U.S. House airs patent reform debate News & Analysis 4/30/2009 Post a comment The debate over patent reform came to the U.S. House of Representatives Thursday as a diverse set of five industry executives, an academic and an engineer testified on their views for and against the draft Patent Reform Act of 2009, focusing on its provisions on infringement damages and post-grant review of patents.
CEA will set specs for 3-D glasses News & Analysis 4/29/2009 Post a comment The Consumer Electronics Association plans to set standards for stereo 3-D glasses, one of many efforts aimed at paving the road to interoperable 3DTV products for the digital home, a concept some see as the next big thing in television.
Rambus: Ruling allows it to seek higher damages News & Analysis 4/28/2009 Post a comment A U.S. federal court ruled that the patent damages that memory technology licensor Rambus could seek from Samsung Electronics for alleged infringement after June 2005 were not capped by a March 2005 settlement between Rambus and Infineon Technologies, according to a statement issued by Rambus.
Trio plan chip packaging joint venture News & Analysis 4/28/2009 Post a comment The consolidation in the semiconductor market is set to continue as Toshiba Corp. plans to create a joint venture in Japan with two packaging groups, Amkor Technology and Nakaya Microdevices, in a bid to cut costs.
Obama to boost federal R&D spending News & Analysis 4/27/2009 1 comment President Barack Obama pledged to raise the level of U.S. federal spending on research and development to more than three percent of the country's gross domestic product. He also named Microsoft chief research and strategy officer Craig Mundie and Google chief executive Eric Schmidt to his board of advisors on science and technology.
'Patent Assassins' ad stirs reform debate News & Analysis 4/22/2009 2 comments An in-your-face advertising campaign for the Patent Assassins Web site has stirred debate over the legal process for challenging patents, an issue now being debated in the U.S. Senate.
Bluetooth upgrade rides 802.11 radios News & Analysis 4/21/2009 Post a comment The Bluetooth Special Interest Group has released its version 3.0 specification supporting data rates up to 24 Mbits/second over a shared 802.11 radio, a small but significant step toward the technology becoming a de facto protocol for ad hoc, secure wireless peer-to-peer networks.
UWB startup Radiospire folds News & Analysis 4/21/2009 5 comments Another ultrawideband startup bites the dust as Radiospire Networks Inc. confirms it is closing its doors, but three remaining UWB startups remain committed to the technology despite a string of bad news over the last nine months.
Obama names relative unknown as U.S. CTO News & Analysis 4/20/2009 3 comments The United States has its first ever chief technology officer, but Aneesh Chopra is not well known in the electronics industry, and it's not clear whether his focus will be on many of the issues near and dear to the sector.
Mosaid loses Qimonda IP license deal, but NXP re-signs News & Analysis 4/17/2009 Post a comment Memory IP specialist Mosaid Technologies Inc. (Ottawa, Canada) and NXP Semiconductors BV (Eindhoven, the Netherlands) have extended their patent license deal. However, troubled and insolvent memory maker Qimonda (Munich, Germany) has terminated the six-year patent licensing agreement between the two companies that came into effect July 1, 2006
EU defence, aerospace groups want R&D aid, not bailout News & Analysis 4/17/2009 Post a comment A lobby group representing Europe's defence and aerospace industries has urged national governments to help with more investment in R&D and provide loans for struggling suppliers and contractors, but stressed it does not need bailing out, like some oher sectors.
Fuel cells get $49M in stimulus funds News & Analysis 4/16/2009 Post a comment The Department of Energy will give $49 million of government stimulus funding to a broad range of 13 projects promoting the use and development of fuel cells, including deployment of nearly 1,000 fuel cells.
Micronic, ASML terminate licensing agreement News & Analysis 4/16/2009 Post a comment Micronic Laser Systems AB (Stockholm, Sweden) and ASML Netherlands B.V. have terminated their long-standing license agreement that gives the Dutch lithography gear maker the right to market optical maskless lithography for semiconductor applications based on Micronic's patents.
Bookham, JDSU settle tunable laser IP battles News & Analysis 4/15/2009 Post a comment Optical component manufacturers Bookham and JDSU have settled their long-running legal battles over ownership of intellectual property related to tunable lasers in an out of court deal, according to specialist magazine Compound Semiconductor .
Can you afford to cut the cost of PCB electrical safety test? News & Analysis 4/15/2009 Post a comment All manufacturers and designers of electrically operated products have an obligation to ensure that their equipment functions in a correct and safe fashion, meeting quality and performance standards and, ultimately, living up to the expectations of customers. This applies to PCBs, where the need for testing by manufacturers who use populated boards in their products is clearly paramount.
Future Horizons postpones its annual IEF News & Analysis 4/14/2009 Post a comment In another sign of the problems facing the semiconductor industry, Future Horizons (Sevenoaks, England) has had to postpone its annual International Electronics Forum (IEF) that was scheduled to take place next month in Geneva, Switzerland.
TTTech, NASA team on TTEthernet for space apps News & Analysis 4/14/2009 Post a comment Realtime networking specialist TTTech Computertechnik AG (Vienna, Austria), which focuses on time-triggered technology, has teamed with NASA to support the space agency's work on and need for dependable integrated embedded systems.
Research team reports breakthrough in optical silicon communication News & Analysis 4/14/2009 Post a comment Transmission speeds beyond 100 Gbit/s based solely on silicon devices have become possible through the efforts of an American-European research group. In particular telecommunications industries are possible beneficiaries. The researchers believe they have paved a promising way to handle the increasing global data traffic.
SMPTE to kick off 3DTV effort in June News & Analysis 4/13/2009 Post a comment Stereoscopic 3-D content took a small step closer to the home TV as the Society of Motion Picture and Television Engineers said it will define a single mastering standard for viewing on TVs, PCs and mobile phones stereo 3-D content that could come from optical disks, broadcast networks or the Internet.
NIST shows road to smart grid standards News & Analysis 4/9/2009 Post a comment The National Institute of Standards and Technology will publish in September a road map for developing standards for tomorrow's smart electric grid, according to the new NIST executive coordinating the effort.
Sitronics sets up Indian subsidiary News & Analysis 4/9/2009 Post a comment Russia's JSC Sitronics group, which includes companies manufacturing communications gear, microelectronics components and systems and IT products, has established a subsidiary in India.
U.S. takes step toward smart grid standards News & Analysis 4/8/2009 Post a comment The National Institute of Standards and Technology has forged a contract with the Electric Power Research Institute as a step toward its goal of developing national standards for tomorrow's smart electric grid.
Apple reportedly sued over touchscreen technology News & Analysis 4/8/2009 Post a comment Taiwan's Elan Microelectronics has filed suit against Apple in U.S. federal court, alleging infringement of two touchscreen technology patents by Apple products including the MacBook, iPhone and iPod Touch, according to various published reports.
Server blade group debuts six specs News & Analysis 4/7/2009 Post a comment The Intel-led Server Systems Infrastructure Forum has released a suite of draft specifications for x86-based server blade systems as part of its expanding charter and organization.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.