STMicroelectronics opens new 8-inch fab, flash R&D center News & Analysis 2/27/2001 Post a comment STMicroelectronics today inaugurated an advanced technology research-and-development center along with an 8-inch wafer fab for flash memory at the company's site in Agrate Brianza, Italy, near Milan. The R2 Technology Center will focus heavily on the development and advanced manufacturing of products based on deep-submicron flash and other non-volatile memory technologies, including smart cards.
Network Processor Forum to unite CSIX and CPIX efforts News & Analysis 2/27/2001 Post a comment Former members of two network processor groups have joined together to form the Network Processing Forum, a consortium aimed at accelerating development of networking and telecommunications products by establishing standards. The NP Forum has established four working groups to drive the development of standards, said Raj Yavatkar, director of the Internet Exchange Architecture for Intel and NP Forum board member.
AMD constructs $45 million test, design center for MPUs in Singapore News & Analysis 2/27/2001 Post a comment SINGAPORE--In a move to expand its Asian resources for microprocessor products, Advanced Micro Devices Inc. today (Feb. 27) broke ground for a new $45 million semiconductor testing and chip design facility in Singapore. The seven-story testing facility and design center will be operational in the second half of 2002, said the Sunnyvale, Calif., company.
Intel pushes buildout of Infiniband infrastructure News & Analysis 2/26/2001 Post a comment Hoping to ensure a smooth rollout of the burgeoning Infiniband infrastructure, Intel Corp. will unveil a dedicated interoperability lab, demonstrate the first Infiniband fabric with a multitude of vendors and begin licensing its Infiniband product development kit and port logic at the Intel Developer Forum, which starts Monday (Feb. 26).
Qualcomm's shares tumble amid problems in cell-phone business News & Analysis 2/23/2001 Post a comment SAN DIEGO -- Shares of Qualcomm Inc. took a beating today (Feb. 23) amid reports of weak demand for its chip products and delays in the deployment of third-generation (3G) wireless technology.
The concerns among analysts caused San Diego-based Qualcomm's stock to fall by some 7.7% to about $61.81 per share in heavy trading today.
Conflicts between Bluetooth and wireless LANs called minor News & Analysis 2/20/2001 Post a comment Wireless Bluetooth links and 802.11b wireless LANs can clash, but the conflicts are within acceptable limits, according to tests from two systems makers. However, clouds still hang over the expected rollout of Bluetooth products later this year and some notebook makers said they will not build Bluetooth into their portables until 2002.
Top 10 chip tool suppliers outpace rest in growth, says new ranking News & Analysis 2/20/2001 Post a comment SAN JOSE -- For the semiconductor equipment industry, 2000 was an extremely good year, and it was even better for the top 10 suppliers of tools. With worldwide revenues for chip production systems increasing by more than 80% for the first time in history, the world's top 10 suppliers grew 85.6% in 2000 over the previous year, according to a new ranking released by VLSI Research Inc. here.
FormFactor's pushes parallel probe testing to 128 devices on wafer News & Analysis 2/15/2001 Post a comment LIVERMORE, Calif. -- FormFactor Inc. here today (Feb. 15) announced a major advancement in probe-card technology that enables IC manufacturers to test up to 128 chips on a wafer with a single "touchdown." The jump in parallel probe testing can potentially save tens of millions of dollars in capital spending costs, said the company.
Credence's tester sales drop 44% sequentially in quarter News & Analysis 2/14/2001 Post a comment FREMONT, Calif. -- Credence Systems Corp. here today (Feb. 14) reported net sales dropped sequentially 44% in the company's fiscal first quarter, ended Jan. 31, compared to $220.2 million in the prior three-month period. Sales were up 21% from $101.8 million in the quarter last year.
AMD confirms Ruiz will succeed Sanders as CEO in 2002 News & Analysis 2/14/2001 Post a comment dvanced Micro Devices Inc. said today that W.J. (Jerry) Sanders III, chairman and chief executive, will serve as CEO until the annual shareholder meeting in April 2002, at which time Hector de J. Ruiz, AMD's current president and chief operating officer, will succeed Sanders as CEO. Sanders will serve as chairman of the board through 2003.
SMTC expands capacity in New England News & Analysis 2/12/2001 Post a comment To expand its manufacturing presence in New England, SMTC Corp. said today it has opened a state-of-the-art facility in Massachusetts. The Markham, Ontario, electronic-manufacturing services provider now counts Franklin, Mass., among its plant locations since the company completed building a 150,000-sq.-ft. facility
Samsung, Infineon, Micron chase low-power DRAM sales News & Analysis 2/12/2001 Post a comment SEOUL -- The battle over low-power, high-density memory devices in handheld wireless systems is heating up--so to speak. DRAM rivals Samsung, Infineon, and Micron have launched low-power consuming memories for next-generation mobile systems and cellular handsets.
Ikos and MIT sue Axis News & Analysis 2/9/2001 Post a comment Ikos Systems Inc. (Cupertino, Calif.) and the Massachusetts Institute of Technology (MIT) have co-filed a patent infringement suit against startup Axis Systems Inc. (Sunnyvale, Calif.) in the U.S. District Court in Delaware for violating one MIT and three Ikos patents involving emulation technology.
Credence lays off 200 employees, cuts work schedules News & Analysis 2/9/2001 Post a comment FREMONT, Calif. -- Automatic test equipment supplier Credence Systems Corp. has announced it will lay off 200 workers, about 14% of its workforce, due to the downturn in ATE systems markets. Credence also said it is requiring all of its remaining employees to take off one week in each quarter until the slump ends.
Taiwan's ASE Test aims to capitalize from slowdown after brief pause News & Analysis 2/9/2001 Post a comment TAIPEI, Taiwan -- ASE Test Ltd. here believes suppliers of IC-testing services will benefit from the current semiconductor slowdown as chip companies cut costs by outsourcing more manufacturing steps. But in the first quarter of 2001, the world's largest contract chip-testing house is expecting a 15% drop in revenues from record sales of $124.7 million in the fourth quarter of 2000.
Reusable intellectual property group disbands News & Analysis 2/6/2001 Post a comment LOS GATOS, Calif.--Backers of the Reusable Application-Specific Intellectual Property Developers (RAPID) group have decided to disband the organization, which was formed in 1996 to help promote the concept of buying and selling third-party design cores.
SIA backs off its 22% growth forecast; December sales slip News & Analysis 2/5/2001 Post a comment SAN JOSE -- Worldwide chip sales hit a record $204 billion in 2000 despite revenues slipping 2.1% to $17.89 billion in December compared to $18.27 billion in November, said the Semiconductor Industry Association today. The SIA also said the industry is now unlikely to reach the trade group's forecast of 22% sales growth in 2001 because of excess inventory at manufacturers and chip distributors.
Atmel says court sends Macronix case back to ITC News & Analysis 2/2/2001 Post a comment SAN JOSE--Atmel Corp. today said an appellate court affirmed a U.S. injunction against the import of products by Silicon Storage Technologies Inc., Winbond Electronics Corp., and Sanyo Electric Co. Ltd., which are accused of infringing upon a company patent.
Cohu's Q4 sales fall 23% as test handler demand weakens News & Analysis 2/1/2001 Post a comment SAN DIEGO--Cohu Inc. here today reported a 23% drop in sales to $57.0 million during the fourth quarter compared to $74.1 million in the period last year. Sales fell 26% sequentially from $77.2 million in the third quarter, said the supplier of semiconductor test handlers.
Hyundai, Infineon settle lawsuits with cross-licensing pact News & Analysis 2/1/2001 Post a comment MUNICH -- Hyundai Electronics Industries Co. Ltd. and Infineon Technologies AG announced a cross-licensing pact that settles a number of patent lawsuits pending in the U.S. and Germany. Terms of the technology pact and long-term business agreement were not released by the two companies.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.