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Content tagged with Test & Measurement Designline posted in March 2002
Agilent plans major upgrade of SoC chip testers
News & Analysis  
3/28/2002   Post a comment
SANTA CLARA, Calif. -- During a series of presentations here this week, Agilent Technologies Inc. gave a sneak preview of plans to upgrade its IC testers for cutting-edge communications semiconductors, system-on-a-chip products and other devices.
Infineon executive urges chip makers to adopt more standards
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3/27/2002   Post a comment
SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
JEDEC takes aim at defining wireless LAN chip standards
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3/27/2002   Post a comment
SANTA CLARA, Calif. -- JEDEC today clarified its efforts in the 802.11 wireless local-area networking (WLAN) market, saying it is setting up a new committee to develop the chip-level "physical-layer interface" standards for the technology.
JEDEC describes new DDR-II specs, says first parts due out in late 2002
News & Analysis  
3/26/2002   Post a comment
SANTA CLARA, Calif. -- During the JEDEX conference here on Monday, representatives from the DRAM and PC markets outlined some of the first public details, specifications and updates for a second-generation, double-data-rate SDRAM standard called DDR-II. The proposed DDR-II standard has been in the works for months and is supposed to replace existing DDR SDRAMs or DDR-I. The "mainstream DRAM" market is also supposed to migrate from the 200/266-MHz versions of DDR SDRAMs in the market today, to t
ESEC replaces CEO with former Siemens Semiconductor chief
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3/25/2002   Post a comment
CHAM, Switzerland -- Chip-assembly tool supplier ESEC Group today announced its board had replaced the company's chief executive officer after a disagreement about strategies to turnaround the struggling company. ESEC named Jürgen Knorr--former head of the Siemens Semiconductor Group in the 1980s and 1990s--as its new CEO.
JEDEC discloses DRAM roadmap, but 400-MHz DDR may not make the cut
News & Analysis  
3/25/2002   Post a comment
SANTA CLARA, Calif. -- During the first-ever JEDEX conference today, a representative from JEDEC outlined a roadmap for the "mainstream" DRAM market, disclosing that his organization "may or may not" ratify a much-anticipated standard for 400-MHz double-data-rate (DDR) SDRAMs.
IXYS to appeal injunction of products based on Samsung-IR settlement
News & Analysis  
3/25/2002   Post a comment
SANTA CLARA, Calif.--Power semiconductor supplier IXYS Corp. here announced a court decision binding the company to an injunction entered in a settlement between Samsung Electronics Co. Ltd. and International Rectifier Corp. Samsung in South Korea is a major silicon foundry supplier to IXYS, and the decision affects certain MOSFET devices sold by the company in the U.S. market.
IC tester segment sees hope in above-parity book-to-bill
News & Analysis  
3/22/2002   Post a comment
SAN JOSE -- Suppliers of automatic test equipment (ATE) are beginning to see some positive signs after a horrific year in 2001, but many vendors believe the real growth will not occur until 2003.
QDR SRAM group says JEDEC spec supports future chip densities
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3/20/2002   Post a comment
SAN JOSE -- The five development partners promoting Quad Data Rate (QDR) SRAMs today announced JEDEC approval of industry packaging standards for QDRII and Double Data RateII (DDRII) static RAM architectures. These devices are aimed at serving high-speed communications and are competing with rival format, called "SigmaRAM."
Proof of cancer link in fab workers still missing, says SIA panel
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- An advisory committee has concluded there is no affirmative evidence of increased cancer risk in wafer fab workers, but the panel also said there is insufficient data to decide whether or not exposure to chemicals and other hazardous materials in chip plants could be a factor in cancer cases.
Canon will emphasize partnerships in lithography to reach No. 1 position
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- Canon Inc. today said it will place greater emphasis on partnerships in lithography and wafer-processing technologies as it continues to pursue a corporate goal of becoming No. l in exposure tools for chip production.
MRT promises counter suit in patent fight with Genesis Microchip
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3/19/2002   Post a comment
SUNNYVALE, Calif.--Media Reality Technologies Inc. promised to "vigorously fight" a U.S. patent infringement lawsuit filed by Genesis Microchip Inc., which is accusing MRT and two other companies of violating its technology for liquid-crystal display (LCD) controllers.
Metrowerks offers live 2.5G test
News & Analysis  
3/19/2002   Post a comment
Real-world networks will allow application developers to check projects and avoid embarassing launch bugs.
UK associations in the dark on EU plan to recognise qualifications
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3/18/2002   Post a comment
The IEE and FEI both admit to not being aware Brussels had published its latest proposals.
Agilent Labs pursues FeRAMs, optical processors, and 100-Gbit Ethernet
News & Analysis  
3/14/2002   Post a comment
PALO ALTO, Calif. -- Behind the protected doors of Agilent Labs here, researchers are in pursuit of a surprising range of advanced and somewhat exotic R&D projects to position Agilent Technologies Inc. in emerging new markets by the middle of this decade.
Agilent believes its test business is off to strong start in 2002
News & Analysis  
3/12/2002   Post a comment
PALO ALTO, Calif. -- Propelled by the spread of system-on-chip designs, graphics ICs, and other high-performance products, Agilent Technologies Inc. here is counting on its automatic test equipment (ATE) business to grow faster than the industry average for 2002, according to company executives. That might not be too hard since the entire ATE segment is expected to be nearly flat in 2002.
HyperTransport Consortium adds eight member companies
News & Analysis  
3/11/2002   Post a comment
SAN FRANCISCO -- Eight new member companies have joined the HyperTransport Technology Consortium to promote the HyperTransport I/O link for high-speed communications between integrated circuits. The new members are: Hewlett-Packard, Hifn, NEC Electronics, NurLogic Design, Phoenix Technologies, SandCraft, Schlumberger Semiconductor Solutions, and Seaway Networks.
Ex-employee of TSMC sent e-mail to China's SMIC, says wire service
News & Analysis  
3/7/2002   Post a comment
TAIPEI, Taiwan -- A former employee of Taiwan Semiconductor Manufacturing Co. Ltd. accused of leaking trade secrets to a rival startup foundry in mainland China has been identified in local newspaper reports as working for Shanghai-based Semiconductor Manufacturing International Corp., said the Associated Press today.
Infineon teams with Austria's NewLogic in wireless LAN licensing pact
News & Analysis  
3/7/2002   Post a comment
MUNICH -- Infineon Technologies AG here and Austria's NewLogic Technologies AG today announced a cross-licensing and royalty agreement for intellectual property (IP) used in wireless local area network products. The two companies said the pact will help Infineon speed development of wireless LAN products while support NewLogic's IP portfolio.
Suit accuses Nvidia of inflating stock price with accounting practice
News & Analysis  
3/6/2002   Post a comment
BALA CYNWYD, Pa -- A class action lawsuit has been filed against graphics chip supplier Nvidia Corp. by a law firm here, which accuses the Silicon Valley company of violating accounting rules to overstate its revenues and assets.
TSMC charges employee with giving data to China rival
News & Analysis  
3/6/2002   Post a comment
HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. Ltd. has brought charges against a former employee for allegedly sending confidential business information to a rival in mainland China.
A second look at jitter: Calculating bit error rates
News & Analysis  
3/6/2002   Post a comment
Now that you know what jitter feels like, the question is "Okay: why should I care?" In this piece, Maxim's popular communications guru, Justin Redd, correlates jitter and bit error rates with some handsome trigger circuits.
Processed-wafer demand will grow 16% in 2002, says fabless trade group survey
News & Analysis  
3/6/2002   Post a comment
SAN JOSE -- Demand for foundry-processed wafers will grow 16% in 2002 over shipments in 2001, but bookings will be up just 2% sequentially in the first quarter over Q4 last year, according to tempered results from an annual survey by the Fabless Semiconductor Association.
Mattson wants to stop shipments of Dainippon Screen systems after jury verdict
News & Analysis  
3/6/2002   Post a comment
FREMONT, Calif.--After a four-week jury trial, Mattson Technology Inc. here said it has won a verdict in a U.S. patent lawsuit against Japan's Dainippon Screen Manufacturing Co. Ltd. (DNS) for infringement of technology in wafer drying systems.
January chip sales slip, but SIA expects 'double-digit growth' in last half of year
News & Analysis  
3/5/2002   Post a comment
SAN JOSE -- Monthly semiconductor sales sequentially declined 1.7% in January to $10.01 billion from $10.18 billion in December, according to a new report released today by the Semiconductor Industry Association here.
Intel aims to push 'ultrawideband' wireless connection to 500-Mbit speeds
News & Analysis  
3/1/2002   Post a comment
SAN FRANCISCO -- During the Intel Developer Forum (IDF) here this week, Intel Corp. claimed it has developed the world's fastest chips and systems, based on a new, short-range wireless technology, called "ultrawideband" (UWB).
Cabot pays Rodel $1 million in settlement of slurry patent suit
News & Analysis  
3/1/2002   Post a comment
AURORA, Ill.--Cabot Microelectronics Corp. will pay Rodel Inc. $1 million and receive a worldwide license for technology as part of a patent lawsuit settlement announced by the two companies. Other details about the settlement were not released, and none of the parties admitted to liability in the settlement.


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