Groups debut multicore API, benchmarks News & Analysis 3/31/2008 Post a comment Efforts to improve techniques for programming and measuring multicore processors take three small steps forward as the annual MultiCore Expo where the Multicore Association will announce it has completed work on a standard applications programming interface for communications and started work to define a standard for embedded virtualization and a related group will show the first fruits of its efforts to define a benchmark for multicore CPUs.
Surface monitoring for industrial production gets smart News & Analysis 3/25/2008 Post a comment Against the background of growing quality requirements as well as increasing pressure to increase productivity, automatic surface monitoring technologies increasingly gain importance. With its MASC System (Modular Algorithms for Surface Control), Fraunhofer Institute Techno- und Wirtschaftsmathematik (Fraunhofer ITWM) has developed a set of software tools that detect and classify material defects through image processing.
ITC to hear complaint about LED / LD patent infringements News & Analysis 3/20/2008 Post a comment The U.S. International Trade Commission has agreed to hear a case filed by a former Columbia University professor with a 50-year engineering career, Gertrude Neumark Rothschild, who has accused 34 companies including Nokia, Sony, Motorola, and Samsung of infringing her patents for LEDs and laser diodes.
Court denies Qualcomm bid for patent case delay News & Analysis 3/20/2008 Post a comment In the latest episode of the long running saga between Broadcom Corp. and Qualcomm Inc, the U.S. Court of Appeals for the Federal District has turned down Qualcomm's request to hold off imposition of an injunction against sales of some of the company's mobile phone chips while Qualcomm (San Diego, Calif.) pursues an appeal of a patent suit won by Broadcom last July.
Wipro aligns efforts on aerospace target News & Analysis 3/20/2008 Post a comment Indian outsourcing company Wipro Ltd. is attempting to fly a handful of design efforts and partnerships into formation to make an assault on the rapidly growing aerospace market in India and around the region, striking collaborations with Lockheed Martin, Boeing and BA Systems.
Fail-safe gyro sensors targets high-reliability applications Product News 3/20/2008 Post a comment Austrian fabless chip vendor SensorDynamics has introduced two angular rate sensors which integrate monitoring circuitry at chip and module level. This double safety enables designers to use them in automotive applications as well as in other application areas where very high levels of resilience and safety are a requirement.
Siemens to spin off Electronics Assembly Systems News & Analysis 3/20/2008 Post a comment Siemens plans to spin off its Electronics Assembly Systems business unit. The unit which produces insertion machines for PCB production is no longer considered part of the core business, a company spokesperson explained.
Exchange rates hit Eurozone, CEE exporters News & Analysis 3/19/2008 Post a comment The mega euro, up 19% to the dollar year-on-year in March, drove down exports from Eurozone countries to the US by 3% last year, to $302B (194 billion euro), according to recently-released Eurostat figures.
NI expands data logging portfolio Product News 3/19/2008 Post a comment National Instruments has announced four new C Series modules for data-logging applications including vibration/acoustical data logging and in-vehicle, structural, temperature and pressure testing.
TI high-performance analog team meets in India News & Analysis 3/18/2008 Post a comment The president and CEO of Texas Instruments said last year that high-performance analog (HPA) could be the core growth engine of the company's future. The HPA team recently held its first-ever review meeting outside in the U.S. in Bengaluru.
India's R&D drive slows News & Analysis 3/17/2008 Post a comment The rate at which multinational companies are establishing R&D centers in India has slowed significantly, according to a study on the outsourcing of R&D.
ARM extends Indian design group, facility News & Analysis 3/13/2008 Post a comment ARM plc has moved into larger premises in Bangalore, India in anticipation of extended operations in the country that will see it become the second largest design center outside its Cambridge, U.K. headquarters.
AOI provider Camtek faces class action lawsuit News & Analysis 3/13/2008 Post a comment The law office of Jacob Sabo (Tel Aviv, Israel) has filed a class action lawsuit in the District Court for the Northern District of California, claiming that inspection systems specialist Camtek Ltd. (Migdal Haemek, Israel) and some of its executives violated federal securities laws.
Canon entlässt am Standort Giessen News & Analysis 3/12/2008 Post a comment Canon stellt die Kopiererfertigung am Standort Gießen zum Ende des Monats ein. Nach Verhandlungen zwischen Arbeitnehmervertretung und Geschäftsleitung steht fest, dass 130 von 400 Arbeitsplätze abgebaut werden.
One-patent company snags deal with AT&T News & Analysis 3/11/2008 Post a comment AT&T will pay unspecified fees to a small licensing company which owns rights to a 16-year-old patent it claims covers fundamental cellphone technology, one of many intellectual property agreements between large corporations and a rising tide of small firms created solely to license one or more patents.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.