Motorola, AMD's Ruiz settle suit over recruitment dispute News & Analysis 6/29/2001 Post a comment SCHAUMBURG, Ill. -- Motorola Inc. and the former president of its semiconductor business, Hector de J. Ruiz, here have reached an out-of-court settlement in their suit over the alleged illegal recruitment of Motorola executives to Advanced Micro Devices Inc.
In January of 2000, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
Orders from TI and others may boost Teradyne, but outlook is still cloudy News & Analysis 6/29/2001 Post a comment BOSTON -- Teradyne Inc.'s outlook remains cloudy in spite of a recent uptick orders for its automatic test equipment (ATE) from several established and new customers, reportedly including Texas Instruments Inc., according to analysts.
It's been a rough time for Teradyne and other ATE companies. The downturn in the ATE business caused Teradyne earlier this month to reduce its workforce and lower its forecast for the second quarter of 2001.
Schlumberger, IMS to set up a network of worldwide IC-testing centers News & Analysis 6/27/2001 Post a comment SAN JOSE -- The new alliance between Integrated Measurement Systems Inc. (IMS) and Schlumberger Semiconductor Solutions will create a new and low-cost outsourcing model for chip-testing, according to company officials.
Last week, the two companies announced plans to set up the first in a series of independent test centers that will provide IC debug, validation, characterization, probing, and related services for chip makers
Intel confirms second 300-mm R&D fab in Oregon for 0.07-micron ICs News & Analysis 6/27/2001 Post a comment SANTA CLARA, Calif. -- Intel Corp. Wednesday confirmed that it has filed permit applications to build a $2 billion development fab capable of 0.07-micron design rules in Hillsboro, Ore. The fab represents Intel's second 300-mm wafer plant at this site.
The announcement has been expected for weeks (see May 14 story ). As first reported at SBN, Intel is moving ahead with the new 300-mm development fab in Oregon, dubbed D1D.
Taiwan's ASE plans two IC-assembly plants in China News & Analysis 6/27/2001 Post a comment SANTA CLARA, Calif. -- Officials with Taiwanese IC-packaging and test giant Advanced Semiconductor Engineering Inc. (ASE) here outlined a bold strategy to enter the China market, telling SBN that the company plans to open two plants at two separate locations. The first facility is expected to be in production by early 2002.
Schlumberger rolls out new low-cost tester, reportedly ships first systems to Intel News & Analysis 6/25/2001 Post a comment SAN JOSE -- Schlumberger Semiconductor Solutions here today rolled out its new low-cost structural tester, while also announcing that it has shipped the system one month ahead of its original schedule.
One of the first customers for the Schlumberger DeFT line of automatic test equipment (ATE) is reportedly Intel Corp. Recently, Intel awarded Schlumberger a major contract to develop and ship a new, low-cost structural tester in order to combat the soaring costs of test (see
Temp sensors target performance News & Analysis 6/25/2001 Post a comment Manufacturers of temperature sensors are striving to pick up the slack in sluggish markets by stressing the performance features of these integrated circuits as well as by increasing accuracy and lowering power requirements.
IC analyst and industry veteran Lathi dies in accident News & Analysis 6/25/2001 Post a comment SCOTTSDALE, Ariz.--A motor vehicle accident earlier this month has claimed the life of Walter George Lathi, vice president of market research at Chipworks Integrated Circuit Engineering (ICE). Lathi, 57, has over 30 years of experience in manufacturing, management, and market research.
Drop in chip tool orders eases, but long 'trough' period now expected News & Analysis 6/22/2001 Post a comment SAN JOSE -- The downturn in semiconductor equipment orders may be easing and the cycle might be at the "bottom" of the slump, but bookings for new production systems will most likely remain at these low levels for most of this year, according to analysts, responding to new data released on Thursday evening.
Costello testimony turns into a tirade against Avanti News & Analysis 6/21/2001 Post a comment Pounding his fist during emotionally charged testimony in Avanti Corp.'s ongoing restitution hearing, the former chief executive officer of Cadence Design Systems Inc. said Avanti officials engaged in a "pattern of lying and cheating and stealing" while trying to personally disparage him during Cadence's seven-year legal battle over stolen database code.
Advantest cuts flash testing costs by third in parallel system News & Analysis 6/21/2001 Post a comment SANTA CLARA, Calif. -- Advantest Corp. today rolled out a new front-end flash memory test system, which has the ability to test up to 128 devices simultaneously. The throughput of the T5771 tester is an eightfold increase compared to the company's previously available system, said Advantest.
Broadcom says chip set boosts satellite TV bandwidth more than 35% News & Analysis 6/20/2001 Post a comment IRVINE, Calif.--Broadcom Corp. today claimed availability of the industry's most highly integrated chip-set solution for reception of consumer satellite television service. The two-chip set will enable satellite service providers to increase usable bandwidth by more than 35% compared to existing systems, said the Irvine company.
Schlumberger to sell test business in pieces, but denies ATE customers are in limbo News & Analysis 6/20/2001 Post a comment SAN JOSE -- Schlumberger Ltd. here outlined its strategy to divest itself from the automatic test equipment (ATE) business, saying the operation will be sold in pieces rather than as a whole to potential buyers.
The company's ATE business, Schlumberger Semiconductor Solutions, also refuted claims that its customers are in limbo as a result of the divestiture. Its ATE customers include the who's who in the semiconductor business: Advanced Micro Devices, Intel, Motorola, among others.
Intel shifts test strategy to battle exploding costs of big ATE systems News & Analysis 6/19/2001 Post a comment SANTA CLARA, Calif. -- Intel Corp. has declared war on chip-testing costs, which have surged by 25 times for complex microprocessors and other ICs in recent years. To combat the staggering cost increase, Intel is revamping its entire testing strategy in an attempt to get more leverage from build-in self-test (BIST) and open up the use of lower cost testers.
SigmaRAM group expects samples of 18-Mbit memories in Q4 News & Analysis 6/18/2001 Post a comment SAN JOSE -- Right on the heels of an announcement by a rival group, the SigmaRAM Consortium today unveiled its product roadmap for high-speed synchronous SRAMs, which will support sustained data rates of up to 24-gigabits per second at clock speeds of 333 MHz in networking and telecom systems.
Macronix claims victory in ITC probe of Atmel's patent case News & Analysis 6/14/2001 Post a comment WASHINGTON -- Macronix International Co. Ltd. of Taiwan and its U.S. subsidiary today announced a legal victory before the U.S. International Trade Commission, which ruled for the second time that the company's chip products did not infringe upon the "silicon signature" patent of Atmel Corp.
Axcelis taps GW's software for connection of 300-mm tools News & Analysis 6/14/2001 Post a comment SUNNYVALE, Calif. -- GW Associates Inc. here has struck an agreement to sell 300-mm wafer fab connectivity software to Axcelis Technologies Inc. for use in ion implantation and rapid-thermal processing (RTP) tools. Axcelis will use the GWconX300 software to offer standard communications interfaces to automated material handling systems (AMHS) and other systems in 300-mm fabs.
Philips Semiconductors names U.S. executive to run worldwide chip operations News & Analysis 6/13/2001 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors here today announced a major reorganization in its semiconductor business, replacing its long-time chip leader in the Netherlands with a U.S. executive. The move represents the latest in a string of management changes at the Dutch-based chip giant.
On Wednesday, Scott McGregor, the head of the Emerging Business Unit for Philips Semiconductors' U.S. subsidiary in Sunnyvale, Calif., was named to head up the company's worldwide chip operations,
Danaher acquires test-equipment maker Microtest for $74 million News & Analysis 6/13/2001 Post a comment WASHINGTON -- Danaher Corp. here today announced it has acquired Microtest Inc., a Phoenix-based supplier of test, measurement, and instrumentation equipment, for $74 million in stock.
Under the terms of the agreement, Microtest's network test and measurement operations will be combined with Danaher's Fluke Networks subsidiary.
Stanford Microdevices to change name after court settlement with Stanford University News & Analysis 6/11/2001 Post a comment SUNNYVALE, Calif. -- Wireless-chip maker Stanford Microdevices Inc. (SMI) here today announced it will drop the use of "Stanford" in its corporate name, as part of an out-of-court settlement reached with Stanford University.
Several years ago, Stanford University of Palo Alto, Calif. filed a suit against SMI over SMI's use of the name "Stanford." The suit was filed in the U.S. Northern District of California.
Agilent Technologies to partner CETECOM News & Analysis 6/7/2001 Post a comment Agilent Technologies and Centro de Tecnologia de las Comunicaciones SA (CETECOM) have announced that CETECOM has integrated Agilent equipment into test solutions for certification of Bluetooth devices
Silicon Wave selects Agilent 93000 platform News & Analysis 6/7/2001 Post a comment Agilent Technologies and Silicon Wave have announced that the Agilent 93000 SOC Series with RF capabilities will be implemented for the development and manufacturing test of next-generation Bluetooth integrated circuits (ICs
Germany's SZ Testsysteme moves into Japanese market News & Analysis 6/4/2001 Post a comment TOKYO -- In a move to expand its presence in Japan and Asia, SZ Testsysteme AG of Germany today opened a new subsidiary in the Tokyo suburb of Chiba. Until now, the company had relied on distributors to sell its mixed-signal test equipment in Japan and the region.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.