analysis 12/14/2007 Post a comment Nintendo's Mario, Microsoft's Master Chief and Sony's Kratos, and friends, are just not doing enough for the environment, so lobbyist group Greenpeace is urging their fans to write to the games console makers to make the machines more eco-friendly.
ITU promises to do its bit at climate change conference News & Analysis 12/14/2007 Post a comment The International Telecommunication Union (ITU) is attempting to alert delegates at the UN Conference on Climate Change in Bali, Indonesia, to the role being played by the global electronics and communications industry in both causing and potentially lessening energy use.
Chip test startup raises $16 million News & Analysis 12/10/2007 Post a comment Israeli Startup Optimal Test, which has developed a test suite for maximizing IC yields through managed test results, has raised $16 million in a second round of financing. The round was led by Evergreen Venture Partners, with the participation of the existing investors – Carmel Ventures and Pitango.
Upgrades for PCI Express in the works News & Analysis 12/8/2007 Post a comment The PCI Special Interest Group is making progress on a basket of feature extensions to its latest 2.0 specification to enhance system performance as well as smooth a path for accelerators and storage devices, all of which should be available by June at the latest.
India rolls out nanotech initiative News & Analysis 12/6/2007 Post a comment India's national nanotechnology program is rolling out as the first of three Institutes for Nano Science and Technology is inaugurated under the federal government's $250 million national initiative in support of nanotechnological research.
Cellular nets must get smarter, says CTO News & Analysis 12/4/2007 Post a comment Tomorrow's cellular networks will be more intelligent, as they evolve to become more widespread and open, according to Jake MacLeod, chief technology officer for Bechtel Communications Inc.
Fabless organization changes name, role News & Analysis 12/3/2007 Post a comment The Fabless Semiconductor Association has gotten the global-supply-chain gospel. The industry group, formed in 1994 to champion the fabless business model, will announce this week that it is changing its name to the Global Semiconductor Alliance.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.