Researchers say eye strain a concern as 3-D TVs debut News & Analysis 2/25/2010 Post a comment Experts in human perception are expressing concerns stereo 3-D TVs now hitting the market could cause eye strain and related health problems, a sensitive topic industry groups are actively discussing, but in their rush to get systems out the door vendors have yet to fund any major studies of the issues.
Senator: Committee struck deal on patent reform News & Analysis 2/25/2010 Post a comment A U.S. Senator leading the charge for patent reform suggested a Senate committee has struck a rough compromise keeping a draft bill alive by balancing calls for lowering damages in patent infringement suits with calls for improving the quality of patents.
PRODUCT HOW TO: Improving switch maintenance in PXI with BIRST News & Analysis 2/25/2010 Post a comment Switching systems are a key part of any test system, they allow users to connect the test equipment to the unit under test in different ways. Users consider the switching system to be perhaps one of the most likely parts of the system to fail, this article explores the reasons for concern and a way that one manufacturer has found to diagnose these problems.
Mil/aero group foresees shift to optical in 2012 News & Analysis 2/24/2010 1 comment The VITA Standards Organization, a leading standards group for military and aerospace markets, will announce as early as next week a call for participation in a group to explore the feasibility of deploying in 2012 products with optical backplanes and system interconnects.
Intel-led alliance pledges $3.5B in venture funds News & Analysis 2/23/2010 Post a comment The Invest in America Alliance, a group of 25 venture capital and 17 high tech companies led by Intel Corp., pledged to invest $3.5 billion in U.S. technology startups over the next two years and hire as many as 10,500 college students in 2010.
Uncle Sam asks consumers to weigh in on smart grid News & Analysis 2/22/2010 Post a comment In an effort to break through electronics-industry logjams, U.S. government policy makers are launching a blog to consumers for comment on a range of questions about smart electric grids including issues about gateways and networks that speak to systems engineers.
Infineon files DRAM complaint against Elpida News & Analysis 2/22/2010 Post a comment Chipmaker Infineon Technologies AG (Munich, Germany) has announced it has filed a complaint with the U.S. International Trade Commission (ITC) against Elpida Memory Inc. (Tokyo, Japan) seeking to stop Elpida from importing and selling certain DRAMs in the United States.
Mentor names VP of new ventures News & Analysis 2/19/2010 1 comment Mentor Graphics Corp. announced it has named Serge Leef, current general manager of the System Level Engineering division, as vice president of New Ventures, to expand the company into markets adjacent to EDA.
ISSCC, Nvidia shortfall lead weekly story ranking News & Analysis 2/19/2010 Post a comment Here are the top five online stories for the week beginning Sunday, Feb. 14, as ranked by EE Times readers, up to and including Friday, Feb. 19. The ranking is based on the number of reader "views" or "hits" on a particular article.
Silicon Frontline enhances post-layout verification tools Product News 2/19/2010 Post a comment Startup Silicon Frontline Technology, Inc. has introduced the latest versions of its products for post-layout verification: F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures like power devices.
PLX fires up 8 GHz PCI Express chip News & Analysis 2/17/2010 Post a comment PLX Technology, Inc. announced it has working PCI Express Gen 3 silicon that it will demo to key customers before the end of March and aims to sample a range of PCIe Gen 3 switches made in 40nm process technology before the end of the year, starting with server and storage switches sampling before July.
EU project to define next gen design methodologies Product News 2/17/2010 Post a comment Scientists and companies from Europe and Brazil have joined forces in an EU-backed project that aims to develop design methods and EDA tools in a view to remove the limitations in physical implementation effectiveness associated with technology scaling and advanced sub-wavelength lithography.
XMOS brings in veteran chip exec as interim CEO News & Analysis 2/16/2010 Post a comment XMOS Semiconductor Ltd. (Bristol, England), a vendor of event-driven multicore processor chips, has announced the appointment of Charles Cotton as a board member and interim chief executive officer. He takes over from James Foster, who continues as an advisor to the company.
CoFluent bridges gap from UML to SystemC Product News 2/15/2010 Post a comment French ESL company CoFluent Design (Nantes, France) claimed it has developed a methodology that combines the OMG's (Object Management Group) standards UML (Unified Modeling Language), SysML (System Modeling Language) and MARTE (Modeling and Analysis for Real-Time and Embedded Systems) profiles.
IBM joins EU R&D project to slash chip design time News & Analysis 2/11/2010 Post a comment IBM Research Lab in Haifa, Israel, announced it has joined the European research project DIAMOND (Diagnosis, Error Modeling and Correction for Reliable Systems Design) to provide integrated diagnosis and correction for spec, design and soft errors.
Amkor beats Q4 sales target News & Analysis 2/10/2010 Post a comment Semiconductor test and assembly house Amkor Technology reported revenue of $668 million for the fourth quarter of 2009, surpassing analyst's expectations and the company's own revised sales target for the period, issued in December.
An analyst's 10 reasons to be cheerful News & Analysis 2/8/2010 Post a comment Bill McClean, analyst with IC Insights Inc. (Scottsdale, Ariz.) has provided ten reasons that support the idea that 2010 could be between a good and a great year for the semiconductor industry.
Engineers explore life beyond 10 Gbit links News & Analysis 2/8/2010 1 comment Electronics engineers are bumping up against the limits of their tools and techniques—and perhaps even physics--to keep pace with the rapidly expanding needs of an Internet-driven society as they coalesce around a move to 25 Gbit/second chips and ponder what comes next.
Metering chips feature isolated sensing technology Product News 2/7/2010 Post a comment Teridian Semiconductor has begun sampling its fourth generation residential smart metering integrated circuits (ICs) that eliminate costly current transformers and associated copper wiring in 2-element residential meters, with up to class 0.2-accuracy.
Cadence back in the black in Q4 News & Analysis 2/5/2010 Post a comment EDA vendor Cadence Design Systems Inc. (San Jose, Calif.) reported a net income of $2 million, based on generally accepted accounting principles (GAAP), for the fourth quarter of 2009, compared to a net loss of $1.63 billion a year ago.
FCC may redraw spectrum allocations in broadband plan News & Analysis 2/4/2010 1 comment A Federal Communications Commission director suggested the agency is exploring new ways to use a swath of spectrum to serve multiple users including utilities building smart electric grids as part of a national broadband plan the FCC will release March 17.
Data logger supports all automotive bus systems Product News 2/3/2010 Post a comment For test and evaluation purposes in automotive environments, Ixxat automation GmbH (Weingarten, Germany) has developed its CARcorder diagnosis and data logging unit. The device supports all relevant bus systems such as CAN, FlexRay and LIN.
Forum describes 25G backplane, standard News & Analysis 2/1/2010 Post a comment The Optical Internetworking Forum has successfully demonstrated a 25 Gbit/second backplane, more than twice the speed to today's typical systems and reported on it at an open workshop hosted by the Optical Internetworking Forum that is drafting a standard for 25G interconnect.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.