Microchip, Chang headline 2009 ACE Award winners News & Analysis 3/31/2009 Post a comment Microcontroller and analog chip vendor Microchip Technology was presented the award for "Company of the Year," one of 11 winners of the 2009 EE Times ACE Awards. Morris Chang, founding chairman of TSMC, was honored with a "Lifetime Achievement Award."
Video: Cisco shows server at Xeon launch News & Analysis 3/31/2009 Post a comment Big data centers are preparing for a shift to 10 Gbit/s Ethernet and some are interested in GPU processing once standards emerge, said a panel of data center managers who are testing Intel's just announced Xeon 5500 processors.
Albany NanoTech Complex expanded News & Analysis 3/30/2009 Post a comment A $150 million expansion at the College of Nanoscale Science and Engineering's Albany NanoTech Complex will create $1 billion in new investments and 600 high-tech jobs by 2013, according to a statement released by New York Assembly Speaker Sheldon Silver.
QLogic converges nets in ASIC News & Analysis 3/30/2009 Post a comment The move to merged data center networks takes a step forward as QLogic Corp. formally announces new chips and cards designed for the Fibre Channel over Ethernet standard with rivals Emulex and Intel Corp. expected to announce competing products soon.
Action urged to help Europe's semis sector News & Analysis 3/27/2009 Post a comment European governments and public authorities need to take coordinated, strong and urgent action to ensure the continent can remain competitive in the semiconductor and nanotechnologies sectors, Dirk Beernaert of the European Commission's Nanoelectronics division warned Friday (March 27).
DoE debuts $3.2b in energy efficiency grants News & Analysis 3/26/2009 Post a comment The U.S. Department of Energy has announced a new $3.2 billion grant program to promote efficient use of energy, a slice of the estimated $32.7 billion in tech stimulus dollars allocated to the department.
Senators push for deal on patent damages News & Analysis 3/26/2009 1 comment U.S. Senators put out what amounts to a final call for compromise on the controversial question of how to calculate damages for patent infringement, a key sticking issue in the ongoing debate on a proposed patent reform bill S.515.
Agilent to cut 2,700 jobs in restructuring News & Analysis 3/26/2009 Post a comment Agilent Technologies plans to cut about 2,700 jobs--roughly 14 percent of its workforce--as part of a major restructuring in its Electronic Measurement and Semiconductor & Board Test segments which will include new leadership.
Cobham reorganizes design and test activities News & Analysis 3/24/2009 Post a comment British defense, aerospace and sub-assembly group Cobham plc is bringing together three of its design, development and testing businesses, Vector Fields, ERA Technology and Culham Lightning, under a new operating company dubbed Cobham Technical Services.
Yokogawa : New models expand applications for OTDR family Product News 3/24/2009 Post a comment Six models have been added to the Yokogawa AQ7275 Series of optical time-domain reflectometers (OTDRs), extending its range of applications to cover virtually all metro, access and core networks as well as FTTH (fibre to the home) and PONs (passive optical networks).
Adva demos 100G serial modulation scheme News & Analysis 3/23/2009 Post a comment Researchers at Adva Optical Networking (Martinsried/Munich, Germany) have .demonstrated a ten-fold increase in system capacity over existing metro DWDM systems using traditional techniques, with an in-house developed DPSK-3ASK (Differential Phase-Shift Keying, 3-level Amplitude-Shift Keying) modulation format for serial 100Gbit/s transmission over a single wavelength channel.
LeCroy expands WaveSurfer oscilloscope line Product News 3/23/2009 Post a comment LeCroy has introduced a line of WaveSurfer Xs-A and MXs-A digital oscilloscopes that offers faster processing, a more responsive user interface, 5 Mpts/ch memory and LXI compliance in bandwidths from 200 MHz to 1 GHz.
Mobile operators seal, extend network sharing deals News & Analysis 3/23/2009 Post a comment In a wide-ranging cost cutting deal that will have major implications for their equipment suppliers, and further down the chain for many component suppliers, Vodafone and Telefonica have confirmed they will pool their mobile networks in the U.K and said that the deal covers several other European countries.
SEMI book-to-bill mired at historic low News & Analysis 3/20/2009 Post a comment North America-based semiconductor equipment vendors posted a book-to-bill ratio of 0.48 in February, roughly flat with a revised book-to-bill ratio of 0.47 for January, as the equipment industry continues to drag at levels not seen since at least 1991, according to the trade group SEMI.
IEEE approves low-power design spec News & Analysis 3/20/2009 1 comment The IEEE has approved a new standard that provides portability for low-power design specifications that can be used throughout the electronic system design, analysis, verification and implementation flow.
IEEE, conference drive smart grids News & Analysis 3/19/2009 Post a comment The IEEE formally approved a new group that will scope out standards for smart grids, and a separate set of stakeholders announced plans for a conference to guide federal investments in the area.
Senate delays patent reform vote News & Analysis 3/19/2009 2 comments Clashing interests in a patent reform debate have yet to reach a consensus, delaying until next week a key vote on a draft bill in the U.S. Senate where a key sticking issue remains how to calculate patent infringement damages in court cases.
Former NXP chief to advise ASMI's board News & Analysis 3/18/2009 Post a comment Frans van Houten, former CEO of semiconductor supplier NXP, was named by ASM International NV as an advisor to the company's management board for a period expected to last four to six months.
Dashing towards another wireless data standard News & Analysis 3/18/2009 Post a comment A consortium of semiconductor companies, RFID industry players, system integrators and wireless data users have formed the DASH7 Alliance that will develop and promote a technology that extends the ISO 18000-7 standard.
Japan suffers lowest ever chip equipment book-to-bill News & Analysis 3/18/2009 Post a comment The global book-to-bill ratio for Japanese semiconductor manufacturing equipment dropped to 0.35 in February the lowest figure on record, according to a Dow Jones report which gave the Semiconductor Equipment Association of Japan as its source.
Update: DoE's Chu pushes to speed ARPA-E funding News & Analysis 3/17/2009 Post a comment Energy Secretary Steven Chu told the House Science and Technology Committee that organizing a new R&D agency will move ahead on several fronts despite initial estimates that it could take a year before the agency is fully operational.
Nintendo prevails in joystick IP lawsuit News & Analysis 3/17/2009 Post a comment Games console specialist Nintendo has won a patent infringement case in a U.S. District Court in Texas against Texas-based Fenner that alleged the Japanese group infringed on a patent covering an interface for joysticks used in the hugely successful Wii console as well as the Nintendo GameCube.
De Geus touts new products, says ICs will rebound News & Analysis 3/17/2009 Post a comment Delivering the keynote address at a user group event, Aart de Geus, Synopsys chairman and CEO, touted the company's new products and said the semiconductor industry would remain critical to the world after emerging from a recession expected to be long and deep.
Cisco seeks bigger slice of data center News & Analysis 3/17/2009 Post a comment Hungry for growth, Cisco Systems has jumped into the server business, using advances in silicon, networking and virtualization in its Unified Computing System to seek an edge over veterans such as IBM and Hewlett-Packard.
IT giants lobby for Obama bucks News & Analysis 3/13/2009 1 comment A group of at least a dozen large computer and communications companies are proposing a set of high tech projects they'd like to see funded with money earmarked for technology goals under the recently passed economic stimulus package.
Tessera moves to dismiss ITC action News & Analysis 3/13/2009 Post a comment Tessera Technologies has moved to terminate a U.S. International Trade Commission action it brought against semiconductor packaging subcontractors, one of three complaints by Tessera currently before the ITC.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.