ITC issues final determination against Tessera News & Analysis 12/30/2009 Post a comment The U.S. International Trade Commission issued a final determination that Tessera Technologies failed to prove that its patents were infringed by some DRAM manufacturers and sellers, including Elpida Memory, Nanya Technology, Powerchip Semiconductor and ProMOS Technologies.
Broadcom settles stock options suit for $160M News & Analysis 12/29/2009 Post a comment Fabless chip vendor Broadcom said it has agreed in principle to settle the securities class action litigation pending against the company and some of its current and former officers and directors for $160.5 million in cash.
The 10 most popular stories of 2009 News & Analysis 12/29/2009 Post a comment Here are the top ten stories for 2009 as ranked by EE Times readers, up to and including Tuesday, Dec. 29. The ranking is based on the number of reader "views" or "hits" on a particular article.
Analyst: Impact of FTC versus Intel overblown News & Analysis 12/28/2009 Post a comment The final impact of a suit brought by the U.S. Federal Trade Commission against Intel is likely to be less than what many expect, according to a Wall Street analyst, who rejected the notion that the courts would force the microprocessor giant to license modern x86 instruction sets to other firms.
Incomplete 3DTV products in CES spotlight News & Analysis 12/23/2009 1 comment The HDMI standard is getting an update to support broadcast stereo 3D content on new and existing links, one of many pieces of the puzzle still being put in place for the roll pout of 3DTV which will be a major focus at the Consumer Electronics Show.
Universities gear up for smart grid training News & Analysis 12/22/2009 Post a comment The U.S. Department of Energy is evaluating dozens of proposals from universities and others seeking $100 million in grants to train tomorrow's engineers and technicians for as many as 30,000 new jobs that could be needed over the next few years as today's electric grid transitions to a digital network.
Amkor raises Q4 sales target News & Analysis 12/22/2009 Post a comment Semiconductor test and assembly house Amkor Technology Inc. Monday (Dec. 21) raised its fourth quarter sales target, citing higher than expected demand across all of its product lines.
Engineer tapped to head smart grid standards work News & Analysis 12/16/2009 Post a comment The U.S. government fueled significant work on smart electric grid this year, but the hard work of making the transition to a digital power network is just beginning, according to Steve Widergren, a principal engineer at Pacific Northwest National Laboratory recently named to head a broad new smart grid standards effort.
Appliance makers outline needs for smart grid Product News 12/14/2009 Post a comment The Association of Home Appliance Manufacturers, a trade association of appliance makers, has released a technical paper outlining what the group needs to enable its products for a smart electric grid as talks continue at the United Nations Climate Change Conference in Copenhagen.
WiGig group gives first peak at 60 GHz spec News & Analysis 12/10/2009 Post a comment The Wireless Gigabit Alliance, an ad hoc group that includes top Wi-Fi chip makers, gave the first peak into its specification for 60 GHz links capable of sending data at rates of 1-7 Gbits/second and aimed at addressing a wide variety of computer and consumer applications.
Day of the Indian engineer News & Analysis 12/9/2009 17 comments Indian engineers can have their day under the sun soon blessed as they are with advantages such as low average age, desirous of staying current on news and continuing technical education and are not blinkered by age-old methods, according to a senior Mentor Graphics executive.
U.S. starts fellows program in energy Product News 12/9/2009 Post a comment The U.S. Department of Energy (DoE) is looking for a few high voltage power engineers and scientists for its new R&D arm--the Advanced Research Projects Agency Energy—which announced it is taking nominations for a new fellows program.
IEEE's council forms EDA user group News & Analysis 12/8/2009 Post a comment The IEEE Council for Electronic Design Automation (CEDA) has formed the Design Technology Committee to explore and analyze future requirements of the system and semiconductor communities toward the EDA industry.
WHDI group announces spec for wireless video News & Analysis 12/8/2009 Post a comment The WHDI Consortium has completed its specification for wireless video over a 5 GHz variant of Wi-Fi based on technology from startup chip designer Amimon, one of at least four major approaches to delivering wireless video in the digital home.
U.S. accelerates battery R&D, green patents Product News 12/7/2009 Post a comment The U.S. government will provide more funds for battery research and accelerate some green technology patent applications as part of a set of announcements made days before the United Nations Climate Change Conference in Copenhagen.
Court orders Apple to pay Opti $22 million News & Analysis 12/4/2009 Post a comment A U.S. federal court has ordered Apple to pay $21.7 million in royalties and interest to technology licensor Opti for unintentionally infringing one of Opti's patents, according to a statement issued by Opti.
Wanted: Moon engineers News & Analysis 12/4/2009 Post a comment Engineering students worried about their job prospects and looking to expand their design experience may want to consider a NASA internship program.
ST reorganizes regional structure News & Analysis 12/3/2009 Post a comment STMicroelectronics NV (Geneva, Switzerland) has announced changes in its global sales and marketing organization, consolidating ST's regions in Asia to two: Greater China & South Asia, Japan & Korea, with effect from Jan. 1, 2010.
HTC joins defensive patent pool News & Analysis 12/3/2009 Post a comment Taiwanese mobile phone maker HTC Corp. has become the twentieth company to join startup RPX Corp. a defensive patent pool service started a year ago in a sign the hunger to lower costs and risks of patent infringement litigation is still keen among established electronics companies.
Update: EU clears Renesas-NEC merger News & Analysis 12/2/2009 Post a comment The proposed merger between Japanese chip makers Renesas Technology and NEC Electronics has been approved by the European Commission, the executive body of the European Union.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.