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Content tagged with Test & Measurement Designline posted in March 2008
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Groups debut multicore API, benchmarks
News & Analysis  
3/31/2008   Post a comment
Efforts to improve techniques for programming and measuring multicore processors take three small steps forward as the annual MultiCore Expo where the Multicore Association will announce it has completed work on a standard applications programming interface for communications and started work to define a standard for embedded virtualization and a related group will show the first fruits of its efforts to define a benchmark for multicore CPUs.
Wireless channel emulator adds bi-directional MIMO, beamforming testing
Product News  
3/31/2008   Post a comment
Spirent Communications has released new packaged configurations for its Spirent SR5500 wireless channel emulator targeted at WiMAX and LTE developers.
Reporter's Notebook: Hong Kong rises with mainland
News & Analysis  
3/31/2008   Post a comment
Ten years after its handover from Britain, Hong Kong is vibrant community rising on China's coattails.
India's people power is also its problem
News & Analysis  
3/28/2008   Post a comment
One of India's biggest challenges is managing its biggest strength: its deep well of young and talented people.
Agilent demos automated DisplayPort physical layer compliance test
Product News  
3/26/2008   Post a comment
Agilent claims to demonstrate the industry's fully automated DisplayPort receiver physical layer compliance test solution at DisplayPort Plug Test in Yokohama, Japan.
Ixthus : Laser triangulation position sensor has high-speed CANbus
Product News  
3/26/2008   Post a comment
Manufactured by Riftek, the RF603 laser triangulation sensor with a CANbus interface is capable of fast 1 Mbits/s position feedback over a measurement range from 2 to 1000 mm.
Surface monitoring for industrial production gets smart
News & Analysis  
3/25/2008   Post a comment
Against the background of growing quality requirements as well as increasing pressure to increase productivity, automatic surface monitoring technologies increasingly gain importance. With its MASC System (Modular Algorithms for Surface Control), Fraunhofer Institute Techno- und Wirtschaftsmathematik (Fraunhofer ITWM) has developed a set of software tools that detect and classify material defects through image processing.
Siemens to restructure international organization
News & Analysis  
3/25/2008   Post a comment
According to media releases, industry giant Siemens AG intends to radically restructure its international business organization.
UPDATED: Yen departs Sun chip unit for Juniper
News & Analysis  
3/25/2008   Post a comment
Veteran David Yen is leaving Sun Microsystems to take an unnamed position at Juniper Networks in April after just one year in his latest post as head of Sun's revived semiconductor unit.
Azimuth MIMO channel emulator adds models, enhancements
Product News  
3/24/2008   Post a comment
Now supported are configurations from full 4x4 to multiple 2x2, uni-directional or bi-directional -- all with simple configuration and no re-cabling.
Synchronized, portable USB module analyzes sound and vibration
Product News  
3/24/2008   Post a comment
Data Translation's latest USB module for sound and vibration analysis has four independent 24-bit IEPE (Integrated Electronics Piezo Electric) sensor inputs that are synchronized with a tachometer input to provide data streams matched in time for field or laboratory use.
IEEE launches wireless engineering certification program
Product News  
3/24/2008   Post a comment
The Institute of Electrical & Electronics Engineers Communications Society (IEEE ComSoc) has launched a new program to certify the competency, practical knowledge and skills of wireless communications professionals.
Cable tester adds API for test control via external programs
Product News  
3/21/2008   Post a comment
CAMI Research has added an optional application programming interface (API) software library to its Cable Eye cable and wire harness tester that enables control of the tester by an external program.
Hybrid test technology eliminates physical test points for ICT
Product News  
3/21/2008   Post a comment
Agilent Technologies has unveiled a limited access solution for in-circuit test (ICT) users that eliminates the need for physical test points.
Data acquisition instruments offer high-speed performance over Ethernet
Product News  
3/21/2008   Post a comment
DATAQ Instruments has introduced the DI-785 and DI-788 Ethernet data acquisition models that deliver full synchronization over long distances via daisy-chain, simplified deployment, high-speed performance and high channel density.
ASA delivers DisplayPort compliance test for scopes
Product News  
3/21/2008   Post a comment
Amherst Systems has released a test script for the DisplayPort compliance specification for its M1-OT oscilloscope tools software family.
Russia's vulnerability highlighted in index
News & Analysis  
3/21/2008   Post a comment
Russia has scored relatively poor on the recently released "Index of State Weakness in the Developing World," basically a list of the world’s most vulnerable states.
ITC to hear complaint about LED / LD patent infringements
News & Analysis  
3/20/2008   Post a comment
The U.S. International Trade Commission has agreed to hear a case filed by a former Columbia University professor with a 50-year engineering career, Gertrude Neumark Rothschild, who has accused 34 companies including Nokia, Sony, Motorola, and Samsung of infringing her patents for LEDs and laser diodes.
IBM manages Brno expansion despite labor shortage
News & Analysis  
3/20/2008   Post a comment
IBM's operation in Brno, Czech Republic, went from 50 to 2400 employees in two years despite a skilled labor shortage in Central Europe.
Court denies Qualcomm bid for patent case delay
News & Analysis  
3/20/2008   Post a comment
In the latest episode of the long running saga between Broadcom Corp. and Qualcomm Inc, the U.S. Court of Appeals for the Federal District has turned down Qualcomm's request to hold off imposition of an injunction against sales of some of the company's mobile phone chips while Qualcomm (San Diego, Calif.) pursues an appeal of a patent suit won by Broadcom last July.
Wipro aligns efforts on aerospace target
News & Analysis  
3/20/2008   Post a comment
Indian outsourcing company Wipro Ltd. is attempting to fly a handful of design efforts and partnerships into formation to make an assault on the rapidly growing aerospace market in India and around the region, striking collaborations with Lockheed Martin, Boeing and BA Systems.
Fail-safe gyro sensors targets high-reliability applications
Product News  
3/20/2008   Post a comment
Austrian fabless chip vendor SensorDynamics has introduced two angular rate sensors which integrate monitoring circuitry at chip and module level. This double safety enables designers to use them in automotive applications as well as in other application areas where very high levels of resilience and safety are a requirement.
Siemens to spin off Electronics Assembly Systems
News & Analysis  
3/20/2008   Post a comment
Siemens plans to spin off its Electronics Assembly Systems business unit. The unit which produces insertion machines for PCB production is no longer considered part of the core business, a company spokesperson explained.
Exchange rates hit Eurozone, CEE exporters
News & Analysis  
3/19/2008   Post a comment
The mega euro, up 19% to the dollar year-on-year in March, drove down exports from Eurozone countries to the US by 3% last year, to $302B (194 billion euro), according to recently-released Eurostat figures.
NI expands data logging portfolio
Product News  
3/19/2008   Post a comment
National Instruments has announced four new C Series modules for data-logging applications including vibration/acoustical data logging and in-vehicle, structural, temperature and pressure testing.
TI high-performance analog team meets in India
News & Analysis  
3/18/2008   Post a comment
The president and CEO of Texas Instruments said last year that high-performance analog (HPA) could be the core growth engine of the company's future. The HPA team recently held its first-ever review meeting outside in the U.S. in Bengaluru.
EU makes further push for DVB-H as mobile TV standard
News & Analysis  
3/18/2008   Post a comment
The European Commission has officially endorsed Digital Video Broadcasting - Handheld (DVB-H) as the mobile TV technology of choice in Europe, and has told member states to "encourage" use of the technology.
Tektronix delivers complete DDR memory test bench
Product News  
3/17/2008   Post a comment
Tektronix delivers a comprehensive test tool set for next-generation DDR3 memory that supports all speeds of DDR, DDR2 and DD3 and provides both analog and digital validation and debug.
India's R&D drive slows
News & Analysis  
3/17/2008   Post a comment
The rate at which multinational companies are establishing R&D centers in India has slowed significantly, according to a study on the outsourcing of R&D.
Linear Hall-effect sensor targets current, position sensing applications
Product News  
3/17/2008   Post a comment
Allegro has introduced a high precision, programmable linear Hall-effect sensor with a 125-Hz pulse width modulated (PWM) output that is targeted at the automotive and industrial markets in current and position sensing applications.
Miniature power meters range up to 26.5GHz
Product News  
3/17/2008   Post a comment
Satori Technology releases the ST265 high dynamic range USB power meters.
CEE business wins as visa, passport formalities dissolve
News & Analysis  
3/17/2008   Post a comment
Central and East European member states that joined the EU in 2004 are lining up this week to sign individual agreements with the US for visa-free travel.
Real-time module boosts speed of wireless propagation tool
News & Analysis  
3/16/2008   Post a comment
Remcom has announced a time-enhancing real-time-module for their Wireless InSite software tool, which is an RF planning tool used for site-specific radio signal propagation prediction.
U.S. engineering gap: number of degrees declining
News & Analysis  
3/14/2008   10 comments
The numbers are cause for concern. While enrollment at individual U.S. engineering schools remains stable, the overall number of engineering degrees is declining, according to a report on engineering trends.
Electronics expansions for euro-bound Slovakia
News & Analysis  
3/14/2008   Post a comment
Samsung and Sony are among the companies expanding manufacturing operations in Slovakia as the country prepares to adopt the euro currency in 2009.
New Virtex-5 FPGA-based evaluation platform for ASIC prototyping
News & Analysis  
3/13/2008   Post a comment
New Virtex-5 FPGA-based ASIC prototyping platform from Tokyo Electron Device (TED) significantly reduces ASIC development times for consumer applications.
Oscilloscope incorporates FlexRay physical layer test tool
Product News  
3/13/2008   Post a comment
LeCroy Corp. has introduced a FlexRay physical layer test package that adds eye diagram mask testing and physical layer measurement parameters to its WaveRunner Xi oscilloscope.
Firmware upgrade eases phase noise, jitter measurements
Product News  
3/13/2008   Post a comment
Agilent Technologies has announced a new firmware release for its E5052B signal source analyzer making it easier to use in phase-noise and jitter measurements.
Ixia rolls QoE and service validation platform for triple play
Product News  
3/13/2008   Post a comment
Ixia has launched its IxRave end-to-end remote Quality of Experience (QoE) and service validation platform for triple play services.
ARM extends Indian design group, facility
News & Analysis  
3/13/2008   Post a comment
ARM plc has moved into larger premises in Bangalore, India in anticipation of extended operations in the country that will see it become the second largest design center outside its Cambridge, U.K. headquarters.
German chip market to continue growth, ZVEI says
Product News  
3/13/2008   Post a comment
The German industry association ZVEI expects the local semiconductor market to grow in 2008 at a rate of 4 percent - if valued in euros. In dollar terms however, the growth rate is highly unclear.
AOI provider Camtek faces class action lawsuit
News & Analysis  
3/13/2008   Post a comment
The law office of Jacob Sabo (Tel Aviv, Israel) has filed a class action lawsuit in the District Court for the Northern District of California, claiming that inspection systems specialist Camtek Ltd. (Migdal Haemek, Israel) and some of its executives violated federal securities laws.
India study recommends more university chip R&D
News & Analysis  
3/12/2008   1 comment
A study by the India Semiconductor Association (ISA) concludes that India needs a network of dedicated research centers focusing on chip technology research.
EU R&D gulf between West and East
News & Analysis  
3/12/2008   Post a comment
West and East Europe are at two ends of the scale when it comes to R&D spending.
Canon entlässt am Standort Giessen
News & Analysis  
3/12/2008   Post a comment
Canon stellt die Kopiererfertigung am Standort Gießen zum Ende des Monats ein. Nach Verhandlungen zwischen Arbeitnehmervertretung und Geschäftsleitung steht fest, dass 130 von 400 Arbeitsplätze abgebaut werden.
One-patent company snags deal with AT&T
News & Analysis  
3/11/2008   Post a comment
AT&T will pay unspecified fees to a small licensing company which owns rights to a 16-year-old patent it claims covers fundamental cellphone technology, one of many intellectual property agreements between large corporations and a rising tide of small firms created solely to license one or more patents.
NTI delivers portable audio test tools
Product News  
3/11/2008   Post a comment
NTI has increased volume production for its flagship Minirator MR-PRO and latest version MR2 portable signal generators.
Space station gets major robot arm upgrade
News & Analysis  
3/11/2008   Post a comment
Space Shuttle Endeavour will carry a Canadian-built humanoid robotic arm with unprecedented dexterity for a space robot.
Wroclaw wants to host Europe's imminent version of MIT
News & Analysis  
3/11/2008   Post a comment
Wroclaw, Poland, is among the cities hoping to be selected as the administrative headquarters for the European Institute of Innovation and Technology (EIT), Europe's version of the Massachusetts Institute of Technology.
Balluff : Optical distance sensor offers long range and accuracy
Product News  
3/11/2008   Post a comment
With the BOD 63M, Balluff has designed an optical distance sensor especially for industrial applications requiring long range and accuracy with simple and reliable handling.
Page 1 / 2   >   >>


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