Agilent plans major upgrade of SoC chip testers News & Analysis 3/28/2002 Post a comment SANTA CLARA, Calif. -- During a series of presentations here this week, Agilent Technologies Inc. gave a sneak preview of plans to upgrade its IC testers for cutting-edge communications semiconductors, system-on-a-chip products and other devices.
Infineon executive urges chip makers to adopt more standards News & Analysis 3/27/2002 Post a comment SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
JEDEC describes new DDR-II specs, says first parts due out in late 2002 News & Analysis 3/26/2002 Post a comment SANTA CLARA, Calif. -- During the JEDEX conference here on Monday, representatives from the DRAM and PC markets outlined some of the first public details, specifications and updates for a second-generation, double-data-rate SDRAM standard called DDR-II.
The proposed DDR-II standard has been in the works for months and is supposed to replace existing DDR SDRAMs or DDR-I. The "mainstream DRAM" market is also supposed to migrate from the 200/266-MHz versions of DDR SDRAMs in the market today, to t
ESEC replaces CEO with former Siemens Semiconductor chief News & Analysis 3/25/2002 Post a comment CHAM, Switzerland -- Chip-assembly tool supplier ESEC Group today announced its board had replaced the company's chief executive officer after a disagreement about strategies to turnaround the struggling company. ESEC named Jürgen Knorr--former head of the Siemens Semiconductor Group in the 1980s and 1990s--as its new CEO.
IXYS to appeal injunction of products based on Samsung-IR settlement News & Analysis 3/25/2002 Post a comment SANTA CLARA, Calif.--Power semiconductor supplier IXYS Corp. here announced a court decision binding the company to an injunction entered in a settlement between Samsung Electronics Co. Ltd. and International Rectifier Corp. Samsung in South Korea is a major silicon foundry supplier to IXYS, and the decision affects certain MOSFET devices sold by the company in the U.S. market.
QDR SRAM group says JEDEC spec supports future chip densities News & Analysis 3/20/2002 Post a comment SAN JOSE -- The five development partners promoting Quad Data Rate (QDR) SRAMs today announced JEDEC approval of industry packaging standards for QDRII and Double Data RateII (DDRII) static RAM architectures. These devices are aimed at serving high-speed communications and are competing with rival format, called "SigmaRAM."
Proof of cancer link in fab workers still missing, says SIA panel News & Analysis 3/19/2002 Post a comment SAN JOSE -- An advisory committee has concluded there is no affirmative evidence of increased cancer risk in wafer fab workers, but the panel also said there is insufficient data to decide whether or not exposure to chemicals and other hazardous materials in chip plants could be a factor in cancer cases.
Agilent believes its test business is off to strong start in 2002 News & Analysis 3/12/2002 Post a comment PALO ALTO, Calif. -- Propelled by the spread of system-on-chip designs, graphics ICs, and other high-performance products, Agilent Technologies Inc. here is counting on its automatic test equipment (ATE) business to grow faster than the industry average for 2002, according to company executives. That might not be too hard since the entire ATE segment is expected to be nearly flat in 2002.
HyperTransport Consortium adds eight member companies News & Analysis 3/11/2002 Post a comment SAN FRANCISCO -- Eight new member companies have joined the HyperTransport Technology Consortium to promote the HyperTransport I/O link for high-speed communications between integrated circuits. The new members are: Hewlett-Packard, Hifn, NEC Electronics, NurLogic Design, Phoenix Technologies, SandCraft, Schlumberger Semiconductor Solutions, and Seaway Networks.
Ex-employee of TSMC sent e-mail to China's SMIC, says wire service News & Analysis 3/7/2002 Post a comment TAIPEI, Taiwan -- A former employee of Taiwan Semiconductor Manufacturing Co. Ltd. accused of leaking trade secrets to a rival startup foundry in mainland China has been identified in local newspaper reports as working for Shanghai-based Semiconductor Manufacturing International Corp., said the Associated Press today.
Infineon teams with Austria's NewLogic in wireless LAN licensing pact News & Analysis 3/7/2002 Post a comment MUNICH -- Infineon Technologies AG here and Austria's NewLogic Technologies AG today announced a cross-licensing and royalty agreement for intellectual property (IP) used in wireless local area network products. The two companies said the pact will help Infineon speed development of wireless LAN products while support NewLogic's IP portfolio.
Cabot pays Rodel $1 million in settlement of slurry patent suit News & Analysis 3/1/2002 Post a comment AURORA, Ill.--Cabot Microelectronics Corp. will pay Rodel Inc. $1 million and receive a worldwide license for technology as part of a patent lawsuit settlement announced by the two companies. Other details about the settlement were not released, and none of the parties admitted to liability in the settlement.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.