Infineon mulls transistor plant in China News & Analysis 3/30/2001 Post a comment BEIJING -- Munich-based Infineon Technologies AG is considering a joint venture in China to make transistors and diodes for telecom products, according to sources familiar with the negotiations.
China will supply 25% of its chip needs by 2005 despite buildup News & Analysis 3/28/2001 Post a comment BEIJING -- Semiconductor capital spending in mainland China will nearly double to $4 billion in 2001 from about $2.1 billion in 2000, according to government estimates presented at industry forum here today (March 28). Investments in China's chip plants will then surge to $7 billion by 2003, said the government.
Ex-Motorolan sails into DSP waters News & Analysis 3/22/2001 Post a comment At Motorola, Tom Beaver helped make the VMEbus a mainstay of the electronics industry. Now he's hoping he'll be able to steer another technology into the realm of classic. As the new chief at tiny 3DSP Corp., Beaver has turned his attention to system-on-chip digital signal processing, with a view to guiding his company's DSP core technology into design wins with OEM customers and chip makers alike.
All eyes are now on tool orders as key cycle indicator News & Analysis 3/21/2001 Post a comment NEW YORK -- With semiconductor capital spending still falling deeper into negative "growth" territory, Wall Street is turning more of its attention to tool orders, believing that the bookings rate will be an early indicator of when the industry downturn will hit bottom.
Very-short-reach interface specs roll News & Analysis 3/20/2001 Post a comment The Optical Internetworking Forum has adopted a pair of very short-reach (VSR) interface standards in an effort to bring down the costs of OC-192/STM-64 links among equipment within a telephone company's central office.
Yokogawa develops first 50-Gbit devices for optical-network instruments News & Analysis 3/19/2001 Post a comment TOKYO -- Yokogawa Electric Corp. here claimed development of the industry's first 50-gigabit-per-second devices, which were fabricated with indium gallium phosphide (InGaP) and indium gallium arsenide (InGaAs) for telecommunications measurement instruments targeted at next-generation optical communications networks.
To Chip Designers, Test is a Four-Letter Word News & Analysis 3/19/2001 Post a comment You don't have to like implementing design-for-test in your chips, but you have to do it. Help is on the way through cooperative efforts between vendors that develop chip DFT software and companies that manufacture chip test equipment.
Intel combines communications IC and systems groups, shuffles executives News & Analysis 3/14/2001 Post a comment SANTA CLARA, Calif. -- Intel Corp. today (March 14) announced a major structural change in its communications products businesses, combining semiconductor and network systems groups into a single operation to serve Internet infrastructure. Along with the move, Intel is shuffling top management, and it announced the retirement of two corporate executives.
LSI Logic rolls out lead-free BGAs for communications, storage systems News & Analysis 3/14/2001 Post a comment MILPITAS, Calif. -- LSI Logic Corp. today (March 14) introduced lead-free ball-grid array (BGA) chip packages for communications and storage peripheral applications. The new BGAs are aimed to satisfy government directives in Japan, Europe, and the U.S. for environmentally-friendly electronics, including products that do not contain lead.
Analogue converters put focus on SoC test costs News & Analysis 3/14/2001 Post a comment Logicvision is working on a project that will bring on-chip test to mixed-signal designs that use analogue-to-digital converters (ADCs) in an attempt to stop the rise in test costs, particularly for complex system-on-chip (SoC) designs. At the same time, Agilent Technologies and Synopsys have cut a deal in which the two companies will try to optimise test software for SoC production.
Matsushita inks Rambus licensing pact for SDRAM, DDR controllers News & Analysis 3/13/2001 Post a comment LOS ALTOS, Calif.--Japan's Matsushita Electric Industrial Co. Ltd. has become the eighth chip maker to license Rambus Inc.'s patents for controllers used with synchronous DRAMs and double data rate (DDR) memories. Rambus today (March 13) said Matsushita is the first "logic-only" licensee to sign an agreement for those patents.
Proxim claims patent rights to 2.4-GHz wireless LAN technology News & Analysis 3/8/2001 Post a comment
SUNNYVALE, Calif. -- In what promises to become a major legal battle, Proxim Inc. today (March 8) launched a patent enforcement campaign aimed at protecting its direct sequence wireless networking intellectual property, which the company claims is a key element of the 2.4-GHz IEEE 802.11b standard.
Taiwan edges Japan as second largest chip-gear market News & Analysis 3/1/2001 Post a comment SAN JOSE -- Worldwide revenues for chip-making tools grew 90% to $48.4 billion in 2000 from $25.5 billion in 1999, according to a report released today (March 1) by the Semiconductor Equipment and Materials International (SEMI) trade group. The report shows Taiwan just passing Japan as the world's second largest region for chip-production tools.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.