Cirrus to integrate Silicon Wave's Bluetooth technology in processors News & Analysis 5/30/2001 Post a comment SAN DIEGO--Silicon Wave Inc. here announced it has licensed Bluetooth wireless connectivity technology to Cirrus Logic Inc., which plans to integrate the function into its Maverick microprocessors for consumer products, such as Internet audio players, personal digital assistants (PDAs) and electronic books.
How 2001 downturn will impact regions, chip segments News & Analysis 5/29/2001 Post a comment TAIPEI, Taiwan -- The big losers in chip revenues this year will be the Americas and Asia Pacific markets as well as memories, bipolar digital ICs, and "micro" product segments, according to the new World Semiconductor Trade Statistics (WSTS) forecast issued this week.
Board hosts 2 Ethernet, 36 serial ports News & Analysis 5/29/2001 Post a comment A dense serial communication card equipped with a PowerQuicc II processor, two fast Ethernet ports and 36 usable serial interfaces is now available from Actis Computer. The VCOM-6862 card is targeted for use in large data concentrators and protocol converters.
Q1 fab utilization falls near low point of last recession News & Analysis 5/25/2001 Post a comment SAN JOSE -- Worldwide wafer fab utilization rates plunged to their lowest levels in two years during the first quarter of 2001, according to new industry statistics. IC wafer fabrication plants were operating at 83.7% of their installed capacity in Q1 compared to 92.8% in Q4 of 2000, said a report released by the Semiconductor Industry Association here this week.
Japan becomes top chip equipment market in Q1; Taiwan falls to fifth place News & Analysis 5/23/2001 Post a comment SAN JOSE -- The chip industry's sharp downturn in 2001 has reshuffled the ranking of geographic markets for semiconductor equipment. Surprisingly, Japan has come out on top of the world by growing 31.7% to $3.37 billion in the first quarter compared to $2.56 billion in Q4 of 2000, according to new market numbers released today.
Consortium reviews new standards for testing networking chip and board technologies Product News 5/23/2001 Post a comment PALO ALTO, Calif. -- A consortium that hopes to set new IC-testing standards for high-speed networking chip and board-level technologies has narrowed its proposals to three separate solutions.
The so-called AC-Extest Working Group--an organization that consists of automatic-test equipment suppliers, chip makers, and OEMs--plans to review IC-testing proposals from three different companies: Agilent Technologies, Cisco Systems, and Philips.
SEMI predicts chip-equipment sales will drop 27% in 2001 News & Analysis 5/23/2001 Post a comment SAN JOSE -- The Semiconductor Equipment and Materials International (SEMI) trade organization here today slashed its forecast for the worldwide chip-equipment industry, saying the business will decline by 27% this year.
Citing the downturn in the semiconductor and equipment markets, SEMI said that worldwide chip-equipment shipments will drop from $47.7 billion in 2000 to $35 billion in 2001.
Statemate becomes a formal tool News & Analysis 5/23/2001 Post a comment I-Logix has brought formal verification techniques into its Statemate Magnum software and systems design tool, using technology bought in from Germany-based Offis Systems and Consulting.
SEMI equipment book-to-bill hits new low at 0.42 in April News & Analysis 5/22/2001 Post a comment SAN JOSE -- It's gone from bad to worse for chip-equipment makers. In what is arguably the worst semiconductor downturn ever, North American-based suppliers of chip production systems posted a record low book-to-bill of 0.42 in April, said the Semiconductor Equipment and Materials International (SEMI) trade group here today.
Standards group nixes TI wireless LAN proposal News & Analysis 5/18/2001 Post a comment Texas Instruments Inc. was forced to remove its 22-Mbit/second wireless LAN proposal from the IEEE standardization process this week when the 802.11 Working Group voted in favor of Intersil Corp.'s alternative solution, which received 58 percent of the vote. But under IEEE rules, a proposal must get at least a 75 percent vote, so Intersil's proposal has still not been accepted as the standard, and is not likely to be until the next IEEE meeting in July.
Applied's China fab bookings surge to $150 million in quarter News & Analysis 5/18/2001 Post a comment SANTA CLARA, Calif. -- China this year is turning into a real hot spot for Applied Materials Inc., despite the sharpest downturn ever in the semiconductor equipment history. The Santa Clara, Calif., company booked $150 million of new orders in China during what otherwise was a dismal second fiscal quarter, ended April 30.
Funeral set for SRC chief scientist: Peter Verhofstadt News & Analysis 5/17/2001 Post a comment SARATOGA, Calif. -- Funeral services will be held here on Friday for Silicon Valley semiconductor pioneer Peter Verhofstadt, who was chief scientist of the Semiconductor Research Corp. (SRC) and the first manager of the U.S. chip industry's Focus Center Research Program.
Mosel Vitelic delays DRAM projects News & Analysis 5/17/2001 Post a comment DRAM maker Mosel Vitelic Inc. is shelving plans to build two 12-inch wafer fabs in Taiwan and Canada because of the sickly nature of the memory market. The company joins a host of others inside and outside Taiwan that have deferred expansion plans because of the semiconductor slowdown.
Taiwanese official suggests chip fabs leave Tainan Park News & Analysis 5/15/2001 Post a comment TAIPEI, Taiwan - A senior government official in Taiwan has suggested that semiconductor companies move operations out of the Tainan Science Park because the government will not be able to reduce vibrations from a planned high-speed rail that's to run nearby.
LTX tester revenues drop 37% from prior quarter News & Analysis 5/15/2001 Post a comment WESTWOOD, Mass.--Semiconductor tester supplier LTX Corp. today reported sales sequentially declined 37% to $65.6 million in the company's fiscal third quarter, ended April 30, compared to $104.7 million in the prior three-month period. Compared to a year ago, LTX's sales were 20% lower than $82.1 million in the quarter last year.
TI to seek FCC certification of 22-Mbit/sec. wireless LAN technology News & Analysis 5/14/2001 Post a comment DALLAS -- Texas Instruments Inc. today announced plans to move quickly to gain U.S. certification of its 22-megabit-per-second wireless local area network technology following last week's decision by the Federal Communications Commission (FCC) to grant interim waivers for new digital devices operating in the 2.4-GHz band.
Barrett states Intel's stance on standards News & Analysis 5/10/2001 Post a comment The strategy behind Intel Corp.'s network-processor efforts has become entirely standards-minded, as the company freely accepts that its command over the PC market isn't going to translate into the networking area, chief executive Craig Barrett said.
15 major fab tool suppliers plan 'Sematech-styled' consortium News & Analysis 5/9/2001 Post a comment SAN JOSE -- Fifteen of the world's largest suppliers of semiconductor equipment are in the final stages of planning a new industry consortium to jointly pursue R&D for new chip-production standards, next-generation processes, and a range of emerging concepts in wafer fabs, such as e-diagnostics of tools connected to the Internet.
Rambus loses SDRAM lawsuit against Infineon News & Analysis 5/4/2001 Post a comment RICHMOND, Va. -- Rambus Inc. today lost its lawsuit against Infineon Technology AG after a ruling by a federal court here dismissed the remaining three SDRAM patent infringement claims against the Germany chip maker.
ASML aims to accelerate EUV platform R&D once SVG merger closes News & Analysis 5/4/2001 Post a comment VELDHOVEN, the Netherlands -- As soon as ASM Lithography Holding N.V. completes its delayed acquisition of Silicon Valley Group Inc. this month, ASML will form joint-development teams with SVG's U.S. operations to accelerate the planning of a common platform for next-generation extreme ultraviolet (EUV) tools.
IBM to license patented LCD manufacturing process News & Analysis 5/3/2001 Post a comment IBM Corp. has developed and patented a new manufacturing process that could save the LCD industry as much as $20 billion a year by simplifying display production, the company said. IBM will license the process to other manufacturers.
What ASML agreed to do to win U.S. approval of SVG merger News & Analysis 5/3/2001 Post a comment VELDHOVEN, the Netherlands -- To gain U.S. clearance in the purchase of Silicon Valley Group Inc., officials at ASM Lithography Holding N.V. agreed to a number of restrictions and obligations aimed at protecting lens technology and maintaining operations in the United States. But the Dutch company's CEO today said many of those requirements are compatible with ASML's original goals in buying SVG.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.